702 results about "Ultra precision" patented technology

The invention discloses a hard and brittle material ultra-precision turning damage monitoring method based on multi-sensor fusion, and relates to the technical field of precision / ultra-precision machining state monitoring, a multi-sensor signal acquisition device is built on an ultra-precision turning machine tool to capture different types of sensor signals generated in the turning process in real time; performing signal preprocessing operation of minimum entropy deconvolution filtering on the acquired sensor signal; feature extraction is carried out on the signals subjected to minimum entropy deconvolution filtering, and 95 time domain and frequency domain statistical features reflecting turning damage are extracted; by integrating data from different sensors, the precision and reliability of monitoring are remarkably improved, more comprehensive and more accurate information can be obtained by capturing and fusing acoustic characteristics, cutting force and mechanical vibration information in the machining process, so that the abrasion degree of a tool and the damage condition of a workpiece are judged more accurately, and the machining accuracy is improved. And false alarm and missing alarm can be reduced, and the monitoring reliability can be improved.

The invention discloses a micron-sized lens array machining device and method based on a micro-forming tool, and relates to the technical field of micron-sized lens array machining, the micron-sized lens array machining device comprises an ultra-precision machine tool with a Y axis, a lifting tool rest and an arc tool, a vacuum chuck on the Y axis of the ultra-precision machine tool is used for installing a workpiece, and the lifting tool rest is used for installing the arc tool; the lifting tool rest can drive the arc tool to ascend and descend in the Y direction and enable the arc tool to machine the surface of a workpiece to form a micro-lens unit, and the ultra-precision machine tool can drive the workpiece to move in the X direction, the Y direction and the Z direction relative to the arc tool and enable the arc tool to machine the surface of the workpiece to form a micro-lens array. And the radius of a cutting edge of the arc cutter is equal to the curvature radius of the micro-lens unit. According to the invention, high-quality and high-uniformity micron-sized lens array processing can be realized.

The invention provides a subsurface damage depth prediction and control method for ultra-precision grinding of a semiconductor wafer. The method comprises the following steps that the subsurface damage depth difference of ductile grinding and brittle grinding is analyzed; calculating the critical cutting depth of ductile-brittle transition; establishing the relationship between the subsurface damage depth and the normal force of a single abrasive particle; specifically, on the basis of the relation between the normal force of a single abrasive particle and the plastic radius of a plastic deformation area in ductile grinding and the median crack depth in brittle grinding, the relation between the subsurface damage depth of wafer grinding and the normal force of the single abrasive particle is obtained in combination with ductile-brittle transformation judgment conditions; establishing the relationship between the normal force of a single abrasive particle and the cutting depth of the abrasive particle; establishing the relationship between the abrasive particle cutting depth and the grinding process parameters; and establishing the relationship between the subsurface damage depth and the grinding process parameters. According to the method, the grinding process parameters are reversely solved based on the subsurface damage depth model, the grinding process can be formulated according to specific damage indexes, and the machining efficiency is improved on the basis of meeting the machining requirements.

The invention belongs to the technical field of hard and brittle crystal material micropore machining, and particularly relates to an ultra-precision micropore multi-energy field coupling machining method and system.The method comprises the steps that the laser pulse frequency and power are set according to the workpiece material type and the micropore depth-diameter ratio, and a laser focus is positioned at the inner hole bottom of a workpiece; a modified structure extending in the axial direction of a hole is formed by controlling matching of a light spot and a hole diameter and the movement track of the light spot, in the machining process, a plasma nozzle and laser coaxially move, a modified area is removed in real time, a heat affected zone and the hole shape taper are restrained, meanwhile, vibration is applied to a workpiece through an axial ultrasonic vibration device, and machining precision is improved. And chip discharge is promoted, and stress and crack generation are reduced. The problems of serious thermal damage, poor hole shape precision, low machining efficiency and high energy consumption in the micropore machining process in the prior art are solved, and high-quality and high-precision machining of the high-depth-diameter-ratio micropore of the hard and brittle transparent crystal material is achieved.

The invention relates to the technical field of turning machining, and discloses an ultra-precision turning machining control method and system and a storage medium. The method comprises the steps that a laser contourgraph detects geometric parameters and abrasion data of a turning tool, and a tool health degree index is calculated; performing error compensation based on the health degree index to obtain a feeding control parameter; cutting force signals are collected, and technological parameters are optimized through a multi-target genetic algorithm; arranging a temperature sensor array, and adjusting cooling control according to process parameters; and generating a track control point and performing interpolation processing to obtain a motion control sequence. According to the method, the problem that the machining precision is unstable due to the fact that the cutter state cannot be quantitatively evaluated in real time in traditional turning is solved, and the precision control capability and machining quality consistency of ultra-precision turning are improved.

The invention relates to an ultra-precision grinding and photochemical mechanical polishing combined process for a laser crystal sheet. Comprising the following steps that coarse grinding is conducted through a coarse-grained grinding wheel, rapid thinning is achieved, the depth of a subsurface damaged layer is determined, and reference is provided for the grinding wheel feeding amount in the accurate grinding stage; a fine-grained grinding wheel is adopted for accurate grinding, a damaged layer introduced in the coarse grinding stage is removed, and high surface / subsurface quality and surface precision are obtained by optimizing technological parameters; a special polishing solution for photochemical mechanical polishing is prepared from an aluminum oxide (Al2O3) grinding material, semi-fine polishing is carried out on a laser crystal sheet, and surface damage caused in the grinding stage is rapidly removed; a special polishing solution for photochemical mechanical polishing is prepared from a zirconium oxide (ZrO2) grinding material, and the laser crystal sheet is finely polished, so that the surface quality and the surface precision are further optimized; an ultrasonic cleaning instrument is adopted to clean the laser crystal slice, and a cleaning agent is absolute ethyl alcohol. According to the invention, high-surface integrity and high-efficiency processing of the laser crystal slice can be synchronously realized.

The invention discloses a weak-rigidity free-form surface monocrystalline silicon reflecting lens and a processing method thereof. The method comprises the following steps: obtaining a monocrystalline silicon block; cutting into blocks; diamond wire cutting; precisely grinding the back surface; performing slicing; the free-form surface sucker adsorbs the lens; precisely grinding the front surface into a cylindrical surface; polishing the magnetorheological elastomer; releasing the lens; the cylindrical sucker adsorbs the lens; precisely grinding and thinning the back surface; releasing the lens; cutting edges and carrying out wet etching on the back surface; and carrying out ion beam modification processing to achieve the final surface shape precision of the free-form surface. According to the X-ray reflecting lens machining method, the free-form surface weak-rigidity reflecting mirror is clamped and deformed into the cylindrical surface for machining, the whole process is ultra-precision grinding and polishing of the cylindrical surface, the machining method is simple and mature, the manufacturing cost is extremely low, dependence on an ultra-high-precision multi-axis linkage machine tool is completely eliminated, and the machining precision is greatly improved. And the machining efficiency is greatly improved, and the method is suitable for mass production of reflectors.

The invention provides an epitaxial wafer edge morphology compensation type wafer double-sided polishing device and method, and belongs to the technical field of semiconductor wafer ultra-precision machining. The polishing main machine comprises an upper fixed disc, a lower fixed disc and a wafer driving mechanism; the pressure loading system is used for applying adjustable pressure to the fixed disc; the polishing solution supply system is used for conveying a flow-adjustable polishing solution to the processing interface; the central control unit is in communication connection with the two systems and executes edge morphology compensation control logic, specifically, the machining pressure is adjusted in a segmented mode, and the flow of the polishing solution and the pressure are subjected to coupling change. According to the method, the atomic level flatness of the wafer surface is ensured, the edge morphology is accurately controlled, the edge thickening of the epitaxial layer is perfectly counteracted, and the photoetching yield of high-end chip manufacturing is remarkably improved.

The invention discloses a high-precision multi-layer sliding shaft clamp based on a wedge-shaped guide rail structure, and relates to the field of micro-lens array manufacturing and other ultra-precision machining. The problem that in the ultra-precision machining process, when a machine tool is not provided with a guide rail in the vertical direction, centering cannot be efficiently achieved is solved, and the problems that in a traditional centering mode, operation is tedious, the installation and adjustment time is long, the production cost is high, and the machining efficiency is low are solved. A second-stage bottom plate relatively sliding in the ascending direction is arranged above a first-stage bottom plate, and a servo motor transmits power to a transmission mechanism to achieve horizontal linear motion of the second-stage bottom plate relative to the first-stage bottom plate; a third-level bottom plate which relatively slides in the ascending direction is arranged above the second-level bottom plate, a main shaft holding clamp which relatively slides in the direction perpendicular to the ascending direction is arranged above the third-level bottom plate, and the first-level bottom plate and the second-level bottom plate, the second-level bottom plate and the third-level bottom plate and the third-level bottom plate and the main shaft holding clamp are detachably connected through locking pieces. The device is used for achieving vertical centering work of the machine tool spindle.

The invention discloses an intelligent cutter system with a multi-signal sensing function and a manufacturing method of the intelligent cutter system, and relates to the field of intelligent cutting tools for ultra-precision machining. The method comprises the steps that boron ions and sulfur ions are doped in a multi-layer gradient doping mode through a multi-step ion implantation method in a front tool nose area and a front tool face area of the single crystal diamond tool, so that the single crystal diamond tool has the conductivity of a semiconductor; the multi-layer gradient doping mode comprises shallow-layer doping, middle-layer doping and deep-layer doping, and the concentration and depth distribution of boron ions and sulfur ions can be controlled by the multi-layer gradient doping mode, so that the concentration of a tool nose area is the highest; the single crystal diamond cutter with the conduction characteristic of a semiconductor is connected with a signal processing and transmission circuit through a platinum electrode, so that the intelligent cutter capable of sensing force, temperature and vibration at the same time and monitoring the cutting state and the cutter abrasion state in real time is obtained. By means of the scheme, the cutting force, the cutting heat degree and the vibration signals in the cutting process can be accurately detected at the same time.

The invention relates to the field of ultra-precision polishing, in particular to an in-situ laser polishing system for a diamond turning metal surface. Comprising a turning tool servo shaft, a laser polishing assembly and a controller, a laser emitting part is arranged on the turning tool servo shaft, and the controller is used for controlling polishing laser emitted by the laser emitting part to move and scan on the surface of a turned workpiece in the direction perpendicular to the turning path. The distance between two adjacent scanning paths is smaller than the diameter of the Gaussian beam. According to the invention, the laser polishing system is integrated on the ultra-precision machine tool, so that the turning and polishing processes of the workpiece can be completed under the same clamping, and secondary clamping and repositioning, introduced scratches and clamping errors are avoided. And meanwhile, the surface of the workpiece is heated through the out-of-focus light spots, so that the material in the area is in a flowable state after being heated, and under the action of gravity or self-tension, the material at the high position moves to the low position, so that the self-leveling effect is achieved, and the surface roughness is reduced.

The invention discloses ultra-precision laser processing equipment and method based on AI vision, and belongs to the technical field of laser processing. The ultra-precision laser processing equipment comprises a stabilizing plate, a first linear module is fixedly installed on the upper surface of the stabilizing plate, and a second linear module is fixedly installed on the upper surface of a movable block of the first linear module; a connecting cylinder is fixedly installed on the upper surface of a movable block of the second linear module, a workpiece bearing table is fixedly installed on the upper surface in the connecting cylinder, a pushing and clamping mechanism is installed in the connecting cylinder, third linear modules are fixedly installed at the two ends of the upper surface of the stabilizing plate, and a connecting ring is fixedly installed between movable blocks of the two third linear modules. And a cutting angle regulation and control mechanism is rotationally mounted in the connecting ring. Through the design of the cutting angle regulation and control mechanism, the incident angle of laser can be automatically regulated and controlled through the camera in the workpiece machining process, and the diversified machining requirements of workpieces with complex curved surfaces and irregular shapes are met.

The invention discloses a full-static-pressure ultra-precise double-head spindle, which relates to the technical field of machine tool spindles and comprises a mandrel, a shaft sleeve is fixedly connected to the outer surface of the mandrel, a spindle equipment compartment is rotatably connected to the outer surface of the shaft sleeve, a synchronous pulley is fixedly connected to one side of the outer surface of the shaft sleeve, and a transmission assembly is in transmission connection to the synchronous pulley. The synchronous belt wheel is sleeved with a belt cover, the belt cover is fixedly connected into the main shaft equipment compartment body, and a transmission assembly looseness abnormity early warning mechanism is arranged in the belt cover and can automatically trigger an alarm to remind workers when the transmission assembly is loosened. The situation that the core shaft breaks down due to the fact that the transmission assembly falls off and is broken can be reduced, the maintenance cost of the core shaft is reduced, the service life of the core shaft is prolonged, the situation that vibration and noise are generated when the core shaft works under the abnormal condition of the transmission assembly can be avoided, the stability of the core shaft in the operation process is guaranteed, and the service life of the core shaft is prolonged. Therefore, the product grinding precision and quality of the mandrel are improved.

The invention belongs to the technical field of ultra-precision machining, and discloses an ultra-precision cutting surface geometrical morphology and machining precision prediction method which comprises the steps that machining parameters, cutter parameters and material parameters are obtained; a cutting edge contour of the tool is established according to the tool parameters, contour deformation caused by material elastic recovery is calculated according to the machining parameters and the material parameters, and contour deformation caused by plastic lateral flow is calculated according to the machining parameters, the tool parameters and the material parameters; on the basis of the cutting edge contour of the tool, the deformation caused by material elastic recovery and the deformation caused by plastic lateral flow, the correction coefficient of the shape prediction model under different machining parameters is calculated, and a cutting surface geometric shape prediction model is obtained; and the machining parameters are optimized and corrected, the elasticoplastic deformation is pre-compensated, and the final cutting surface is obtained. According to the method, the contour of the cutting edge of the cutter, the elastic recovery and the plastic lateral flow are comprehensively considered into the surface topography model, so that the prediction precision of the microstructure surface topography model is effectively improved.

The invention relates to the technical field of precision and ultra-precision machining, and discloses a CO2 full-laser machining device and method for a fused quartz micro convex lens array. The three-axis motion platform is arranged on the supporting platform; the pulse CO2 laser is used for generating a processing laser beam; the light beam transmission system sequentially comprises a light beam combining module, a light beam adjusting module, a light splitting module, a light beam guiding module, a scanning galvanometer and a focusing field lens along a laser beam path; the main light beam is guided to the scanning galvanometer through the light beam guiding module and is emitted to a fused quartz workpiece after being focused through the focusing field lens; the contour detection unit is used for taking morphology data of the micro-lens array in situ; the temperature monitoring unit is used for measuring the temperature of the processing area; the control unit is connected with the three-axis motion platform, the contour detection unit, the temperature monitoring unit and the pulse CO2 laser, and is used for adjusting the laser power and the displacement of the three-axis motion platform according to detection data; the device has the characteristics of high efficiency, high precision, non-contact processing and small heat influence.

The invention belongs to the technical field of advanced manufacturing, and particularly relates to a microtexture functional curved surface machining method based on a structured grinding tool, which comprises the following steps of: determining an artificial joint type and an artificial joint surface microtexture array form; a grinding wheel is selected according to the microtexture array form; the grinding wheel is provided with an upper convex part and a lower concave part; mounting the artificial joint and the grinding wheel on a five-axis numerical control ultra-precision machine tool; setting a moving track of a grinding wheel according to the artificial joint type; and polishing the surface of the artificial joint to form a micro-texture array. The micro-texture array is machined on the surface of the artificial joint in a structured grinding mode, and the method has the advantages of being high in machining efficiency, good in process continuity, low in cost and the like, and is wide in applicability and high in flexibility.

The invention discloses a free-form surface flexible polishing self-adaptive control method and device, and belongs to the technical field of ultra-precision four-axis polishing machine tool machining. According to the method, a high-efficiency closed-loop control system is constructed on the basis of a flexible head removal principle in combination with an automatic control technology and a pressure sensing technology, fine online capture of down pressure changes and self-adaptive adjustment of polishing parameters in the polishing process can be achieved, the limitation of the prior art is effectively overcome, and the intelligent level of the process is improved. Comprising a flexible polishing head and a downward pressure on-line detection device. The actual machining condition of the current position is analyzed by collecting downward pressure generated by deformation of the flexible polishing head in the polishing process, and technological parameters are automatically adjusted. The invention provides a more efficient and accurate free-form surface flexible polishing scheme, the machining time can be remarkably shortened, the labor intensity of technicians is relieved, and meanwhile, the machining precision is guaranteed and improved. The device has the advantages of simple structure, convenience in disassembly and assembly, high precision and the like.

The invention relates to the technical field of laser cutting, in particular to an ultra-precision laser cutting path optimization method and system.The method comprises the steps that a CAD model of a mechanical part is obtained, contour information of the mechanical part is extracted, the contour is discretized into a series of nodes, and technological parameters of laser cutting and motion constraint conditions of cutting equipment are determined; a laser cutting path is obtained according to the extracted contour information, nodes in the cutting path are coded into chromosomes in sequence, and each chromosome represents a cutting path scheme; designing a fitness function to evaluate each chromosome to obtain a fitness value of each chromosome; and performing genetic manipulation and iterative optimization on each chromosome according to the fitness value until a termination condition is met, obtaining the chromosome with the highest fitness, and decoding the chromosome into an optimized ultra-precision laser cutting path. According to the method, the genetic algorithm and the fitness function are planned and designed for the ultra-precision laser cutting path, global optimization of the cutting path is achieved, and the cutting efficiency and quality are improved.

The invention discloses a nanoscale high-precision positioning method based on a multi-degree-of-freedom motion workbench, and relates to the field of large-stroke and high-precision positioning, and the method comprises the steps: S1, initializing the motion workbench, and guaranteeing that a system is in a zero position state; s2, sending a target position instruction by the upper computer, and driving the macro moving platform to quickly move to a position near a target; s3, acquiring the current position, calculating the deviation from the target position according to the target displacement and the current actual feedback displacement value, and generating micropositioner control parameters; s4, a control instruction is generated, and nanoscale displacement compensation is executed; and S5, iteratively correcting the displacement of the micropositioner until the deviation fed back by the laser interferometer meets the requirement. According to the invention, the positioning precision of large-stroke (hundred millimeters) movement is improved to a nanometer level, the device is suitable for the fields of photoetching machines, ultra-precision machining, biological micromanipulation and the like, and the equipment performance and the process level are improved. In addition, the system adopts a modular design, can adapt to different driving and sensing units according to requirements, and has strong expansibility.

The invention relates to the technical field of grinding mills, and discloses an ultra-precise double-sided grinding miller which comprises a rack, a supporting frame is fixedly mounted at the top of the rack, a base is fixedly mounted in the middle of the top of the supporting frame, and a hydraulic cylinder is fixedly mounted at the top of the base; and a hydraulic rod is fixedly mounted at the top of the grinding assembly. According to the ultra-precise double-sided grinding machine, when a hydraulic rod drives a lantern ring to move downwards, a grinding block makes contact with a mechanical part firstly, along with continuous downward extrusion of the hydraulic rod, a clamping ring is extruded to drive a ring sleeve below the clamping ring to slide upwards on the surface of a positioning rod, and at the moment, a limiting ring slides on the surface of a sliding supporting rod while moving upwards along with the ring sleeve; the outer side of the extrusion bag is affected by deformation to extend outwards so as to be attached to the upper portion of the mechanical part, the grinding position of the mechanical part is limited, and it can be guaranteed that in the grinding process of the mechanical part, grinding pressure can be more evenly distributed on the surface of the mechanical part.

The invention relates to the technical field of ultra-precision machining, in particular to an automatic tool changing device and method for a hydrostatic spindle. The tool changing device comprises a tool changing frame, a plurality of locking assemblies and a plurality of screw adjusting assemblies, the tool changing frame is provided with a plurality of tool changing stations, the locking assemblies and the tool changing stations are arranged on the tool changing frame in a one-to-one correspondence mode, the screw adjusting assemblies are arranged on the tool changing frame, and the positions of the screw adjusting assemblies and the positions of the locking assemblies are in one-to-one correspondence. The screw adjusting assembly is used for adjusting an adjusting screw of the liquid expansion clamp. The locking assembly is arranged on the tool changing frame to lock the tool, the adjusting screw of the liquid expansion clamp is adjusted through the screw adjusting assembly so that the liquid expansion clamp can be in a clamping state or a loosening state, and the locking assembly, the screw adjusting assembly and the liquid expansion clamp are matched to achieve automatic tool changing. The whole process does not need human participation, the working efficiency is improved, the risk in the process of manually replacing the cutter is avoided, and the safety is improved.

The invention discloses an ultra-precision optical centering lathe, and relates to the technical field of high-end lens machining. The ultra-precision optical centering lathe comprises a support, a lathe body, a stand column, a rotary table, an upper light pipe assembly, a lower light pipe assembly and a sliding table assembly, the lathe body is arranged on the support, the lower end of the stand column is arranged on the lathe body, the rotary table is installed on the lathe body and suitable for fixing a mirror set to be machined, and the upper light pipe assembly is arranged on the stand column. The upper light pipe assembly is used for calibrating the optical axis of the upper surface of the lens set, the lower light pipe assembly is arranged on the support and used for calibrating the optical axis of the lower surface of the lens set, the sliding table assembly is arranged on the stand column, a four-station tool turret is installed on the sliding table assembly, an optical confocal system is arranged in a first station on the four-station tool turret, and the optical confocal system is arranged in a second station on the four-station tool turret. An automatic measuring system is arranged in a second station on the four-station tool turret, an outer circle turning tool is arranged in a third station on the four-station tool turret, and an inner circle turning tool is arranged in a fourth station on the four-station tool turret.

The invention relates to the technical field of ultra-precision intelligent manufacturing, in particular to an ultra-precision machining error compensation method based on multi-modal information fusion, a medium and equipment. The method comprises the following steps: acquiring three-dimensional shape data of a workpiece through an in-situ measurement device, synchronously acquiring temperature field and vibration data, constructing a multi-modal space-time tensor, inputting a physical information neural network to decouple a static geometric error, a time-varying thermal drift error and a dynamic vibration error, and generating a four-dimensional correction tool path to realize reverse compensation. According to the method, physical constraints are embedded through a PINN model, the problem of false thermal drift misjudgment in a traditional method is solved, experiments show that the RMS error of free-form surface machining is reduced to 5 nm or below, and the precision is improved by 70% or above; and meanwhile, error decoupling is endowed with physical interpretability, the small sample generalization ability is enhanced, and a technical basis is provided for process optimization.

The invention belongs to the technical field of ultra-precision machining, and discloses a micro-fluidic chip based on the electroosmosis effect and a stress regulation and control method thereof.The micro-fluidic chip is internally provided with a plurality of solution channels, each solution channel is of a snakelike reciprocating structure, one end of each solution channel is provided with a channel inlet, and the other end of each solution channel is provided with a channel outlet; a plurality of inflection points arranged at intervals are arranged on one side, facing the bottom of the micro-fluidic chip, of the solution channel, the inflection points are close to the bottom of the micro-fluidic chip and are distributed on the micro-fluidic chip in the horizontal direction, and an electrode is further arranged on the solution channel. The electroosmosis effect and the microfluidic technology are combined, high-precision dynamic stress regulation and control are achieved through gradient flow channel design, a composite driving liquid formula and a hysteresis compensation algorithm, and the problems that pressure control response is delayed and precision is insufficient in a traditional polishing technology are solved; and a new technical approach is provided for ultra-precision machining of the large-aperture optical element for the inertial confinement nuclear fusion device.

The invention relates to the technical field of precision and ultra-precision machining, and provides a hydrostatic pressure guide rail device which comprises a guide rail and a sliding block which are in sliding connection. A sliding block body oil inlet channel and a sliding block body oil return channel are arranged in the sliding block; the sliding block comprises a sliding block body and a pair of bearing strips, an opening groove is formed in the bottom end of the sliding block body, the guide rail and the pair of bearing strips are located in the opening groove, one side of each bearing strip is fixedly connected with the sliding block body, and the other side of each bearing strip is slidably connected with the guide rail; the combination faces of the sliding block body, the bearing strip and the guide rail are matched, and a gap between the bearing strip and the guide rail forms an oil film bearing area. After the sliding block is designed in a split mode, the sliding block body plays a role in installation, the bearing strips play roles in static pressure supporting and oil film gap adjustment, the difficulty in manufacturing, measuring, assembling and adjusting the static pressure sliding block is lowered, the sliding block bodies with different opening sizes and the bearing strips with different thicknesses can be freely arranged, and therefore the static pressure sliding block can be conveniently assembled and disassembled. The precise adjustment of the oil film gaps is realized, and the consistency of the oil film gaps between the sliding blocks is ensured.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The topology reconfigurable modular multi-level power amplifier belongs to the field of ultra-precision motor drive technology. The invention solves the problem that the existing linear power amplifier works in the linear amplification area of ​​the switch device, has high loss and low efficiency, thus limiting the improvement of the power level. It includes: a power supply, a multi-level circuit and a filter circuit. The multi-level circuit includes: power switches are cascaded in sequence, resonant capacitors are respectively connected in parallel with the power switches, and fast capacitors C q1 Connect to the power switch S n+1 The source of the power switch S n+4 Between the drain of, ..., the fast capacitor C q(n+1) Connect the source of power switch S1 to the power switch S 2n+4 The drain of S1 is connected to the positive terminal of the power supply, and S 2n+4 The source is connected to the negative terminal of the power supply, and the power switch S n+2 The source is connected to the input end of the filter circuit, and the output end of the filter circuit is connected to the motor coil winding load. The invention is used for an ultra-precision motor system.

The invention provides a three-axis three-phase variable-speed ultraprecise microsphere grinding and polishing device and a grinding and polishing method, and belongs to the technical field of high-precision spherical part machining. By adjusting three sets of servo grinding head assemblies, output shafts (a first shaft, a second shaft and a third shaft) of the three sets of servo grinding head assemblies intersect at the sphere center of a machined sphere; the alignment precision of the three servo grinding head assemblies relative to the center of the ultra-precision microsphere is improved; meanwhile, output shafts of the three servo grinding head assemblies are controlled to rotate at a variable speed according to the sine rule, it is guaranteed that the motion trails formed by the three servo grinding head assemblies are evenly distributed on the surface of the machined ball and can completely wrap the surface of the machined ball, and sliding of the ultra-precise microspheres in the machining process is avoided; and the stability in the ultra-precision microsphere processing process can be ensured.

The invention discloses a micro-structure ultra-precision cutting method, and relates to the technical field of ultra-precision machining. Comprising the following steps that a contour error pre-compensation model is constructed based on an overall transfer function of a tool servo system, and the tool servo system comprises a fast tool servo system and a slow tool servo system; based on a frequency decomposition method, decomposing a processing track obtained by the contour error pre-compensation model to obtain a high-frequency small-amplitude track and a low-frequency large-amplitude track; and the high-frequency small-amplitude track is sent to a fast tool servo system, and the low-frequency large-amplitude track is sent to a slow tool servo system for cutting machining. According to the method, the requirement for machining precision can be met while the machining efficiency of the complex curved surface microstructure is guaranteed.

The invention belongs to the related field of ultra-precision polishing technology, and discloses an ultrasound-piezoelectricity-photocatalysis assisted chemical mechanical polishing method which comprises the following steps: mixing a basic polishing abrasive, a piezoelectric material and a photocatalyst, calcining and grinding, and processing to obtain a modified abrasive; preparing a polishing solution containing a piezoelectric catalysis carrier and a photocatalysis carrier at the same time; the polishing process is completed through a chain of mechanical stress, a piezoelectric electric field, efficient carrier separation and more active species participating in reaction. The invention further discloses a matched polishing device. Compared with the prior art, the method has the advantages that the material removal rate can be effectively increased, the polishing time can be effectively shortened, the surface quality can be further improved, the subsurface damage can be reduced, in addition, a more environment-friendly polishing solution can be used, the waste liquid treatment cost is reduced, the environment is protected, and the method is suitable for industrial production. Therefore, the polishing device is especially suitable for various high-hardness materials to realize the polishing application occasions of low-damage and ultra-smooth surfaces of the high-hardness materials.