Method for preparing ultra-fine diamond grinding wheel of vitrified bond

Abstract

The invention discloses a method for preparing an ultra-fine diamond grinding wheel of a vitrified bond, belongs to the technical field of ultra-precision machining of hard brittle and soft brittle photoelectric crystals, and in particular relates to the method for preparing an ultra-fine diamond grinding wheel of photoelectric semiconductor hard brittle and soft brittle photoelectric crystals. The method is characterized by comprising the following steps of: taking ultra-fine diamond powder which has a particle size of a fixed valve from #10,000 to #300,000 as an ultra-fine diamond grinding material; taking three or four ultra-fine non-oxide ceramics as bonding agents, taking one or two of chlorides or nitrates of potassium, calcium, sodium and magnesium as a dispersant and a refiner; taking one or two of dextrine, carbonates and hydrocarbonates as a foaming agent; pressing and molding by a cold-press molding method; uniformly heating to the temperature of between 480 and 530 DEG C from a room temperature; keeping the temperature for 30 to 60 minutes; uniformly heating to the temperature of between 580 and 610 DEG C; keeping the temperature for 40 to 60 minutes; uniformly heating to the temperature of between 640 and 680 DEG C; keeping the temperature for 100 to 150 minutes; and naturally cooling to the room temperature so as to sinter and mold the ultra-fine diamond grinding wheel. The method has the effects and the advantages of high-efficiency ultra-smooth low-damage grinding and high-efficiency ultra-precision grinding machining effect.

Description

technical field

[0001] The invention belongs to the technical field of ultra-precision processing of hard and brittle and soft and brittle photoelectric crystals, in particular to a method for preparing an ultrafine diamond grinding wheel for photoelectric semiconductor hard and brittle and soft and brittle photoelectric crystals. Background technique

[0002] With the rapid development of IC chip technology, the semiconductor industry has higher and higher requirements for the flatness, surface quality and integrity of silicon wafers. Because of its unique advantages, it is widely used in the field of ultra-precision grinding of silicon wafers. However, the currently used resin bonded diamond grinding wheel, due to the weak bonding force of the resin bond, the particle size of the grinding wheel is generally lower than #5000, which makes the surface roughness that the resin bonded grinding wheel can achieve generally Ra is generally several nanometer, and the depth of the ...