595 results about "Ultra precision" patented technology

The invention discloses a hard and brittle material ultra-precision turning damage monitoring method based on multi-sensor fusion, and relates to the technical field of precision / ultra-precision machining state monitoring, a multi-sensor signal acquisition device is built on an ultra-precision turning machine tool to capture different types of sensor signals generated in the turning process in real time; performing signal preprocessing operation of minimum entropy deconvolution filtering on the acquired sensor signal; feature extraction is carried out on the signals subjected to minimum entropy deconvolution filtering, and 95 time domain and frequency domain statistical features reflecting turning damage are extracted; by integrating data from different sensors, the precision and reliability of monitoring are remarkably improved, more comprehensive and more accurate information can be obtained by capturing and fusing acoustic characteristics, cutting force and mechanical vibration information in the machining process, so that the abrasion degree of a tool and the damage condition of a workpiece are judged more accurately, and the machining accuracy is improved. And false alarm and missing alarm can be reduced, and the monitoring reliability can be improved.

The invention provides a subsurface damage depth prediction and control method for ultra-precision grinding of a semiconductor wafer. The method comprises the following steps that the subsurface damage depth difference of ductile grinding and brittle grinding is analyzed; calculating the critical cutting depth of ductile-brittle transition; establishing the relationship between the subsurface damage depth and the normal force of a single abrasive particle; specifically, on the basis of the relation between the normal force of a single abrasive particle and the plastic radius of a plastic deformation area in ductile grinding and the median crack depth in brittle grinding, the relation between the subsurface damage depth of wafer grinding and the normal force of the single abrasive particle is obtained in combination with ductile-brittle transformation judgment conditions; establishing the relationship between the normal force of a single abrasive particle and the cutting depth of the abrasive particle; establishing the relationship between the abrasive particle cutting depth and the grinding process parameters; and establishing the relationship between the subsurface damage depth and the grinding process parameters. According to the method, the grinding process parameters are reversely solved based on the subsurface damage depth model, the grinding process can be formulated according to specific damage indexes, and the machining efficiency is improved on the basis of meeting the machining requirements.

The invention belongs to the technical field of hard and brittle crystal material micropore machining, and particularly relates to an ultra-precision micropore multi-energy field coupling machining method and system.The method comprises the steps that the laser pulse frequency and power are set according to the workpiece material type and the micropore depth-diameter ratio, and a laser focus is positioned at the inner hole bottom of a workpiece; a modified structure extending in the axial direction of a hole is formed by controlling matching of a light spot and a hole diameter and the movement track of the light spot, in the machining process, a plasma nozzle and laser coaxially move, a modified area is removed in real time, a heat affected zone and the hole shape taper are restrained, meanwhile, vibration is applied to a workpiece through an axial ultrasonic vibration device, and machining precision is improved. And chip discharge is promoted, and stress and crack generation are reduced. The problems of serious thermal damage, poor hole shape precision, low machining efficiency and high energy consumption in the micropore machining process in the prior art are solved, and high-quality and high-precision machining of the high-depth-diameter-ratio micropore of the hard and brittle transparent crystal material is achieved.

The invention relates to the technical field of turning machining, and discloses an ultra-precision turning machining control method and system and a storage medium. The method comprises the steps that a laser contourgraph detects geometric parameters and abrasion data of a turning tool, and a tool health degree index is calculated; performing error compensation based on the health degree index to obtain a feeding control parameter; cutting force signals are collected, and technological parameters are optimized through a multi-target genetic algorithm; arranging a temperature sensor array, and adjusting cooling control according to process parameters; and generating a track control point and performing interpolation processing to obtain a motion control sequence. According to the method, the problem that the machining precision is unstable due to the fact that the cutter state cannot be quantitatively evaluated in real time in traditional turning is solved, and the precision control capability and machining quality consistency of ultra-precision turning are improved.

The invention provides an epitaxial wafer edge morphology compensation type wafer double-sided polishing device and method, and belongs to the technical field of semiconductor wafer ultra-precision machining. The polishing main machine comprises an upper fixed disc, a lower fixed disc and a wafer driving mechanism; the pressure loading system is used for applying adjustable pressure to the fixed disc; the polishing solution supply system is used for conveying a flow-adjustable polishing solution to the processing interface; the central control unit is in communication connection with the two systems and executes edge morphology compensation control logic, specifically, the machining pressure is adjusted in a segmented mode, and the flow of the polishing solution and the pressure are subjected to coupling change. According to the method, the atomic level flatness of the wafer surface is ensured, the edge morphology is accurately controlled, the edge thickening of the epitaxial layer is perfectly counteracted, and the photoetching yield of high-end chip manufacturing is remarkably improved.

The invention discloses a high-precision multi-layer sliding shaft clamp based on a wedge-shaped guide rail structure, and relates to the field of micro-lens array manufacturing and other ultra-precision machining. The problem that in the ultra-precision machining process, when a machine tool is not provided with a guide rail in the vertical direction, centering cannot be efficiently achieved is solved, and the problems that in a traditional centering mode, operation is tedious, the installation and adjustment time is long, the production cost is high, and the machining efficiency is low are solved. A second-stage bottom plate relatively sliding in the ascending direction is arranged above a first-stage bottom plate, and a servo motor transmits power to a transmission mechanism to achieve horizontal linear motion of the second-stage bottom plate relative to the first-stage bottom plate; a third-level bottom plate which relatively slides in the ascending direction is arranged above the second-level bottom plate, a main shaft holding clamp which relatively slides in the direction perpendicular to the ascending direction is arranged above the third-level bottom plate, and the first-level bottom plate and the second-level bottom plate, the second-level bottom plate and the third-level bottom plate and the third-level bottom plate and the main shaft holding clamp are detachably connected through locking pieces. The device is used for achieving vertical centering work of the machine tool spindle.

The invention discloses ultra-precision laser processing equipment and method based on AI vision, and belongs to the technical field of laser processing. The ultra-precision laser processing equipment comprises a stabilizing plate, a first linear module is fixedly installed on the upper surface of the stabilizing plate, and a second linear module is fixedly installed on the upper surface of a movable block of the first linear module; a connecting cylinder is fixedly installed on the upper surface of a movable block of the second linear module, a workpiece bearing table is fixedly installed on the upper surface in the connecting cylinder, a pushing and clamping mechanism is installed in the connecting cylinder, third linear modules are fixedly installed at the two ends of the upper surface of the stabilizing plate, and a connecting ring is fixedly installed between movable blocks of the two third linear modules. And a cutting angle regulation and control mechanism is rotationally mounted in the connecting ring. Through the design of the cutting angle regulation and control mechanism, the incident angle of laser can be automatically regulated and controlled through the camera in the workpiece machining process, and the diversified machining requirements of workpieces with complex curved surfaces and irregular shapes are met.

The invention relates to the technical field of precision and ultra-precision machining, and discloses a CO2 full-laser machining device and method for a fused quartz micro convex lens array. The three-axis motion platform is arranged on the supporting platform; the pulse CO2 laser is used for generating a processing laser beam; the light beam transmission system sequentially comprises a light beam combining module, a light beam adjusting module, a light splitting module, a light beam guiding module, a scanning galvanometer and a focusing field lens along a laser beam path; the main light beam is guided to the scanning galvanometer through the light beam guiding module and is emitted to a fused quartz workpiece after being focused through the focusing field lens; the contour detection unit is used for taking morphology data of the micro-lens array in situ; the temperature monitoring unit is used for measuring the temperature of the processing area; the control unit is connected with the three-axis motion platform, the contour detection unit, the temperature monitoring unit and the pulse CO2 laser, and is used for adjusting the laser power and the displacement of the three-axis motion platform according to detection data; the device has the characteristics of high efficiency, high precision, non-contact processing and small heat influence.

The invention belongs to the technical field of advanced manufacturing, and particularly relates to a microtexture functional curved surface machining method based on a structured grinding tool, which comprises the following steps of: determining an artificial joint type and an artificial joint surface microtexture array form; a grinding wheel is selected according to the microtexture array form; the grinding wheel is provided with an upper convex part and a lower concave part; mounting the artificial joint and the grinding wheel on a five-axis numerical control ultra-precision machine tool; setting a moving track of a grinding wheel according to the artificial joint type; and polishing the surface of the artificial joint to form a micro-texture array. The micro-texture array is machined on the surface of the artificial joint in a structured grinding mode, and the method has the advantages of being high in machining efficiency, good in process continuity, low in cost and the like, and is wide in applicability and high in flexibility.

The invention discloses a free-form surface flexible polishing self-adaptive control method and device, and belongs to the technical field of ultra-precision four-axis polishing machine tool machining. According to the method, a high-efficiency closed-loop control system is constructed on the basis of a flexible head removal principle in combination with an automatic control technology and a pressure sensing technology, fine online capture of down pressure changes and self-adaptive adjustment of polishing parameters in the polishing process can be achieved, the limitation of the prior art is effectively overcome, and the intelligent level of the process is improved. Comprising a flexible polishing head and a downward pressure on-line detection device. The actual machining condition of the current position is analyzed by collecting downward pressure generated by deformation of the flexible polishing head in the polishing process, and technological parameters are automatically adjusted. The invention provides a more efficient and accurate free-form surface flexible polishing scheme, the machining time can be remarkably shortened, the labor intensity of technicians is relieved, and meanwhile, the machining precision is guaranteed and improved. The device has the advantages of simple structure, convenience in disassembly and assembly, high precision and the like.

The invention relates to the technical field of laser cutting, in particular to an ultra-precision laser cutting path optimization method and system.The method comprises the steps that a CAD model of a mechanical part is obtained, contour information of the mechanical part is extracted, the contour is discretized into a series of nodes, and technological parameters of laser cutting and motion constraint conditions of cutting equipment are determined; a laser cutting path is obtained according to the extracted contour information, nodes in the cutting path are coded into chromosomes in sequence, and each chromosome represents a cutting path scheme; designing a fitness function to evaluate each chromosome to obtain a fitness value of each chromosome; and performing genetic manipulation and iterative optimization on each chromosome according to the fitness value until a termination condition is met, obtaining the chromosome with the highest fitness, and decoding the chromosome into an optimized ultra-precision laser cutting path. According to the method, the genetic algorithm and the fitness function are planned and designed for the ultra-precision laser cutting path, global optimization of the cutting path is achieved, and the cutting efficiency and quality are improved.

The invention discloses a nanoscale high-precision positioning method based on a multi-degree-of-freedom motion workbench, and relates to the field of large-stroke and high-precision positioning, and the method comprises the steps: S1, initializing the motion workbench, and guaranteeing that a system is in a zero position state; s2, sending a target position instruction by the upper computer, and driving the macro moving platform to quickly move to a position near a target; s3, acquiring the current position, calculating the deviation from the target position according to the target displacement and the current actual feedback displacement value, and generating micropositioner control parameters; s4, a control instruction is generated, and nanoscale displacement compensation is executed; and S5, iteratively correcting the displacement of the micropositioner until the deviation fed back by the laser interferometer meets the requirement. According to the invention, the positioning precision of large-stroke (hundred millimeters) movement is improved to a nanometer level, the device is suitable for the fields of photoetching machines, ultra-precision machining, biological micromanipulation and the like, and the equipment performance and the process level are improved. In addition, the system adopts a modular design, can adapt to different driving and sensing units according to requirements, and has strong expansibility.

The invention relates to the technical field of ultra-precision machining, in particular to an automatic tool changing device and method for a hydrostatic spindle. The tool changing device comprises a tool changing frame, a plurality of locking assemblies and a plurality of screw adjusting assemblies, the tool changing frame is provided with a plurality of tool changing stations, the locking assemblies and the tool changing stations are arranged on the tool changing frame in a one-to-one correspondence mode, the screw adjusting assemblies are arranged on the tool changing frame, and the positions of the screw adjusting assemblies and the positions of the locking assemblies are in one-to-one correspondence. The screw adjusting assembly is used for adjusting an adjusting screw of the liquid expansion clamp. The locking assembly is arranged on the tool changing frame to lock the tool, the adjusting screw of the liquid expansion clamp is adjusted through the screw adjusting assembly so that the liquid expansion clamp can be in a clamping state or a loosening state, and the locking assembly, the screw adjusting assembly and the liquid expansion clamp are matched to achieve automatic tool changing. The whole process does not need human participation, the working efficiency is improved, the risk in the process of manually replacing the cutter is avoided, and the safety is improved.

The invention discloses an ultra-precision optical centering lathe, and relates to the technical field of high-end lens machining. The ultra-precision optical centering lathe comprises a support, a lathe body, a stand column, a rotary table, an upper light pipe assembly, a lower light pipe assembly and a sliding table assembly, the lathe body is arranged on the support, the lower end of the stand column is arranged on the lathe body, the rotary table is installed on the lathe body and suitable for fixing a mirror set to be machined, and the upper light pipe assembly is arranged on the stand column. The upper light pipe assembly is used for calibrating the optical axis of the upper surface of the lens set, the lower light pipe assembly is arranged on the support and used for calibrating the optical axis of the lower surface of the lens set, the sliding table assembly is arranged on the stand column, a four-station tool turret is installed on the sliding table assembly, an optical confocal system is arranged in a first station on the four-station tool turret, and the optical confocal system is arranged in a second station on the four-station tool turret. An automatic measuring system is arranged in a second station on the four-station tool turret, an outer circle turning tool is arranged in a third station on the four-station tool turret, and an inner circle turning tool is arranged in a fourth station on the four-station tool turret.

The invention relates to the technical field of ultra-precision intelligent manufacturing, in particular to an ultra-precision machining error compensation method based on multi-modal information fusion, a medium and equipment. The method comprises the following steps: acquiring three-dimensional shape data of a workpiece through an in-situ measurement device, synchronously acquiring temperature field and vibration data, constructing a multi-modal space-time tensor, inputting a physical information neural network to decouple a static geometric error, a time-varying thermal drift error and a dynamic vibration error, and generating a four-dimensional correction tool path to realize reverse compensation. According to the method, physical constraints are embedded through a PINN model, the problem of false thermal drift misjudgment in a traditional method is solved, experiments show that the RMS error of free-form surface machining is reduced to 5 nm or below, and the precision is improved by 70% or above; and meanwhile, error decoupling is endowed with physical interpretability, the small sample generalization ability is enhanced, and a technical basis is provided for process optimization.

The invention belongs to the technical field of ultra-precision machining, and discloses a micro-fluidic chip based on the electroosmosis effect and a stress regulation and control method thereof.The micro-fluidic chip is internally provided with a plurality of solution channels, each solution channel is of a snakelike reciprocating structure, one end of each solution channel is provided with a channel inlet, and the other end of each solution channel is provided with a channel outlet; a plurality of inflection points arranged at intervals are arranged on one side, facing the bottom of the micro-fluidic chip, of the solution channel, the inflection points are close to the bottom of the micro-fluidic chip and are distributed on the micro-fluidic chip in the horizontal direction, and an electrode is further arranged on the solution channel. The electroosmosis effect and the microfluidic technology are combined, high-precision dynamic stress regulation and control are achieved through gradient flow channel design, a composite driving liquid formula and a hysteresis compensation algorithm, and the problems that pressure control response is delayed and precision is insufficient in a traditional polishing technology are solved; and a new technical approach is provided for ultra-precision machining of the large-aperture optical element for the inertial confinement nuclear fusion device.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The invention provides a three-axis three-phase variable-speed ultraprecise microsphere grinding and polishing device and a grinding and polishing method, and belongs to the technical field of high-precision spherical part machining. By adjusting three sets of servo grinding head assemblies, output shafts (a first shaft, a second shaft and a third shaft) of the three sets of servo grinding head assemblies intersect at the sphere center of a machined sphere; the alignment precision of the three servo grinding head assemblies relative to the center of the ultra-precision microsphere is improved; meanwhile, output shafts of the three servo grinding head assemblies are controlled to rotate at a variable speed according to the sine rule, it is guaranteed that the motion trails formed by the three servo grinding head assemblies are evenly distributed on the surface of the machined ball and can completely wrap the surface of the machined ball, and sliding of the ultra-precise microspheres in the machining process is avoided; and the stability in the ultra-precision microsphere processing process can be ensured.

The invention discloses a micro-structure ultra-precision cutting method, and relates to the technical field of ultra-precision machining. Comprising the following steps that a contour error pre-compensation model is constructed based on an overall transfer function of a tool servo system, and the tool servo system comprises a fast tool servo system and a slow tool servo system; based on a frequency decomposition method, decomposing a processing track obtained by the contour error pre-compensation model to obtain a high-frequency small-amplitude track and a low-frequency large-amplitude track; and the high-frequency small-amplitude track is sent to a fast tool servo system, and the low-frequency large-amplitude track is sent to a slow tool servo system for cutting machining. According to the method, the requirement for machining precision can be met while the machining efficiency of the complex curved surface microstructure is guaranteed.

The invention belongs to the related field of ultra-precision polishing technology, and discloses an ultrasound-piezoelectricity-photocatalysis assisted chemical mechanical polishing method which comprises the following steps: mixing a basic polishing abrasive, a piezoelectric material and a photocatalyst, calcining and grinding, and processing to obtain a modified abrasive; preparing a polishing solution containing a piezoelectric catalysis carrier and a photocatalysis carrier at the same time; the polishing process is completed through a chain of mechanical stress, a piezoelectric electric field, efficient carrier separation and more active species participating in reaction. The invention further discloses a matched polishing device. Compared with the prior art, the method has the advantages that the material removal rate can be effectively increased, the polishing time can be effectively shortened, the surface quality can be further improved, the subsurface damage can be reduced, in addition, a more environment-friendly polishing solution can be used, the waste liquid treatment cost is reduced, the environment is protected, and the method is suitable for industrial production. Therefore, the polishing device is especially suitable for various high-hardness materials to realize the polishing application occasions of low-damage and ultra-smooth surfaces of the high-hardness materials.

The application relates to the technical field of ultra-precision machining, and discloses a free curved surface envelope machining track planning method and system based on an arbitrary curved section tool, which comprises the following steps: step 1, judging the concave-convex property of discrete points of a tool section curve, retaining convex envelope points, discarding concave envelope points, obtaining a set of all convex envelope points of the tool section curve, and defining the set as a full-convex envelope contour matrix of the tool section curve; step 2, calculating a new tool section curve convex envelope interpolation contour, and calculating a new tool section curve according to the new tool section curve convex envelope interpolation contour; and step 3, obtaining a tool curved surface point cloud according to the new tool section curve in step 2, and planning a free curved surface workpiece envelope machining track based on the tool curved surface point cloud.

The invention discloses a hemispherical harmonic oscillator in-situ thickness measuring device and method based on multipoint spectral confocal. The device comprises a workpiece rotating shaft, a workpiece moving shaft, a workpiece clamp, an axial measurement window, a radial measurement window, a multi-point spectrum confocal sensing probe, a probe bracket, a probe rotating shaft and a probe moving shaft. According to the invention, lossless and in-situ measurement is carried out on thickness data. According to the method, a thickness measurement path is designed and planned, a spectral confocal sensor is driven to move in different areas of the thin wall of the hemispherical resonator to cover more measurable positions, a theoretical mathematical model based on multi-point distance measurement is established, and the inclination angle is obtained through multi-point fitting calculation to compensate the thickness measurement result of the thin wall of the hemispherical resonator. And extracting section thickness data based on a hemispherical resonator thin-wall thickness uniformity calculation method of NURBS internal and external fitting, and calculating thickness distribution in the circumferential direction of a rotary body. The method is suitable for nondestructive testing of the ultra-precision manufacturing process with strict requirements on the quality of finished products. The method is suitable for the ultra-precision manufacturing process of the thin wall of the hemispherical harmonic oscillator, errors are compensated through on-line measurement in a machine, and the machining efficiency and the finished product quality are improved.

The invention provides a double-light-path refraction measurement type precision leveling machining platform and a working method thereof, and belongs to the technical field of ultra-precision plane machining equipment. The problems that existing plane machining is low in machining precision and efficiency are solved. The device comprises a supporting table, a machining device, a limiting assembly, a positioning assembly and a leveling assembly, a to-be-machined workpiece is placed on the machining device, and the limiting assembly can prevent the to-be-machined workpiece from rotating; the positioning assembly comprises a first laser transmitter, a first photosensitive position sensor, a second laser transmitter, a second photosensitive position sensor and a double-sided transmitting mirror, the positioning assembly can detect whether a to-be-machined workpiece is horizontal or not, and the leveling assembly can adjust the inclination angle between the to-be-machined workpiece and the horizontal plane. According to the machining platform, plane machining can be conducted on the workpiece to be machined, meanwhile, whether the workpiece to be machined is horizontal or not is detected, the workpiece to be machined is leveled, real-time monitoring and correction are achieved, and the machining precision and the machining efficiency can be improved.

The present invention relates to a combined process of ultra-precision grinding and photochemical mechanical polishing of laser crystal slices. The process comprises the following steps: using a coarse-grained grinding wheel for rough grinding to achieve rapid thinning and determine the depth of the subsurface damage layer, providing a reference for the grinding wheel feed rate in the fine grinding stage; using a fine-grained grinding wheel for fine grinding to remove the damage layer introduced in the rough grinding stage, and obtaining higher surface / subsurface quality and surface accuracy by optimizing process parameters; using aluminum oxide (Al2O3) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing semi-fine polishing on the laser crystal slices to quickly remove the surface damage caused in the grinding stage; using zirconium oxide (ZrO2) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing fine polishing on the laser crystal slices to further optimize the surface quality and surface accuracy; and using an ultrasonic cleaner to clean the laser crystal slices, with anhydrous ethanol as the cleaning agent. The present invention can simultaneously achieve high surface integrity and high-efficiency processing of laser crystal slices.

The invention provides a surface roughness prediction and control method for ultra-precision grinding of a semiconductor wafer. The method comprises the following steps: step 1, calculating to obtain a relation model between abrasive particle cutting depth and grinding process parameters when a grinding wheel grinds a wafer; 2, calculating the critical cutting depth of ductile-brittle transition; 3, calculating the cross sectional area of the wafer cut by the abrasive particles; step 4, calculating a key coefficient of the abrasive particle protrusion height distribution function; 5, calculating the influence of the elastic recovery characteristic of the wafer; step 6, calculating an elastic recovery coefficient of the wafer; and step 7, establishing a surface roughness model considering elastic recovery. According to the method, mechanical properties and elastic recovery characteristics of different materials are considered, and the method has universality. According to the method, the grinding process parameters are reversely solved based on the surface roughness model, the grinding process can be formulated according to the specific surface roughness index, and the machining efficiency is improved on the basis of meeting the machining requirement.

The invention relates to the technical field of optical lens machining, in particular to an ultra-precision laser cutting, grinding and polishing integrated machining method and system for an AI silicon carbide lens. The machining system comprises a laser cutting machine, a cutting table is arranged on the laser cutting machine, and a grinding machine box is arranged on one side of the laser cutting machine; a polishing machine box is arranged on one side of the polishing machine box, supporting plates are fixedly installed between the cutting table and the polishing machine box and between the polishing machine box and the polishing machine box, multi-degree-of-freedom mechanical arms are arranged on the supporting plates, and vacuum suction cups are arranged at the free ends of the multi-degree-of-freedom mechanical arms; jacking dust collection assemblies are arranged in the grinding machine box and the polishing machine box correspondingly, supporting frames are fixedly installed on the top faces of the grinding machine box and the polishing machine box, a left driving motor and a right driving motor which are mutually symmetrical are fixedly installed on a top plate body of each supporting frame, and grinding wheels are detachably installed at the tail ends of output shafts of the driving motors. Integrated machining operation can be achieved, and the machining efficiency can be improved.

The invention discloses a design method for crystal face layout and grinding direction of a diamond biological slicing cutter, and relates to the technical field of ultra-precision machining. The method comprises the following steps of: representing the geometric shape of a cutter by adopting a surface patch, respectively taking three crystal orientations (100), (010) and (001) of a monocrystal diamond crystal as an x axis, a y axis and a z axis, and describing a geometric model of the cutter by giving spatial positions of important nodes; setting a characteristic space, and considering deflection angles of a cutter relative to three crystal orientations of the single crystal diamond and grinding angles on front and rear cutting surfaces; setting three optimization targets of machining efficiency, blade use strength and blade straightness; and executing a genetic algorithm to iteratively output a feasible cutter sharpening scheme. A feasible crystal face layout and a grinding direction are tested based on an NSGA-II multi-target genetic algorithm, a surface patch is adopted to represent the geometrical shape of a tool, three optimization targets of machining efficiency, cutting edge strength and cutting edge straightness are comprehensively considered, and an optimal layout scheme is obtained through screening iteration.

The invention discloses an ultra-precision polishing method for a thermoelectric material. The ultra-precision polishing method comprises the steps that S1, mechanical grinding and rough polishing are conducted on a thermoelectric material block through abrasive paper; wherein the abrasive paper sequentially uses metallographic abrasive paper with the abrasive particle mesh number from small to large; s2, diamond polishing paste or polishing liquid, CeO2 polishing liquid and Al2O3 polishing paste or polishing liquid are used as grinding materials, and mechanical polishing and fine polishing are carried out on the thermoelectric material block after mechanical grinding and rough polishing on a polishing machine; and S3, an alkaline SiO2 polishing solution or a water-based diamond polishing solution is used as a polishing medium, the thermoelectric material block subjected to mechanical polishing is subjected to repeated fine polishing and mechanochemical polishing on a polishing machine, and the thermoelectric material subjected to ultra-precision polishing is obtained. The surface roughness of the thermoelectric material obtained by the method does not exceed 1nm.

The invention relates to a flexible polishing method for RB-SiC composite material photoelectric selective catalysis, and belongs to the field of ultra-precision machining.The method comprises the steps that an RB-SiC composite material workpiece is fixed to a clamp, then the workpiece clamp is connected to the positive electrode of a power source, and the RB-SiC composite material is polished; a polishing solution supply pipe mixed with light, electro-catalysis particles, an oxidizing agent and polishing abrasive particles is connected to the negative electrode, voltage is applied to the workpiece, the polishing solution is sprayed to the surface of the workpiece, and a closed loop is formed; ultraviolet light is used for fully irradiating the position where the polishing solution is sprayed on the surface of the workpiece; and finally, a flexible polishing tool rotating at a high speed is adopted, different phases of the RB-SiC composite material workpiece are selectively removed by adjusting the ultraviolet light intensity and the voltage, and multi-phase consistency machining of the RB-SiC composite material workpiece is achieved. The initial performance difference between the two phases is greatly weakened, high-efficiency and high-precision surface polishing is achieved, and the problems of surface scratches, subsurface damage and the like are avoided.

The invention relates to the field of ultra-precision machine tools, and provides an ultra-precision double-drive high-acceleration hydrostatic guide rail device. The ultra-precise double-drive high-acceleration hydrostatic guide rail device comprises a guide rail base, a guide rail assembly and a guide rail movement assembly, the guide rail assembly comprises at least two guide rails and at least one side guide rail, the at least two guide rails are arranged on the upper portion of the guide rail base in the width direction of the guide rail base at intervals, and one side guide rail is arranged between every two adjacent guide rails. According to the hydrostatic pressure guide rail device, the supporting oil cavity is formed in the bottom of the slide carriage, and the auxiliary oil cavity is formed in the side, close to the guide rail, of the top of the hydrostatic pressure sliding block, so that the position of the supporting oil cavity surface is lifted; due to the fact that the hydrostatic pressure sliding block and the sliding block heightening column are located below the supporting oil cavity face, the overall gravity center of the guide rail movement assembly moves downwards and is coplanar with the supporting oil cavity face, the influence of upsetting moment on the thickness of a supporting oil film is reduced, and the accuracy of the hydrostatic pressure guide rail device is improved.