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High-purity nano diamond polishing liquid and preparing method thereof

A nano-diamond and polishing liquid technology, which is applied in chemical instruments and methods, polishing compositions containing abrasives, and other chemical processes, can solve problems such as surface damage and abrasive agglomeration, and achieve good polishing effect and good dispersion stability Effect

Inactive Publication Date: 2007-09-12
CHINA UNIV OF GEOSCIENCES (WUHAN)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the polishing liquid settles or the abrasives agglomerate during the polishing process, it will cause great harm to the polished surface

Method used

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  • High-purity nano diamond polishing liquid and preparing method thereof
  • High-purity nano diamond polishing liquid and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A preparation method of high-purity nano-diamond polishing liquid, it comprises the steps:

[0038] 1) According to the percentage by weight of each raw material: nano-diamond: 0.05%, wetting agent: 0.01%, surface modifier: 1%, dispersant: 0.1%, chemical additive: 0.2%, water: 98.64%, select Nano-diamond, wetting agent, surface modifier, dispersant, chemical additive and water raw materials are for use; Note: Wetting agent, surface modifier, dispersant and chemical additive refer to solid content respectively.

[0039]The purity of described nano-diamond is 99.9%, and particle size distribution is 10nm; Described wetting agent is stearic acid and tartaric acid, and stearic acid, tartaric acid account for 0.005% by weight each; Described surface modification The active agent is sodium dodecylsulfonate and sodium lauryl sulfate, and the weight percentages of sodium dodecylsulfonate and sodium lauryl sulfate each account for 0.5%; the dispersants are: DisperByk190 and RF5...

Embodiment 2

[0045] A preparation method of high-purity nano-diamond polishing liquid, it comprises the steps:

[0046] 1) According to the percentage by weight of each raw material: nano-diamond: 1%, wetting agent: 0.5%, surface modifier: 1%, dispersant: 0.2%, chemical additive: 0.2%, water: 97.1%, each Select nano-diamond, wetting agent, surface modifier, dispersant, chemical additive and water raw materials for later use; Note: wetting agent, surface modifier, dispersant and chemical additive refer to the solid content respectively.

[0047] The purity of the nano-diamond is 99.9%, and the particle size is 100nm; the wetting agent is citric acid; the surface modifier is sodium hexametaphosphate; the dispersant is sodium ethyl cellulose; The chemical additive is fatty alcohol polyoxyethylene ether.

[0048] 2) Take the wetting agent solution containing the above-mentioned wetting agent solid content weight and add it to the diamond micropowder, stir, and ultrasonicate for 10 minutes to ...

Embodiment 3

[0053] A preparation method of high-purity nano-diamond polishing liquid, it comprises the steps:

[0054] 1) According to the percentage by weight of each raw material: nano-diamond: 1%, wetting agent: 0.05%, surface modifier: 1%, dispersant: 0.1%, chemical additive: 0.2%, water: 97.65%, select Nano-diamond, wetting agent, surface modifier, dispersant, chemical additive and water raw materials are used for standby; Note: Wetting agent, surface modifier, dispersant and chemical additive refer to solid content respectively.

[0055] The purity of the nano-diamond is 99.9%, and the particle size is 125nm; the wetting agent is oxalic acid; the dispersant is Disperse750W; the surface modifier is sodium silicate and 1,4 butanediol, silicic acid Sodium and 1,4 butanediol account for 0.5% and 0.5% respectively by weight; the chemical additive is nonylphenol polyoxyethylene ether.

[0056] 2) Take the wetting agent solution containing the solid content of the above wetting agent and ...

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Abstract

The invention relates to a kind of high purity nano-scale diamond polishing slurry for ultra-precision processing and its preparation. The high-purity polishing slurry is prepared with nano-scale diamond, wetting agent, surface modification agent, dispersing agent, chemical additives and water, and the percentage of the raw materials by weight share are as follow: 0.05~10% of the nano-scale diamond, 0.01~2% of the wetting agent, 1~5% of the surface modification agent, 0.1~10% of the dispersing agent, 0.2~1% of the chemical additives, 88.69~98.64% of water. The amounts of all the materials are weighted as 100%. The amounts of the described wetting agent, surface modification agent, dispersing agent, and chemical additives are referred to solid content. The purity of the nano-scale diamond is 99.9% and the particle size of distribution is 10~200 nm.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision grinding and polishing, and in particular relates to a high-purity nano-diamond polishing fluid for ultra-precision machining and a preparation method of the diamond polishing fluid. Background technique [0002] With the development of micro-sodium technology, the processing of devices is developing towards ultra-precision processing, which puts forward higher requirements for precision grinding and polishing technology. Microelectronics technology develops at a rate of quadrupling the integration level of chips every three years, and shrinking the feature size by 1 / 3. At present, the feature line width of chips is 0.125 μm, and it is expected to reach 0.05 μm by 2010. Computer hard disks are developing rapidly in size and storage capacity, while the flight control accuracy of hard disk heads is constantly improving. In 2002, the flight height has dropped to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
CPCC09G1/02C09K3/1463
Inventor 侯书恩靳洪允潘勇杨晓光赵新颖
Owner CHINA UNIV OF GEOSCIENCES (WUHAN)
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