635results about How to "Increase thermal resistance" patented technology

A CVD reactor, such as a MOCVD reactor conducting metalorganic chemical vapor deposition of epitaxial layers, is provided. The CVD or MOCVD reactor generally comprises a flow flange assembly, adjustable proportional flow injector assembly, a chamber assembly, and a multi-segment center rotation shaft. The reactor provides a novel geometry to specific components that function to reduce the gas usage while also improving the performance of the deposition.

The surface of a phosphor is coated with a coating member made of a material different from the phosphor in chemical vapor-phase reaction. The coating member is made of any of metal oxide, metal nitride and metal oxynitride. The coating member coats the surface of the phosphor whereby having a substantially smooth film, or is formed such that a large number of fine particles relatively smaller than the phosphor aggregate to coat the whole surface of the phosphor. The coating member contains at least one metallic element selected from the group consisting of Al, Si, and rare earth elements. In addition, the phosphor is a transparent water-soluble phosphor and is an alkaline-earth silicon-nitride phosphor, an alkaline-earth silicon oxynitride phosphor, or the like. The BET value of the coated phosphor is 1.0 to 10 times the BET value before coating. The average thickness of the coating is 10 nm to 500 nm.

A circuit package assembly is disclosed. The assembly includes a conductive substrate; a high-side n-channel metal oxide semiconductor field effect transistor (NMOSFET) having a source on a side facing a surface of the conductive substrate and in electrical contact therewith and a low-side standard n-channel metal oxide semiconductor field effect transistor (NMOSFET) having a drain on a side facing the conductive substrate and in electrical contact therewith. Co-packaging of high-side and low-side NMOSFETs in this manner may reduce package size and parasitic inductance and capacitance compared to conventional packaging.

The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.

An improved paperboard has been bulk enhanced by retaining a substantial portion microspheres in a suitable distribution within the paperboard. As in one embodiment, the high retention of the bulk enhancing additives is believed to result from the incorporation of suitable retention aids. The paperboard is able to be formed into suitable paperboard containers without loss of integrity. The resulting containers have increased hold times when they contain hot or cold food or drink.

An apparatus and method technique for producing plane-parallel flakes is disclosed. In a preferred embodiment, the present invention is realized through a multi-chamber apparatus for producing plane-parallel flakes from layers vapor deposited in vacuum on an endlessly circulating substrate. The present invention includes the sequential steps of: vapor deposition of a separating agent layer in high vacuum on the endlessly circulating substrate; vapor deposition of one or more layers of metal, oxides, fluorides, and nitrides in high vacuum on the separating agent layer; and stripping the vapor deposited layers from the endlessly circulating substrate under low vacuum. The vapor deposited layers are subsequently present in a separate vacuum stage separated from the vapor deposition chamber by dynamic locks as a suspension of fine flakes in a mixture of solvent. and separating agent. The suspension may continuously or intermittently be transferred out of the separate vacuum stage for further processing. The solvent may be water in a vacuum environment of more than 20 mbar or secondary or tertiary alcohols at more than 0.05 mbar.

Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b) / 2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0<b<2, and 1.05<a+b<2), and (ii) a condensation catalyst. Also provided are a cured product produced by curing the composition and a process for sealing LED elements with the cured product. The composition exhibits excellent thermal resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.

A melt of an iron-based rare earth material alloy, represented by (Fe1-mTm)100-x-y-zQxRyMz, is prepared, wherein T is Co and / or Ni; Q is B and / or C; R is selected from Y (yttrium) and the rare earth elements; M is selected from Al, Si, Ti, V, Cr, Mn, Cu, Zn, Ga, Zr, Nb, Mo, Ag, Hf, Ta, W, Pt, Au and Pb; 10<=x<=30 at %; 2%<=y<10 at %; 0<=z<=10 at % and 0<=m<=0.5. The melt is fed onto a guide to form a flow of the melt thereon and move the melt onto a melt / chill roller contact region, where the melt is rapidly cooled by the chill roller to make a rapidly solidified alloy. An oxygen concentration of the melt yet to be fed onto the guide is controlled at about 3,000 ppm or less in mass percentage.

The invention provides a waterborne external thermal insulation coating. The coating consists of the following components in part by weight: 25 to 50 parts of functional filler, 30 to 50 parts of emulsion, 20 to 35 parts of filler, 8 to 20 parts of film-forming aid, 1 to 3 parts of wetting dispersant, 1 to 2 parts of propylene glycol, 1 to 2 parts of defoaming agent, 0.5 to 1.5 parts of mildew preventive, 1 to 5 parts of thickening agent and 10 to 20 parts of water. The invention is characterized in that: the coating is safe and environment-friendly, has excellent waterproof and anticorrosive properties, high thermal resistance and reflectivity, excellent thermal insulation property, and good weather resistance, is convenient to construct, and can be well adhered to various base materials, and the density of a dry film is low; an extremely thin hollow cavity layer is formed after the coating is coated on the surface of a base material and then is dried, so that an effective thermal barrier is formed; functional filler particles have large heated cathodes, low coefficient of thermal conductivity, and high heat reflectivity; the consumption of energy sources is remarkably reduced; the coating can reflect, refract and scatter thermal radiation and stop heat conduction; and the energy is saved.

The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

A heat-insulating coating for reflecting solar heat rays, which is composed of two parts: a primer and a top-coat. 10-50%, adhesive polymer resin 10-70%; the percentage of solid matter in the top coating is: surface coating reflective heat ray composite material 5-40%, heat reflective material 10-50%, adhesive Polymer resin 10-70%. The coating of the present invention is mainly used as the exterior surface coating of buildings, automobiles, trains, pipelines, storage tanks, etc. When the thickness of the dry coating film is 0.3-0.5mm, the total reflectance to heat rays can reach 85-90%, which can effectively prevent Thermal radiation from the sun.

A polycrystalline superabrasive composite tool can be produced using high pressure high temperature processes allowing for increased thermal resistance, wear resistance and toughness of abrasive tools, and additionally allowing for increased effective thickness of abrasive tools. A polycrystalline superabrasive compact can include a support substrate and a superabrasive polycrystalline layer having a diffusion bridge embedded therein that includes a carbide former. Additionally, a working layer can be attached adjacent to the superabrasive polycrystalline layer and opposite the support substrate to form a drill bit sandwich segment. The diffusion bridge matrix of the present invention allows for a new welding phase at each interface between the superabrasive polycrystalline layer and support substrate and between the polycrystalline layer and the metal working layer, thus eliminating delamination failure at the interfaces. The superabrasive polycrystalline layer can include superabrasive particles of varying particle sizes such that the final composite tool is tailored for specific abrading characteristics. The polycrystalline superabrasive composite tools can be incorporated for use in machining, drilling, grinding, cutting, polishing and similar abrasive applications.

A jaw assembly includes a jaw member and a structural insert. The jaw member includes an arm member and a support base extending distally from the arm member. The arm member defines a first portion of the jaw member. The support base defines a second portion and a third portion of the jaw member. The second portion defines a cavity disposed between the first portion and the third portion. At least a portion of the structural insert is disposed within the cavity.

An insulation system comprising layers of honeycomb cores where each core is enclosed in a sealed container made of radiation barrier material. The container is evacuated and becomes a vacuum enclosure for the honeycomb cores. To reduce the heat transfer between the honeycomb cores, the cores are placed in an offset arrangement.

The invention provides a building coating with a heat insulation function and a preparation method thereof. The building coating with the heat insulation function is divided into an internal wall coating and an external wall coating, wherein each of the internal wall coating and the external wall coating is composed of a basic carrier for film forming of the coating, a heat insulating material, a heat reflecting material, a heat radiating material, filler, an assistant and water. The preparation method comprises the following steps: preparation of heat insulating material slurry, preparation of function material slurry, grinding of slurry, and paint mixing. The film forming thickness of the building coating is 0.2-0.3mm, so that the building coating belongs to a thin building energy-saving coating; the internal and external wall building coatings have higher heat conducting resistance and lower convection heat transfer, so that the building coating has different heat radiating effects under different temperature environments in different seasons and has the heat insulation function; the building coating is high in safety and long in service life; and the preparation method is simple and is suitable for industrial production.

Space-efficient packaging of microelectronic devices permits greater functionality per unit PC board surface area. In certain embodiments, packages having leads of a reverse gull wing shape reduce peripheral footprint area occupied by the leads, thereby permitting maximum space in the package footprint to be allocated to the package body and to the enclosed die. Embodiments of packages in accordance with the present invention may also reduce the package vertical profile by featuring recesses for receiving lead feet ends, thereby reducing clearance between the package bottom and the PC board. Providing a linear lead foot underlying the package and slightly inclined relative to the PC board further reduces vertical package profile by eliminating additional clearance associated with radiuses of curvature of J-shaped leads.

Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.

A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Fabrics made for apparel, tents, sleeping bags and the like, in various composites, constructed such that a combination of substrate layers and insulation layers is configured to provide improved thermal insulation. The fabric composites are constructed to form a radiant barrier against heat loss via radiation and via conduction from a body.

A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

Compositions and methods for a melt processable semicrystalline poly(aryl ether ketone) incorporating phthalazinone and 4,4′-biphenol as comonomer units are described herein. The polymers are resistant to and insoluble in common organic solvents and liquids as well as in aggressive organic solvents such as chloroform and chlorinated liquids. The polymers are melt processable via techniques such as extrusion, injection molding, and compression molding. The semicrystalline poly(aryl ether ketone) containing phthalazinone comonomer units have properties which make them suitable for manufacturing high temperature resistant molded systems and other articles.

The invention relates to a building material, and particularly relates to a light fly ash multi-row hole self-thermal insulation building block. The technical scheme is that: according to the light fly ash multi-row hole self-thermal insulation building block, through holes are uniformly distributed on a cuboid light fly ash building block. The light fly ash building block is prepared by adopting portland cement as a gelling material, adopting fly ash, crude ash, ceramsite or slag, pumice, perlite or vermiculite, sawdust, polyphenyl particles, building adhesives, humectants and additives as filling materials, diluting and dissolving the mixture with water, mixing, stirring, extruding, and curing; the cross sections of the through holes are rectangular, and the arrangement form of the through holes is multi-section, multi-layer, parallel, and interactive. With the combination of the structure of the multi-row hole self-thermal insulation building block and the light composite fly ash material, the performance of the building block such as heat preservation, light weight, thermal insulation, sound insulation, fire prevention, durability, and the like is greatly improved; traditional clay bricks, aerated blocks and traditional outer wall insulation methods are substituted; and national requirements for building energy saving are fully met.

A hermetically sealed multi-pane window assembly comprises first and second windowpane sheets formed of transparent materials. A first sealing member has an inner edge and an outer edge, the inner edge being hermetically attached around the periphery of the first windowpane sheet by diffusion bonding. A second sealing member has an inner edge and an outer edge, the inner edge being hermetically attached around the periphery of the second windowpane sheet by diffusion bonding and the outer edge being hermetically attached to the outer edge of the first sealing member. A spacer assembly is disposed between the first and the second windowpane sheets for maintaining a gap therebetween, whereby a hermetically sealed cavity is defined between the first and the second windowpanes.

A coating composition and a cooking device and / or cooking receptacle coated with the coating composition are described. The coating composition includes 10 to 30 wt. % of SiO2, 10 to 30 wt. % of P2O5, 10 to 30 wt. % of Al2O3, 1 to 20 wt. % of TiO2, 7 to 15 wt. % of Na2O, 7 to 15 wt. % of K2O, 5 to 10 wt. % of ZrO2, 2 to 5 wt. % of BaO, 2 to 5 wt. % of B2O3, 1 to 2 wt. % of MnO2, and an adhesion enhancer. The coating composition provides favorable thermal resistance, acid resistance and mechanical properties, such that a cooking device and / or receptacle coated with the coating composition may be easily cleaned at a relatively low temperature.

A lower electrode (2) and surface electrode (7) composed of a layer-structured conductive carbide layer is formed on one principal surface side of the substrate (1) composed of an insulative substrate such as a glass or ceramic substrate. A non-doped polycrystalline silicon layer (3) is formed on the lower electrode (2), An electron transit layer (6) composed of an oxidized porous polycrystalline silicon is formed on the polycrystalline silicon layer (3). The electron transit layer (6) is composed of a composite nanocrystal layer including polycrystalline silicon and many nanocrystalline silicons residing adjacent to a grain boundary of the polycrystalline silicon. When voltage is applied between the lower electrode (2) and the surface electrode (7) such that the surface electrode (7) has a higher potential, electrons are injected from the lower electrode (2) toward the surface electrode (7), and emitted through the surface electrode (7) through the electron transit layer (6).

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.