Insulated glazing units and methods

Abstract

A hermetically sealed multi-pane window assembly comprises first and second windowpane sheets formed of transparent materials. A first sealing member has an inner edge and an outer edge, the inner edge being hermetically attached around the periphery of the first windowpane sheet by diffusion bonding. A second sealing member has an inner edge and an outer edge, the inner edge being hermetically attached around the periphery of the second windowpane sheet by diffusion bonding and the outer edge being hermetically attached to the outer edge of the first sealing member. A spacer assembly is disposed between the first and the second windowpane sheets for maintaining a gap therebetween, whereby a hermetically sealed cavity is defined between the first and the second windowpanes.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Application No. 11 / 381,733 filed May 4, 2006 (Office Docket No. STRK-27,673), U.S. Application No. 11 / 381,742 filed May 4, 2006 (Office Docket No. STRK-27,663) , U.S. Provisional Application No. 60 / 678,570 filed May 6, 2005 (Office Docket No. STRK-27,067) and U.S. Provisional Application No. 60 / 707,367 filed August 11, 2005 (Office Docket No. STRK-27,275) priority interests. [0003] U.S. Application No. 11 / 381,733 filed May 4, 2006 (Office Docket No. STRK-27,673) and U.S. Application No. 11 / 381,742 filed May 4, 2006 (Office Docket No. STRK-27,663) are 2004 Continuation-in-Part of pending U.S. Application No. 10 / 766,493 (Docket STRK-26,581), filed January 27, which is U.S. Application No. 10 / 713,475, filed Nov. 14, 2003 (Docket No. STRK-26,032), now U.S. Patent 6,962,834, a continuation-in-part of U.S. Application No. 10 / 133,049 filed April 26, 2002 (firm docket STRK-26,033), now U.S. Patent ...

AI Technical Summary

Problems solved by technology

So, an SMT reflow solder connection to the PWB of a MOEMS device that uses a lower melting point solder preform for the window may have the adverse effect of reflowing the solder of the window assembly, cracking the window into thin layers

[0010] A third disadvantage is that the solder that acts as an interlayer between the glass and the Kovar frame has a CTE that is up to three times greater than the two materials it joins

Problems include: spacers are opaque or aesthetically unappealing so they do not meet industry needs; attempts at laser sealing when sealing result in cracked clears; perimeters on the inside of glass clears Thermal conductivity between surfaces where they are sealed together; stress eventually cracks the seal or translucency because the sealing method is not compliant (flexible); elevated soldering temperature eliminates the use of some soft coatings for low emissivity ( low-e) coating; and / or when vacuum tubes are added, it increases the complexity of the device and reduces its reliability

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