The application discloses a method for recovering
abrasive grains and base solvents in
silicon carbide wafer multi-
wire cutting mortar, which comprises the following steps: S1, cleaning a
solid part A to remove residual oily substances and
metal contaminants, and obtaining a
solid part B; S2, adding a dispersant solution to the
solid part B for
ultrasonic dispersion treatment; S3, naturally
settling the treated solid part B to remove suspended liquid, and obtaining primary
diamond micro
powder; and S4, treating the primary
diamond micro
powder with SC-1 (NH4OH (28%): H2O2 (30%): DIW=1:1:5) and ultrasonic
waves to remove residual organic substances and extremely
fine powder particles. The
silicon carbide agglomerates are dis-agglomerated by the dispersant, the
powder dispersibility is improved, and the
silicon carbide powder can be completely separated out. The fine particles and organic substances adhered to the surface of the
diamond are better treated clean by using the SC-1 solution and ultrasonic
waves. The recovered diamond micro powder has a more round
diamond crystal type, and is not easy to scratch during subsequent repeated use.