323 results about "Ultra precision" patented technology

The invention belongs to the technical field of hard and brittle crystal material micropore machining, and particularly relates to an ultra-precision micropore multi-energy field coupling machining method and system.The method comprises the steps that the laser pulse frequency and power are set according to the workpiece material type and the micropore depth-diameter ratio, and a laser focus is positioned at the inner hole bottom of a workpiece; a modified structure extending in the axial direction of a hole is formed by controlling matching of a light spot and a hole diameter and the movement track of the light spot, in the machining process, a plasma nozzle and laser coaxially move, a modified area is removed in real time, a heat affected zone and the hole shape taper are restrained, meanwhile, vibration is applied to a workpiece through an axial ultrasonic vibration device, and machining precision is improved. And chip discharge is promoted, and stress and crack generation are reduced. The problems of serious thermal damage, poor hole shape precision, low machining efficiency and high energy consumption in the micropore machining process in the prior art are solved, and high-quality and high-precision machining of the high-depth-diameter-ratio micropore of the hard and brittle transparent crystal material is achieved.

The invention relates to the technical field of turning machining, and discloses an ultra-precision turning machining control method and system and a storage medium. The method comprises the steps that a laser contourgraph detects geometric parameters and abrasion data of a turning tool, and a tool health degree index is calculated; performing error compensation based on the health degree index to obtain a feeding control parameter; cutting force signals are collected, and technological parameters are optimized through a multi-target genetic algorithm; arranging a temperature sensor array, and adjusting cooling control according to process parameters; and generating a track control point and performing interpolation processing to obtain a motion control sequence. According to the method, the problem that the machining precision is unstable due to the fact that the cutter state cannot be quantitatively evaluated in real time in traditional turning is solved, and the precision control capability and machining quality consistency of ultra-precision turning are improved.

The invention provides an epitaxial wafer edge morphology compensation type wafer double-sided polishing device and method, and belongs to the technical field of semiconductor wafer ultra-precision machining. The polishing main machine comprises an upper fixed disc, a lower fixed disc and a wafer driving mechanism; the pressure loading system is used for applying adjustable pressure to the fixed disc; the polishing solution supply system is used for conveying a flow-adjustable polishing solution to the processing interface; the central control unit is in communication connection with the two systems and executes edge morphology compensation control logic, specifically, the machining pressure is adjusted in a segmented mode, and the flow of the polishing solution and the pressure are subjected to coupling change. According to the method, the atomic level flatness of the wafer surface is ensured, the edge morphology is accurately controlled, the edge thickening of the epitaxial layer is perfectly counteracted, and the photoetching yield of high-end chip manufacturing is remarkably improved.

The invention relates to the technical field of ultra-precision intelligent manufacturing, in particular to an ultra-precision machining error compensation method based on multi-modal information fusion, a medium and equipment. The method comprises the following steps: acquiring three-dimensional shape data of a workpiece through an in-situ measurement device, synchronously acquiring temperature field and vibration data, constructing a multi-modal space-time tensor, inputting a physical information neural network to decouple a static geometric error, a time-varying thermal drift error and a dynamic vibration error, and generating a four-dimensional correction tool path to realize reverse compensation. According to the method, physical constraints are embedded through a PINN model, the problem of false thermal drift misjudgment in a traditional method is solved, experiments show that the RMS error of free-form surface machining is reduced to 5 nm or below, and the precision is improved by 70% or above; and meanwhile, error decoupling is endowed with physical interpretability, the small sample generalization ability is enhanced, and a technical basis is provided for process optimization.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The invention discloses an ultra-precision polishing method for a thermoelectric material. The ultra-precision polishing method comprises the steps that S1, mechanical grinding and rough polishing are conducted on a thermoelectric material block through abrasive paper; wherein the abrasive paper sequentially uses metallographic abrasive paper with the abrasive particle mesh number from small to large; s2, diamond polishing paste or polishing liquid, CeO2 polishing liquid and Al2O3 polishing paste or polishing liquid are used as grinding materials, and mechanical polishing and fine polishing are carried out on the thermoelectric material block after mechanical grinding and rough polishing on a polishing machine; and S3, an alkaline SiO2 polishing solution or a water-based diamond polishing solution is used as a polishing medium, the thermoelectric material block subjected to mechanical polishing is subjected to repeated fine polishing and mechanochemical polishing on a polishing machine, and the thermoelectric material subjected to ultra-precision polishing is obtained. The surface roughness of the thermoelectric material obtained by the method does not exceed 1nm.

The invention relates to a flexible polishing method for RB-SiC composite material photoelectric selective catalysis, and belongs to the field of ultra-precision machining.The method comprises the steps that an RB-SiC composite material workpiece is fixed to a clamp, then the workpiece clamp is connected to the positive electrode of a power source, and the RB-SiC composite material is polished; a polishing solution supply pipe mixed with light, electro-catalysis particles, an oxidizing agent and polishing abrasive particles is connected to the negative electrode, voltage is applied to the workpiece, the polishing solution is sprayed to the surface of the workpiece, and a closed loop is formed; ultraviolet light is used for fully irradiating the position where the polishing solution is sprayed on the surface of the workpiece; and finally, a flexible polishing tool rotating at a high speed is adopted, different phases of the RB-SiC composite material workpiece are selectively removed by adjusting the ultraviolet light intensity and the voltage, and multi-phase consistency machining of the RB-SiC composite material workpiece is achieved. The initial performance difference between the two phases is greatly weakened, high-efficiency and high-precision surface polishing is achieved, and the problems of surface scratches, subsurface damage and the like are avoided.

The invention discloses a wafer precision grinding method based on laser subsurface modification softening, and belongs to the technical field of semiconductor manufacturing. The method is used for carrying out final damage layer removal and surface finish machining on the hard and brittle wafers (such as silicon carbide and diamond) subjected to preliminary mechanical polishing. The method comprises the following steps: (1) detecting the depth of a damaged layer on the subsurface of a wafer; (2) focusing ultrafast laser on the subsurface of the wafer, scanning to form a continuous and compact softened modified layer, controlling the modified layer to extend upwards in the vertical direction, so that the modified layer covers most of the volume of the material to be removed, and only retaining a micron or submicron original hard thin layer on the top layer of the wafer; (3) carrying out nondestructive testing on the modified layer; and (4) an ultra-precision grinding process (such as CMP or PAP) is adopted, the supporting weakening effect of the modified layer on the top hard thin layer and the characteristic that the modified layer is easy to remove are utilized, and all the to-be-machined allowances are rapidly removed at a time. According to the method, on the premise that the high-quality surface is not damaged, the finish machining efficiency of the superhard material is remarkably improved through the mechanism of internal softening and top layer collapse removal.

The invention discloses a robot anti-interference integrated circuit system based on multi-sensor fusion, relates to the technical field of automatic control, and aims to solve the problems that in ultra-precision hole machining, due to the fact that complex multi-mode vibration of a boring rod cannot be decoupled and accurately compensated in real time, and the machining precision is high. The system comprises a sensor array which is configured on a key structure of an end effector of an industrial robot and is used for collecting multi-dimensional physical signals related to mechanical vibration in real time; the application-specific integrated circuit is in signal connection with the sensor array and the robot controller, and the application-specific integrated circuit comprises a vibration reconstruction and compensation amount determination module which is used for receiving, fusing and processing multi-dimensional physical signals collected by the sensor array; according to the method, a real-time vibration deformation modal reconstruction and mapping system based on a spatial distributed sensing array and a special integrated circuit is constructed, so that the complex dynamic deformation of the boring rod in the machining process is identified.

The invention belongs to the technical field of linear guide rails, and discloses a dynamically-adjustable air-floating linear guide rail and an adjusting method thereof.By arranging a plurality of dynamic adjusting units, the relative distance between an air-floating bearing and a moving platform deck is actively adjusted, and accurate control over the posture of the moving platform deck is achieved; the reference datum piece and the non-contact displacement sensor which are independently arranged outside the guide rail base body are combined, so that the independence and the high precision of the measurement datum are ensured; the closed-loop control system generates a control instruction according to the real-time measurement signal, and drives the dynamic adjustment unit to carry out dynamic compensation, so that the straightness error generated in the operation process of the moving platform deck is effectively corrected; therefore, the motion precision and the stability of the air-floating linear guide rail can be remarkably improved, the air-floating linear guide rail can meet the ultra-precision application requirements of submicron and even nanoscale, and the defect that a traditional air-floating guide rail is difficult to meet the increasingly stringent precision requirement in ultra-precision application is overcome.

The present invention relates to diamond abrasive grains and a manufacturing method thereof, and provides tetradecahedral diamond abrasive grains with uniform size and shape. The manufacturing method of diamond abrasive grains according to the present invention allows for shape control and minimizes impurities and crystal defects, thereby manufacturing diamond abrasive grains for ultra-precision grinding in chemical mechanical planarization (CMP) processes.

A near-atomic-scale electrolytic machining method based on an interface self-assembly biomask comprises the steps that firstly, hydroxylation pretreatment is conducted on the surface of an anode of a workpiece, then the surface of the anode is covered with an organic solvent phase containing phospholipid monomers, water-phase electrolyte drops are introduced, molecular self-assembly driving force at an oil-water-metal three-phase interface is utilized, and the surface of the anode of the workpiece is subjected to near-atomic-scale electrochemical machining. And rapidly forming a layer of ultrathin, continuous and stable support phospholipid bilayer mask on the surface of the workpiece in situ. Then, biological nanochannels are embedded in the biomimetic mask to construct a confinement ion transport path. And finally, a precise pulse electric field is applied, electrolyte ions are driven to be strictly limited in the nanometer channel and transmitted to the surface of the workpiece, local anodic dissolution is triggered, and therefore localized material removal of the nanometer scale or even the near-atomic scale is achieved. According to the method, the technical bottleneck that the high-quality phospholipid bilayer is difficult to prepare on the high-surface-energy metal surface is solved, and a new way is provided for ultra-precision electrolytic machining.

This invention relates to the field of ultra-precision polishing technology, specifically to an ultrasonic cavitation microjet polishing module for polishing microstructures. The module includes an acoustic focusing nozzle, a center-penetrating piezoelectric transducer, an adaptive acoustic impedance frequency tracking system, and a liquid supply and bubble nucleation system. The acoustic focusing nozzle employs a variable cross-section acoustic amplitude rod structure, ensuring that the standing wave antinodes and nozzle outlet are confocal, thus increasing energy density. The piezoelectric transducer has a ring structure with fluid flowing through its center, achieving efficient energy conversion. The frequency tracking system adjusts the excitation frequency in real time to maintain resonance. The liquid supply system introduces cavitation nuclei through a venturi tube, reducing the cavitation threshold. This invention, through an acoustic-fluid coupling mechanism, utilizes the dual effects of macroscopic kinetic energy removal and microscopic cavitation removal to solve the problems of traditional polishing techniques, such as difficulty in processing high aspect ratio microstructures, incomplete bottom polishing, and low efficiency. It achieves high-precision polishing of microstructure surfaces, and is particularly suitable for ultra-precision machining of deep and narrow grooves.

The invention relates to the technical field of optical part ultra-precision machining, in particular to a large optical part ion beam polishing machine which comprises an overturning feeding device and a vacuum chamber, the overturning feeding device is arranged on one side of the vacuum chamber, and a side door is arranged on the side, close to the overturning feeding device, of the vacuum chamber. A driving mechanism is movably mounted in the vacuum chamber; the overturning feeding device comprises a transverse moving module. During application of the technical scheme, through reasonable layout of a driving structure and arrangement of structures such as multiple limiting, rolling feeding, automatic driving and modular layout, smooth feeding, stable overturning and no shaking of large optical parts can be guaranteed, radial acting force is greatly reduced, the operation process is simplified, the equipment layout is optimized, the positioning precision is improved, and the adaptive range is expanded; the problems of center driving material blocking, bottom driving shaking, large acting force, inconvenient operation, overlarge size, insufficient adaptation precision and the like in the prior art are comprehensively solved.

The invention relates to the technical field of ultra-precision optical manufacturing, in particular to a fast tool planing method for a micro-lens array, a medium and equipment. The method comprises the steps that a non-interference feasible planing tool is determined according to surface shape data of a micro lens array to be machined; building a parameter physical model of planing fundamental frequency, surface roughness and single unit machining duration based on micro lens unit parameters, cutter parameters and machining parameters; by taking a parameter limiting condition as a nonlinear constraint and the total processing duration as a target function, optimizing and solving fs, Rt, DL and fx to obtain the shortest processing duration; and finishing machining by adopting optimized parameters. According to the method, a multi-physical parameter model is innovatively constructed, collaborative optimization of optical performance (surface shape), process capability (roughness and dynamic characteristics) and manufacturing efficiency (processing time) is realized, nanoscale roughness and dynamic stability are ensured, a large-scale array processing period is remarkably shortened, and an efficient path is provided for batch manufacturing of ultra-precise optical elements.

The invention belongs to the field of ultra-precision machining equipment, and particularly discloses a stress electromagnetic drive variable-rigidity fast tool servo device and a using method thereof. The device comprises an electromagnetic driver, a variable stiffness spring, a motion unit and a shell. The electromagnetic driver is composed of a fixed iron core, a magnet exciting coil and a permanent magnet, the variable stiffness spring is composed of a fixed iron core with a magnet exciting coil, and the motion unit comprises a movable iron core and a double-end guide motion shaft; the driver and the spring fixed iron core are fixed to the shell, the movable iron core is fixed to the moving shaft, a working air gap is formed between the fixed iron core and the movable iron core, and the permanent magnets are distributed around the movable iron core of the driver. Driving force and spring rigidity are changed by adjusting current; electromagnetic force drives a cutter to do reciprocating precise motion, and the system bandwidth and stroke are changed by the spring rigidity. The device breaks through the rigidity and stroke solidification limitation of traditional equipment, frequency and stroke cooperative control is achieved through electromagnetic-mechanical coupling, nanoscale precision is kept within the millimeter-scale stroke, and the dynamic response and process adaptability of complex curved surface machining are remarkably improved.

The invention relates to the field of diamonds for ultra-precision cutting, in particular to a production method of a spontaneous heating single crystal diamond for an ultra-precision machining cutter, the cutter and an ultra-precision cutting method. The invention relates to a production method of a self-heating single crystal diamond for an ultra-precision machining cutter. The production method comprises the following steps: S1, providing a high-quality single crystal diamond with a crystal orientation inclination angle of 45-55 degrees as a seed crystal; s2, a hydrogen plasma atmosphere with the hydrogen flow being 500 + / -10 sccm is constructed, and carbon source gas, boron source gas, oxygen, nitrogen and argon are introduced; s3, continuously depositing on the surface of the seed crystal for at least 300 hours to obtain a deposited monocrystal diamond with the thickness of not less than 1.1 mm; and S4, carrying out heat treatment on the synthesized sedimentary-state single crystal diamond in a pure oxygen environment to obtain the single crystal diamond of which the resistivity is 0.8-2.0 omegam and which can automatically heat to 200-500 DEG C under the action of a Joule heat effect after variable current is introduced. By means of self-heating of the single crystal diamond, under the condition that an external thermal field is not needed, precise space confinement, quick response and fine regulation and control of a cutting micro-area thermal field can be achieved when the single crystal diamond is used for a cutter, and ultra-precise cutting machining of the optical-grade surface of a hard and brittle material can be conveniently achieved.

The invention relates to the field of ultra-precision optical grinding machines, and provides an ultra-precision small-caliber optical grinding machine integrated with a polishing function and a machining process of the ultra-precision small-caliber optical grinding machine. The small-caliber optical grinding machine achieves micron-order feeding and single-point grinding through multi-axis cooperative movement, meanwhile, due to the position distribution of a machine tool grinding wheel shaft, the high-speed grinding main shaft and the B-axis hydrostatic pressure rotary table, the torque of the B-axis hydrostatic pressure rotary table can meet the cutting torque formed by grinding force more easily, the precision stability of the machined surface type of an optical part is improved, and the machining precision of the optical part is improved. The problems that strong interference geometric components and thin-wall fragile parts are fragile in the rough grinding process and the polishing process is low in efficiency are solved. The workpiece static pressure main shaft clamps the bar through the clamp with the cavity inside, the workpiece can be cut off after machining, part of the remaining length of the bar in the clamp is pulled out to machine the next workpiece, the problem that a current ultra-precision machine tool cannot achieve small-batch machining through one-time clamping of the optical element bar is solved, and the machining precision and the machining efficiency are improved.

The utility model relates to the field of plastic mould, concretely is a movable precision level positioning plastic mould structure, including mould frame A board, mould frame B board, mould frame C board, the mould frame C board mould frame A board mould frame B board set up from top to bottom in array, still include the rear mould guide sleeve positioning spare for doing total positioning and be used for the front mould essence mounting plate of forming, the front mould essence mounting plate installs in the groove of mould frame A board, the mould frame A board groove is provided with the forming mould essence that coordinates the front mould essence mounting plate, the groove of mould frame A board is provided with the front Block frame ultra -precision positioning assembly that positions the front mould essence mounting plate. The utility model installs initial stage, and the front mould essence mounting plate is the clearance fixed state, in the mould closing process, through the front Block frame ultra -precision positioning assembly that the rear Block frame ultra -precision positioning assembly drives comes free correction positioning front mould essence mounting plate, avoided the forcible hard positioning of ordinary state. Reach free precision level positioning state.

This invention relates to a turbulence-assisted dynamic magnetic field magnetorheological polishing device and method, belonging to the field of precision and ultra-precision machining technology. The device includes a base plate, a reciprocating moving mechanism, a rotary drive system, a magnetic field adjustment system, a turbulence generating component, a fluid circulation system, and a pipe fixing component. The turbulence generating component is a spiral head fitted onto a cylindrical magnet. The reciprocating moving mechanism drives the cylindrical magnet in reciprocating linear motion, and the rotary drive system drives the cylindrical magnet to rotate, forming a dynamic magnetic field. When the spiral head rotates, it generates uniform turbulence within the flow channel of the pipe wall, simultaneously creating a localized necking inside the pipe, increasing the flow velocity and pressure of the magnetorheological fluid, and enhancing the impact energy of the abrasive particles on the wall surface. The fluid circulation system achieves closed-loop circulation and maintains the activity of the magnetorheological fluid. This invention achieves uniform distribution of the magnetorheological fluid through turbulence generated by the rotation of the spiral head, and forms a dynamic magnetic field through the combined reciprocating and rotary motion of the cylindrical magnet. The magnetic field parameters can be adjusted in real time according to the polishing process, effectively improving the efficiency and uniformity of polishing the inner wall of pipes. It is suitable for ultra-smooth polishing of the inner walls of various slender pipes and precision fluid pipes.

The invention provides an ultra-precision machining machine tool of a double-tool-rest oppositely-arranged roller mold and a machining method of the ultra-precision machining machine tool. The ultra-precision machining machine tool comprises a main shaft system, a double-tool-rest system, an intelligent quick-change platform and a control system. The two tool rest systems are located on the two sides of a workpiece and oppositely arranged at 180 degrees, self-balance of radial cutting force is achieved, and machining deformation of the roller with the large length-diameter ratio is effectively restrained. The intelligent quick change platform adopts zero point positioning, RFID identification and medium quick docking technologies to realize quick change and automatic parameter reconstruction of functional modules such as turning, fly cutting and measurement. Self-adaptive control over the posture of the cutter is achieved. The machining precision and efficiency of the large-size roller mold are effectively improved, and turning, milling and measuring integrated manufacturing of a complex microstructure is achieved.

This application provides a dynamic tool setting device and method for diamond micro-end milling cutters, relating to the field of precision and ultra-precision machining technology. The method includes the following steps: acquiring a time-series pulse sequence of time-division multiplexing images; and performing tool setting detection on the diamond micro-end milling cutter based on the time-series pulses. This application utilizes the diffraction interference imaging principle of diamond micro-end milling cutters under coaxial laser illumination, employing object-side telecentric vision imaging to ensure a fixed holographic image magnification and microscopic imaging accuracy. By setting the camera trigger acquisition pulse through an external trigger controller via a host computer, the rotating image of the diamond micro-end milling cutter is sampled in a time-division multiplexing manner, achieving full-contour holographic imaging of the diamond micro-end milling cutter under rotating conditions. Simultaneously, by designing a downsampling holographic autofocus algorithm in holographic image processing, the computational load for image holographic reconstruction is reduced, accelerating the tool setting calculation efficiency and providing high-precision tool setting technology support for ultra-precision micro-milling.

The invention relates to the technical field of bearing retainers, and particularly discloses a bearing retainer ultra-precision polishing machine which comprises a feeding unit, one end of the feeding unit is connected with a material carrying and rotating unit, and a vibration polishing groove, a magnetic polishing groove, a chemical polishing groove and a cleaning groove are sequentially formed in the periphery of the material carrying and rotating unit; the material loading rotating unit comprises a base and a stand column, a rotating table and a carrying plate which rotate synchronously are arranged at the upper end of the stand column, a plurality of material loading expansion shafts are evenly arranged on the carrying plate in the circumferential direction, and each material loading expansion shaft is connected with a telescopic driving part on the rotating table, so that the material loading expansion shafts are switched between the horizontal state and the vertical downward state. Through the design of the material loading rotating unit, a plurality of originally dispersed procedures such as vibration polishing, magnetic polishing, chemical polishing and cleaning are integrated in one device, and automatic circulation of workpieces among different stations is achieved; the problems of low automation degree, low production efficiency, large occupied area and the like of a traditional substation type operation mode are thoroughly solved.

The invention discloses a compensation turning machining method for a micro V-groove array structure in the technical field of ultra-precision turning. The compensation turning machining method comprises the steps that a V-shaped tool is designed and machined according to the two-dimensional theoretical contour line size of the micro V-groove array structure; a tool disc is designed according to error requirements, and the surface of the tool disc is turned; a workpiece to be machined is fixed to the turned tool disc, and surface rough machining is conducted; according to the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped cutter is adopted for conducting rough machining on the surface of a machining element; contour data of the micro-V-groove array structure on the surface of the to-be-machined workpiece are detected and obtained through a spectrum confocal displacement sensor; and on the basis of the contour data, compensation finish machining is conducted on the surface of the machined element, and compensation turning machining of the micro V-groove array structure is completed. According to the method, a feasible solution is provided for processing the submicron V-groove array, and the method has important theoretical significance and practical application value for processing the micro V-groove array structure.

The application discloses an ultra-precision air static pressure rotary table, which comprises a radial brass bearing sleeve, a table top, a base, a feedback grating system, an axial thrust, a gas distribution block and an air bearing core. The application has the advantages that: for the 300mm nominal disc diameter specification, the four core performance requirements of focusing low speed / low-medium speed operation, large load bearing, ultra-high structural rigidity and nanometer level rotation accuracy can be met, and the application can be widely applied to 300mm semiconductor wafer detection and calibration platforms, optical element ultra-precision grinding / polishing machine tools, diamond tool ultra-precision cutting rotary tables, large-size part high-precision measurement detection instruments, micro-nano manufacturing system rotary tables, aerospace precision component processing equipment and other national strategic high-end manufacturing equipment. The application is a core basic component for supporting modern ultra-precision machining, semiconductor detection, optical manufacturing and precision measurement industry to realize low-speed stable operation, heavy load support, high rigidity precision protection and nanometer level positioning.

The invention relates to the technical field of ultra-precision machining, in particular to an ultra-precision cutting machining surface roughness online measuring method and system. First, a machining process signal is read. Secondly, calculating the weight of the processing process signal; the processing process signals are weighted according to the weights, and the weighted processing process signals are fused to serve as first input data; the machining process signal is used as additional input data. Then, obtaining a first input result and an additional input result according to the first input data and the additional input data, and obtaining a first fusion result according to the first input result and the additional input result; thirdly, inputting a high-dimensional feature fusion branch according to the first fusion result and additionally extracted first high-dimensional feature information and additional high-dimensional feature information to obtain a second fusion result; and finally, obtaining a surface roughness measurement result. According to the method, surface roughness prediction of ultra-precision cutting machining is more accurate.

A multi-point milling path design method for the full surface feature structure of thin-walled spherical shell micro-components is disclosed, relating to the field of micro-component processing technology. This invention can meet the requirements of high-precision, stable, and controllable removal of full surface feature structures of thin-walled spherical shell micro-components under micro-scale constraints. Key technical points: The method includes spatially uniform distribution of feature structures, micro-structure processing sequence planning, and multi-point milling path generation. The thin-walled spherical shell micro-component to be processed is observed offline using an optical microscope to obtain the coordinates of feature points on the contour edge of the micro-component, and the diameter of the micro-component is obtained by fitting. Based on the secondary development platform of UG software, a micro-structure processing sequence planning method driven by the shortest processing path is established to complete the above-mentioned full surface micro-structure processing sequence planning of the micro-component. Based on the point set coordinates optimized by the spherical point set uniform distribution iterative algorithm and the processing sequence driven by the "shortest processing path," combined with the configuration characteristics of ultra-precision shape control machining equipment and the micro-structure processing requirements, the coordinates of several uniformly distributed point sets with the center of the micro-component as the origin are transformed into a machining coordinate system with the tool setting point as the origin, obtaining the original coordinates of the micro-structure point sets and the corresponding feature angles. This invention is used for full-surface milling of thin-walled spherical shell micro-components.

The embodiment of the invention provides a precision optimization distribution method and system for an ultra-precision grinding machine. The method comprises the steps that the topological relation between moving parts of a machine tool is determined; based on the topological relation, constructing a machine tool motion error model representing the motion error of the motion part; based on the machine tool motion error model, determining the influence of the motion error item of each motion axis of the machine tool on the element surface shape precision; based on the influence of the motion error term of each motion axis on the element surface shape precision and the motion error term, constructing a machine tool precision optimization distribution model; and distributing the precision of the machine tool based on the machine tool precision optimization distribution model and the element surface shape precision requirement of the machine tool. According to the method, the machine tool motion precision index meeting the element machining precision can be determined, and the development cost of the ultra-precision grinding machine tool is reduced.

The invention discloses a polishing solution as well as a preparation method and application thereof in silicon carbide wafer polishing, and belongs to the technical field of semiconductor material processing. The polishing solution comprises the following components in percentage by mass: 15%-30% of an abrasive, 2%-10% of an oxidizing agent, 0.01%-1% of a pH regulator and the balance of water, the grinding material comprises the following components in percentage by weight: 25%-35% of silicon dioxide particles with the particle size of 80-100 nm, 55%-65% of silicon dioxide particles with the particle size of 15-25 nm and 1%-10% of transition state particles. Through abrasive particle size distribution optimization and technological parameter cooperation, efficient and low-damage ultra-precision polishing is achieved, and the problems that in existing 8-inch or above 4H-SiC (0001) substrate CMP, MRR and surface quality are difficult to balance through a single-particle-size abrasive, multiple surface scratches exist, and sub-surface damage is deep are solved.