512 results about "Ultra precision" patented technology

The invention belongs to the technical field of hard and brittle crystal material micropore machining, and particularly relates to an ultra-precision micropore multi-energy field coupling machining method and system.The method comprises the steps that the laser pulse frequency and power are set according to the workpiece material type and the micropore depth-diameter ratio, and a laser focus is positioned at the inner hole bottom of a workpiece; a modified structure extending in the axial direction of a hole is formed by controlling matching of a light spot and a hole diameter and the movement track of the light spot, in the machining process, a plasma nozzle and laser coaxially move, a modified area is removed in real time, a heat affected zone and the hole shape taper are restrained, meanwhile, vibration is applied to a workpiece through an axial ultrasonic vibration device, and machining precision is improved. And chip discharge is promoted, and stress and crack generation are reduced. The problems of serious thermal damage, poor hole shape precision, low machining efficiency and high energy consumption in the micropore machining process in the prior art are solved, and high-quality and high-precision machining of the high-depth-diameter-ratio micropore of the hard and brittle transparent crystal material is achieved.

The invention relates to the technical field of turning machining, and discloses an ultra-precision turning machining control method and system and a storage medium. The method comprises the steps that a laser contourgraph detects geometric parameters and abrasion data of a turning tool, and a tool health degree index is calculated; performing error compensation based on the health degree index to obtain a feeding control parameter; cutting force signals are collected, and technological parameters are optimized through a multi-target genetic algorithm; arranging a temperature sensor array, and adjusting cooling control according to process parameters; and generating a track control point and performing interpolation processing to obtain a motion control sequence. According to the method, the problem that the machining precision is unstable due to the fact that the cutter state cannot be quantitatively evaluated in real time in traditional turning is solved, and the precision control capability and machining quality consistency of ultra-precision turning are improved.

The invention provides an epitaxial wafer edge morphology compensation type wafer double-sided polishing device and method, and belongs to the technical field of semiconductor wafer ultra-precision machining. The polishing main machine comprises an upper fixed disc, a lower fixed disc and a wafer driving mechanism; the pressure loading system is used for applying adjustable pressure to the fixed disc; the polishing solution supply system is used for conveying a flow-adjustable polishing solution to the processing interface; the central control unit is in communication connection with the two systems and executes edge morphology compensation control logic, specifically, the machining pressure is adjusted in a segmented mode, and the flow of the polishing solution and the pressure are subjected to coupling change. According to the method, the atomic level flatness of the wafer surface is ensured, the edge morphology is accurately controlled, the edge thickening of the epitaxial layer is perfectly counteracted, and the photoetching yield of high-end chip manufacturing is remarkably improved.

The invention discloses ultra-precision laser processing equipment and method based on AI vision, and belongs to the technical field of laser processing. The ultra-precision laser processing equipment comprises a stabilizing plate, a first linear module is fixedly installed on the upper surface of the stabilizing plate, and a second linear module is fixedly installed on the upper surface of a movable block of the first linear module; a connecting cylinder is fixedly installed on the upper surface of a movable block of the second linear module, a workpiece bearing table is fixedly installed on the upper surface in the connecting cylinder, a pushing and clamping mechanism is installed in the connecting cylinder, third linear modules are fixedly installed at the two ends of the upper surface of the stabilizing plate, and a connecting ring is fixedly installed between movable blocks of the two third linear modules. And a cutting angle regulation and control mechanism is rotationally mounted in the connecting ring. Through the design of the cutting angle regulation and control mechanism, the incident angle of laser can be automatically regulated and controlled through the camera in the workpiece machining process, and the diversified machining requirements of workpieces with complex curved surfaces and irregular shapes are met.

The invention discloses a free-form surface flexible polishing self-adaptive control method and device, and belongs to the technical field of ultra-precision four-axis polishing machine tool machining. According to the method, a high-efficiency closed-loop control system is constructed on the basis of a flexible head removal principle in combination with an automatic control technology and a pressure sensing technology, fine online capture of down pressure changes and self-adaptive adjustment of polishing parameters in the polishing process can be achieved, the limitation of the prior art is effectively overcome, and the intelligent level of the process is improved. Comprising a flexible polishing head and a downward pressure on-line detection device. The actual machining condition of the current position is analyzed by collecting downward pressure generated by deformation of the flexible polishing head in the polishing process, and technological parameters are automatically adjusted. The invention provides a more efficient and accurate free-form surface flexible polishing scheme, the machining time can be remarkably shortened, the labor intensity of technicians is relieved, and meanwhile, the machining precision is guaranteed and improved. The device has the advantages of simple structure, convenience in disassembly and assembly, high precision and the like.

The invention relates to the technical field of laser cutting, in particular to an ultra-precision laser cutting path optimization method and system.The method comprises the steps that a CAD model of a mechanical part is obtained, contour information of the mechanical part is extracted, the contour is discretized into a series of nodes, and technological parameters of laser cutting and motion constraint conditions of cutting equipment are determined; a laser cutting path is obtained according to the extracted contour information, nodes in the cutting path are coded into chromosomes in sequence, and each chromosome represents a cutting path scheme; designing a fitness function to evaluate each chromosome to obtain a fitness value of each chromosome; and performing genetic manipulation and iterative optimization on each chromosome according to the fitness value until a termination condition is met, obtaining the chromosome with the highest fitness, and decoding the chromosome into an optimized ultra-precision laser cutting path. According to the method, the genetic algorithm and the fitness function are planned and designed for the ultra-precision laser cutting path, global optimization of the cutting path is achieved, and the cutting efficiency and quality are improved.

The invention discloses a nanoscale high-precision positioning method based on a multi-degree-of-freedom motion workbench, and relates to the field of large-stroke and high-precision positioning, and the method comprises the steps: S1, initializing the motion workbench, and guaranteeing that a system is in a zero position state; s2, sending a target position instruction by the upper computer, and driving the macro moving platform to quickly move to a position near a target; s3, acquiring the current position, calculating the deviation from the target position according to the target displacement and the current actual feedback displacement value, and generating micropositioner control parameters; s4, a control instruction is generated, and nanoscale displacement compensation is executed; and S5, iteratively correcting the displacement of the micropositioner until the deviation fed back by the laser interferometer meets the requirement. According to the invention, the positioning precision of large-stroke (hundred millimeters) movement is improved to a nanometer level, the device is suitable for the fields of photoetching machines, ultra-precision machining, biological micromanipulation and the like, and the equipment performance and the process level are improved. In addition, the system adopts a modular design, can adapt to different driving and sensing units according to requirements, and has strong expansibility.

The invention discloses an ultra-precision optical centering lathe, and relates to the technical field of high-end lens machining. The ultra-precision optical centering lathe comprises a support, a lathe body, a stand column, a rotary table, an upper light pipe assembly, a lower light pipe assembly and a sliding table assembly, the lathe body is arranged on the support, the lower end of the stand column is arranged on the lathe body, the rotary table is installed on the lathe body and suitable for fixing a mirror set to be machined, and the upper light pipe assembly is arranged on the stand column. The upper light pipe assembly is used for calibrating the optical axis of the upper surface of the lens set, the lower light pipe assembly is arranged on the support and used for calibrating the optical axis of the lower surface of the lens set, the sliding table assembly is arranged on the stand column, a four-station tool turret is installed on the sliding table assembly, an optical confocal system is arranged in a first station on the four-station tool turret, and the optical confocal system is arranged in a second station on the four-station tool turret. An automatic measuring system is arranged in a second station on the four-station tool turret, an outer circle turning tool is arranged in a third station on the four-station tool turret, and an inner circle turning tool is arranged in a fourth station on the four-station tool turret.

The invention relates to the technical field of ultra-precision intelligent manufacturing, in particular to an ultra-precision machining error compensation method based on multi-modal information fusion, a medium and equipment. The method comprises the following steps: acquiring three-dimensional shape data of a workpiece through an in-situ measurement device, synchronously acquiring temperature field and vibration data, constructing a multi-modal space-time tensor, inputting a physical information neural network to decouple a static geometric error, a time-varying thermal drift error and a dynamic vibration error, and generating a four-dimensional correction tool path to realize reverse compensation. According to the method, physical constraints are embedded through a PINN model, the problem of false thermal drift misjudgment in a traditional method is solved, experiments show that the RMS error of free-form surface machining is reduced to 5 nm or below, and the precision is improved by 70% or above; and meanwhile, error decoupling is endowed with physical interpretability, the small sample generalization ability is enhanced, and a technical basis is provided for process optimization.

The invention belongs to the technical field of ultra-precision machining, and discloses a micro-fluidic chip based on the electroosmosis effect and a stress regulation and control method thereof.The micro-fluidic chip is internally provided with a plurality of solution channels, each solution channel is of a snakelike reciprocating structure, one end of each solution channel is provided with a channel inlet, and the other end of each solution channel is provided with a channel outlet; a plurality of inflection points arranged at intervals are arranged on one side, facing the bottom of the micro-fluidic chip, of the solution channel, the inflection points are close to the bottom of the micro-fluidic chip and are distributed on the micro-fluidic chip in the horizontal direction, and an electrode is further arranged on the solution channel. The electroosmosis effect and the microfluidic technology are combined, high-precision dynamic stress regulation and control are achieved through gradient flow channel design, a composite driving liquid formula and a hysteresis compensation algorithm, and the problems that pressure control response is delayed and precision is insufficient in a traditional polishing technology are solved; and a new technical approach is provided for ultra-precision machining of the large-aperture optical element for the inertial confinement nuclear fusion device.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The invention provides a three-axis three-phase variable-speed ultraprecise microsphere grinding and polishing device and a grinding and polishing method, and belongs to the technical field of high-precision spherical part machining. By adjusting three sets of servo grinding head assemblies, output shafts (a first shaft, a second shaft and a third shaft) of the three sets of servo grinding head assemblies intersect at the sphere center of a machined sphere; the alignment precision of the three servo grinding head assemblies relative to the center of the ultra-precision microsphere is improved; meanwhile, output shafts of the three servo grinding head assemblies are controlled to rotate at a variable speed according to the sine rule, it is guaranteed that the motion trails formed by the three servo grinding head assemblies are evenly distributed on the surface of the machined ball and can completely wrap the surface of the machined ball, and sliding of the ultra-precise microspheres in the machining process is avoided; and the stability in the ultra-precision microsphere processing process can be ensured.

The invention discloses a micro-structure ultra-precision cutting method, and relates to the technical field of ultra-precision machining. Comprising the following steps that a contour error pre-compensation model is constructed based on an overall transfer function of a tool servo system, and the tool servo system comprises a fast tool servo system and a slow tool servo system; based on a frequency decomposition method, decomposing a processing track obtained by the contour error pre-compensation model to obtain a high-frequency small-amplitude track and a low-frequency large-amplitude track; and the high-frequency small-amplitude track is sent to a fast tool servo system, and the low-frequency large-amplitude track is sent to a slow tool servo system for cutting machining. According to the method, the requirement for machining precision can be met while the machining efficiency of the complex curved surface microstructure is guaranteed.

The invention belongs to the related field of ultra-precision polishing technology, and discloses an ultrasound-piezoelectricity-photocatalysis assisted chemical mechanical polishing method which comprises the following steps: mixing a basic polishing abrasive, a piezoelectric material and a photocatalyst, calcining and grinding, and processing to obtain a modified abrasive; preparing a polishing solution containing a piezoelectric catalysis carrier and a photocatalysis carrier at the same time; the polishing process is completed through a chain of mechanical stress, a piezoelectric electric field, efficient carrier separation and more active species participating in reaction. The invention further discloses a matched polishing device. Compared with the prior art, the method has the advantages that the material removal rate can be effectively increased, the polishing time can be effectively shortened, the surface quality can be further improved, the subsurface damage can be reduced, in addition, a more environment-friendly polishing solution can be used, the waste liquid treatment cost is reduced, the environment is protected, and the method is suitable for industrial production. Therefore, the polishing device is especially suitable for various high-hardness materials to realize the polishing application occasions of low-damage and ultra-smooth surfaces of the high-hardness materials.

The application relates to the technical field of ultra-precision machining, and discloses a free curved surface envelope machining track planning method and system based on an arbitrary curved section tool, which comprises the following steps: step 1, judging the concave-convex property of discrete points of a tool section curve, retaining convex envelope points, discarding concave envelope points, obtaining a set of all convex envelope points of the tool section curve, and defining the set as a full-convex envelope contour matrix of the tool section curve; step 2, calculating a new tool section curve convex envelope interpolation contour, and calculating a new tool section curve according to the new tool section curve convex envelope interpolation contour; and step 3, obtaining a tool curved surface point cloud according to the new tool section curve in step 2, and planning a free curved surface workpiece envelope machining track based on the tool curved surface point cloud.

The invention discloses a hemispherical harmonic oscillator in-situ thickness measuring device and method based on multipoint spectral confocal. The device comprises a workpiece rotating shaft, a workpiece moving shaft, a workpiece clamp, an axial measurement window, a radial measurement window, a multi-point spectrum confocal sensing probe, a probe bracket, a probe rotating shaft and a probe moving shaft. According to the invention, lossless and in-situ measurement is carried out on thickness data. According to the method, a thickness measurement path is designed and planned, a spectral confocal sensor is driven to move in different areas of the thin wall of the hemispherical resonator to cover more measurable positions, a theoretical mathematical model based on multi-point distance measurement is established, and the inclination angle is obtained through multi-point fitting calculation to compensate the thickness measurement result of the thin wall of the hemispherical resonator. And extracting section thickness data based on a hemispherical resonator thin-wall thickness uniformity calculation method of NURBS internal and external fitting, and calculating thickness distribution in the circumferential direction of a rotary body. The method is suitable for nondestructive testing of the ultra-precision manufacturing process with strict requirements on the quality of finished products. The method is suitable for the ultra-precision manufacturing process of the thin wall of the hemispherical harmonic oscillator, errors are compensated through on-line measurement in a machine, and the machining efficiency and the finished product quality are improved.

The invention provides a double-light-path refraction measurement type precision leveling machining platform and a working method thereof, and belongs to the technical field of ultra-precision plane machining equipment. The problems that existing plane machining is low in machining precision and efficiency are solved. The device comprises a supporting table, a machining device, a limiting assembly, a positioning assembly and a leveling assembly, a to-be-machined workpiece is placed on the machining device, and the limiting assembly can prevent the to-be-machined workpiece from rotating; the positioning assembly comprises a first laser transmitter, a first photosensitive position sensor, a second laser transmitter, a second photosensitive position sensor and a double-sided transmitting mirror, the positioning assembly can detect whether a to-be-machined workpiece is horizontal or not, and the leveling assembly can adjust the inclination angle between the to-be-machined workpiece and the horizontal plane. According to the machining platform, plane machining can be conducted on the workpiece to be machined, meanwhile, whether the workpiece to be machined is horizontal or not is detected, the workpiece to be machined is leveled, real-time monitoring and correction are achieved, and the machining precision and the machining efficiency can be improved.

The present invention relates to a combined process of ultra-precision grinding and photochemical mechanical polishing of laser crystal slices. The process comprises the following steps: using a coarse-grained grinding wheel for rough grinding to achieve rapid thinning and determine the depth of the subsurface damage layer, providing a reference for the grinding wheel feed rate in the fine grinding stage; using a fine-grained grinding wheel for fine grinding to remove the damage layer introduced in the rough grinding stage, and obtaining higher surface / subsurface quality and surface accuracy by optimizing process parameters; using aluminum oxide (Al2O3) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing semi-fine polishing on the laser crystal slices to quickly remove the surface damage caused in the grinding stage; using zirconium oxide (ZrO2) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing fine polishing on the laser crystal slices to further optimize the surface quality and surface accuracy; and using an ultrasonic cleaner to clean the laser crystal slices, with anhydrous ethanol as the cleaning agent. The present invention can simultaneously achieve high surface integrity and high-efficiency processing of laser crystal slices.

The invention relates to the technical field of optical lens machining, in particular to an ultra-precision laser cutting, grinding and polishing integrated machining method and system for an AI silicon carbide lens. The machining system comprises a laser cutting machine, a cutting table is arranged on the laser cutting machine, and a grinding machine box is arranged on one side of the laser cutting machine; a polishing machine box is arranged on one side of the polishing machine box, supporting plates are fixedly installed between the cutting table and the polishing machine box and between the polishing machine box and the polishing machine box, multi-degree-of-freedom mechanical arms are arranged on the supporting plates, and vacuum suction cups are arranged at the free ends of the multi-degree-of-freedom mechanical arms; jacking dust collection assemblies are arranged in the grinding machine box and the polishing machine box correspondingly, supporting frames are fixedly installed on the top faces of the grinding machine box and the polishing machine box, a left driving motor and a right driving motor which are mutually symmetrical are fixedly installed on a top plate body of each supporting frame, and grinding wheels are detachably installed at the tail ends of output shafts of the driving motors. Integrated machining operation can be achieved, and the machining efficiency can be improved.

The invention discloses an ultra-precision polishing method for a thermoelectric material. The ultra-precision polishing method comprises the steps that S1, mechanical grinding and rough polishing are conducted on a thermoelectric material block through abrasive paper; wherein the abrasive paper sequentially uses metallographic abrasive paper with the abrasive particle mesh number from small to large; s2, diamond polishing paste or polishing liquid, CeO2 polishing liquid and Al2O3 polishing paste or polishing liquid are used as grinding materials, and mechanical polishing and fine polishing are carried out on the thermoelectric material block after mechanical grinding and rough polishing on a polishing machine; and S3, an alkaline SiO2 polishing solution or a water-based diamond polishing solution is used as a polishing medium, the thermoelectric material block subjected to mechanical polishing is subjected to repeated fine polishing and mechanochemical polishing on a polishing machine, and the thermoelectric material subjected to ultra-precision polishing is obtained. The surface roughness of the thermoelectric material obtained by the method does not exceed 1nm.

The invention relates to a flexible polishing method for RB-SiC composite material photoelectric selective catalysis, and belongs to the field of ultra-precision machining.The method comprises the steps that an RB-SiC composite material workpiece is fixed to a clamp, then the workpiece clamp is connected to the positive electrode of a power source, and the RB-SiC composite material is polished; a polishing solution supply pipe mixed with light, electro-catalysis particles, an oxidizing agent and polishing abrasive particles is connected to the negative electrode, voltage is applied to the workpiece, the polishing solution is sprayed to the surface of the workpiece, and a closed loop is formed; ultraviolet light is used for fully irradiating the position where the polishing solution is sprayed on the surface of the workpiece; and finally, a flexible polishing tool rotating at a high speed is adopted, different phases of the RB-SiC composite material workpiece are selectively removed by adjusting the ultraviolet light intensity and the voltage, and multi-phase consistency machining of the RB-SiC composite material workpiece is achieved. The initial performance difference between the two phases is greatly weakened, high-efficiency and high-precision surface polishing is achieved, and the problems of surface scratches, subsurface damage and the like are avoided.

The invention relates to the field of ultra-precision machine tools, and provides an ultra-precision double-drive high-acceleration hydrostatic guide rail device. The ultra-precise double-drive high-acceleration hydrostatic guide rail device comprises a guide rail base, a guide rail assembly and a guide rail movement assembly, the guide rail assembly comprises at least two guide rails and at least one side guide rail, the at least two guide rails are arranged on the upper portion of the guide rail base in the width direction of the guide rail base at intervals, and one side guide rail is arranged between every two adjacent guide rails. According to the hydrostatic pressure guide rail device, the supporting oil cavity is formed in the bottom of the slide carriage, and the auxiliary oil cavity is formed in the side, close to the guide rail, of the top of the hydrostatic pressure sliding block, so that the position of the supporting oil cavity surface is lifted; due to the fact that the hydrostatic pressure sliding block and the sliding block heightening column are located below the supporting oil cavity face, the overall gravity center of the guide rail movement assembly moves downwards and is coplanar with the supporting oil cavity face, the influence of upsetting moment on the thickness of a supporting oil film is reduced, and the accuracy of the hydrostatic pressure guide rail device is improved.

The invention discloses a ceramic guide rail for an ultra-precision machining and ultra-precision measuring instrument and a preparation method of the ceramic guide rail in the field of ceramic materials. The ceramic guide rail comprises the following raw materials: 40-58% of nano alpha-Al2O3; 10 to 15% of titanium carbide; 5-8% of boron nitride; 5% to 10% of a Y2O3-MgO compound; 3-5% of zirconium oxide; 1 to 2 percent of La2O3; 0.5 to 1.5 percent of graphene; and 2 to 5% of nano CeO2 coated Al2O3 core-shell particles. The ceramic guide rail disclosed by the invention has excellent wear resistance, dimensional stability and thermal mechanical property, and is particularly suitable for guiding parts of ultra-precision machining equipment and measuring instruments.

The invention belongs to the technical field of slide valve pair zero-zone micro-scale static characteristic testing, and provides a slide valve pair zero-zone micro-scale static characteristic high-precision test bed and a test method.The slide valve pair zero-zone micro-scale static characteristic high-precision test bed comprises an ultra-precision slide valve pair mounting table and a slide valve pair static characteristic hydraulic testing system; by selecting a control element and a detection element which can measure and control the flow, the pressure and the temperature in a high-precision and precise manner, and combining an innovatively developed test subprogram, an intelligent data processing algorithm and a test model machine learning algorithm, the measurement precision, the test result confidence coefficient and the measurement efficiency are improved; according to the test bed, based on a hydraulic test system for the micro-scale static characteristics of the zero region of the slide valve pair, a control element and a detection element which can measure and control the flow, the pressure and the temperature in a high-precision and accurate manner are carefully selected, and the micro-scale static characteristic measurement under different flow, pressure and temperature of the zero region of the slide valve pair can be comprehensively and accurately simulated.

The invention discloses a manufacturing method of a fused quartz double-aspheric-surface rod mirror. The manufacturing method comprises the following steps: S1, carrying out laser-assisted ultra-precision turning on the fused quartz double-aspheric-surface rod mirror; s2, detecting the surface type precision and the surface roughness of the fused quartz double-aspheric rod mirror, if the detection result meets the processing requirement, executing the step S3, otherwise, executing the step S1; s3, performing shape-preserving polishing on the fused quartz double-aspheric rod mirror; s4, detecting the surface precision and the surface roughness of the fused quartz double-aspheric rod mirror, if the detection result meets the processing requirement, executing the step S5, and otherwise, executing the step S3; and S5, performing optical inspection on the fused quartz double aspheric rod lens. According to the method, the service life of the tool is prolonged, meanwhile, the profile precision after machining is improved, the surface roughness after machining is reduced, the turning efficiency is improved, the conformal polishing procedure is introduced after ultra-precision turning, and the roughness of the machined rod mirror is rapidly improved.

The invention discloses a wafer precision grinding method based on laser subsurface modification softening, and belongs to the technical field of semiconductor manufacturing. The method is used for carrying out final damage layer removal and surface finish machining on the hard and brittle wafers (such as silicon carbide and diamond) subjected to preliminary mechanical polishing. The method comprises the following steps: (1) detecting the depth of a damaged layer on the subsurface of a wafer; (2) focusing ultrafast laser on the subsurface of the wafer, scanning to form a continuous and compact softened modified layer, controlling the modified layer to extend upwards in the vertical direction, so that the modified layer covers most of the volume of the material to be removed, and only retaining a micron or submicron original hard thin layer on the top layer of the wafer; (3) carrying out nondestructive testing on the modified layer; and (4) an ultra-precision grinding process (such as CMP or PAP) is adopted, the supporting weakening effect of the modified layer on the top hard thin layer and the characteristic that the modified layer is easy to remove are utilized, and all the to-be-machined allowances are rapidly removed at a time. According to the method, on the premise that the high-quality surface is not damaged, the finish machining efficiency of the superhard material is remarkably improved through the mechanism of internal softening and top layer collapse removal.

The invention discloses a robot anti-interference integrated circuit system based on multi-sensor fusion, relates to the technical field of automatic control, and aims to solve the problems that in ultra-precision hole machining, due to the fact that complex multi-mode vibration of a boring rod cannot be decoupled and accurately compensated in real time, and the machining precision is high. The system comprises a sensor array which is configured on a key structure of an end effector of an industrial robot and is used for collecting multi-dimensional physical signals related to mechanical vibration in real time; the application-specific integrated circuit is in signal connection with the sensor array and the robot controller, and the application-specific integrated circuit comprises a vibration reconstruction and compensation amount determination module which is used for receiving, fusing and processing multi-dimensional physical signals collected by the sensor array; according to the method, a real-time vibration deformation modal reconstruction and mapping system based on a spatial distributed sensing array and a special integrated circuit is constructed, so that the complex dynamic deformation of the boring rod in the machining process is identified.

The invention provides a cutting head control system and method for ultra-precise high-power laser cutting equipment, and relates to the technical field of metal cutting, and the system comprises a workpiece screening module which screens and integrates multiple workpiece combinations produced in the same batch from a production task pool; the quota setting module is used for presetting production quota characteristics and a quota deviation range; the local calling module is used for calling design information of the workpiece and a cutting laser power interval; the nesting arrangement module is used for optimizing special-shaped nesting arrangement according to the workpiece design information to obtain target special-shaped nesting arrangement; the path optimizing module is used for optimizing a cutting path and positioning a target cutting path and a control sequence; and the cutting control module cooperatively controls the cutting head to execute cutting production. According to the method, the technical problems of low material utilization rate and poor cutting efficiency in the metal cutting process due to lack of integrated modeling of multi-workpiece mixed arrangement and cutting parameter collaborative optimization in the prior art are solved, and the metal cutting flexible production capacity and the material utilization rate are improved.

The invention discloses a processing method of a high-precision cycloolefin copolymer free-form surface lens, the free-form surface lens comprises an upper end surface and a lower end surface, the upper end surface of the free-form surface lens comprises a free-form surface contour A surface and an outer circumferential surface a annularly arranged outside the free-form surface contour A surface; the lower end face of the free-form surface lens comprises a free-form surface contour surface B and an outer circumferential surface b annularly arranged outside the free-form surface contour surface B. The machining method comprises the steps of S1, tool rough machining, S2, lens blank rough machining, S3, inputting a digital-analog point cloud data file into ultra-precision equipment, S4, tool fine trimming, S5, lens blank plane fine trimming and S6, side wall vertical plane machining. S7, rough turning of the upper end face of the lens blank, S8, finish turning of the transition free-form surface outline A face, S9, turnover clamping, S10, rough turning of the lower end face of the lens blank and S11, finish turning of the transition free-form surface outline B face are conducted, and when ultra-precision equipment is used for machining in the steps S4, S5, S7, S8, S10 and S11, liquefied carbon dioxide is used for cooling.

The invention belongs to the technical field of linear guide rails, and discloses a dynamically-adjustable air-floating linear guide rail and an adjusting method thereof.By arranging a plurality of dynamic adjusting units, the relative distance between an air-floating bearing and a moving platform deck is actively adjusted, and accurate control over the posture of the moving platform deck is achieved; the reference datum piece and the non-contact displacement sensor which are independently arranged outside the guide rail base body are combined, so that the independence and the high precision of the measurement datum are ensured; the closed-loop control system generates a control instruction according to the real-time measurement signal, and drives the dynamic adjustment unit to carry out dynamic compensation, so that the straightness error generated in the operation process of the moving platform deck is effectively corrected; therefore, the motion precision and the stability of the air-floating linear guide rail can be remarkably improved, the air-floating linear guide rail can meet the ultra-precision application requirements of submicron and even nanoscale, and the defect that a traditional air-floating guide rail is difficult to meet the increasingly stringent precision requirement in ultra-precision application is overcome.