Method for preparing ultra-fine diamond grinding wheel of vitrified bond

A technology of vitrified bond and diamond grinding wheel, which is applied in the field of preparation of ultra-fine diamond grinding wheel, can solve the problems of high processing time and cost, large depth of sub-surface damage layer, high surface roughness value, etc., to achieve increased porosity, high efficiency ultra-fine The effect of precision grinding and the effect of overcoming thermal burn phenomenon

Inactive Publication Date: 2010-10-27
DALIAN UNIV OF TECH
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Problems solved by technology

[0003] The purpose of this invention is to provide a vitrified bond superfine diamond grinding wheel preparation method, using the method of composite vitrified bond and superfine diamond abrasive, and utilizing the method of dispersant, refiner and foaming agent to improve vitrified bond superfine The porosity of the fine diamond grinding w

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Embodiment Construction

[0012] The specific implementation manner of the present invention will be described in detail below in conjunction with the technical solutions.

[0013] Adopt #12000 ultra-fine diamond abrasive, the corresponding particle average diameter is 900 nanometers, as the abrasive material of ultra-fine diamond grinding wheel. At the same time, #15000 silicon carbide, silicon oxide, cerium oxide, and aluminum oxide are used as the raw materials of the vitrified bond, and the corresponding particle average diameter is about 700 nanometers. The silicon oxide is prepared as silica sol, and the volume percentage is 50%. Silicon carbide, silicon oxide sol, cerium oxide, and aluminum oxide are uniformly mixed by volume ratio of 30:30:20:20 by means of mechanical stirring to prepare vitrified bond. Sodium chloride and magnesium chloride are used as refiner and dispersant, the volume ratio of sodium chloride and magnesium chloride is 1:1, and the method of mechanical stirring is used to mi...

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Abstract

The invention discloses a method for preparing an ultra-fine diamond grinding wheel of a vitrified bond, belongs to the technical field of ultra-precision machining of hard brittle and soft brittle photoelectric crystals, and in particular relates to the method for preparing an ultra-fine diamond grinding wheel of photoelectric semiconductor hard brittle and soft brittle photoelectric crystals. The method is characterized by comprising the following steps of: taking ultra-fine diamond powder which has a particle size of a fixed valve from #10,000 to #300,000 as an ultra-fine diamond grinding material; taking three or four ultra-fine non-oxide ceramics as bonding agents, taking one or two of chlorides or nitrates of potassium, calcium, sodium and magnesium as a dispersant and a refiner; taking one or two of dextrine, carbonates and hydrocarbonates as a foaming agent; pressing and molding by a cold-press molding method; uniformly heating to the temperature of between 480 and 530 DEG C from a room temperature; keeping the temperature for 30 to 60 minutes; uniformly heating to the temperature of between 580 and 610 DEG C; keeping the temperature for 40 to 60 minutes; uniformly heating to the temperature of between 640 and 680 DEG C; keeping the temperature for 100 to 150 minutes; and naturally cooling to the room temperature so as to sinter and mold the ultra-fine diamond grinding wheel. The method has the effects and the advantages of high-efficiency ultra-smooth low-damage grinding and high-efficiency ultra-precision grinding machining effect.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of hard and brittle and soft and brittle photoelectric crystals, in particular to a method for preparing an ultrafine diamond grinding wheel for photoelectric semiconductor hard and brittle and soft and brittle photoelectric crystals. Background technique [0002] With the rapid development of IC chip technology, the semiconductor industry has higher and higher requirements for the flatness, surface quality and integrity of silicon wafers. Because of its unique advantages, it is widely used in the field of ultra-precision grinding of silicon wafers. However, the currently used resin bonded diamond grinding wheel, due to the weak bonding force of the resin bond, the particle size of the grinding wheel is generally lower than #5000, which makes the surface roughness that the resin bonded grinding wheel can achieve generally Ra is generally several nanometer, and the depth of the ...

Claims

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Application Information

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IPC IPC(8): B24D3/14B24D18/00
Inventor 张振宇赵洪浩霍凤伟郭东明
Owner DALIAN UNIV OF TECH
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