788 results about "Diffusion bonding" patented technology

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.

A sputtering target and a backing plate are diffusion-bonded with or without an insert or inserts interposed there-between so as to have a solid phase diffusion-bonded interface. The sputtering target substantially maintains its metallurgical characteristic and properties even though it has been diffusion-bonded to the backing plate. The solid-diffusion bonding of the target and backing plate, is achieved at a low temperature and pressure and results in interdiffusion of constituent atoms to attain high adhesion and bond strength without attendant deterioration or large deformation of the target material, while inhibiting the crystal growth in the target material. The bond undergoes no abrupt decrease in bond strength upon elevation of the service temperature. One hundred percent bonding is achieved with non-bonded portions such as pores left along the interface.

The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency.

The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.

A heat spreader comprising a casing, a micro-structure layer, a support device, and a working fluid is provided. The casing has an inner surface and is defined by a sealed chamber where the working fluid circulates therein. The micro-structure layer is formed on the inner surface of the casing, wherein the micro-structure layer comprises a first structure layer which is formed by the first metallic mesh. Specifically, the first metallic mesh forms the first structure layer on the inner surface through diffusion bonding so that the working fluid can circulate within the micro-structure layer by capillary action. In addition, the support device is disposed in the sealed chamber for supporting the casing. Thus, a heat spreader with a composite micro-structure can not only enhance the capillarity but also reduce the flowing resistance during operation.

A friction stir tool is provided to perform friction stir riveting using a partially consumable pin, wherein the pin includes a cutting edge on a bottom surface thereof, wherein the tool is rotated at a first speed to enable cutting by the pin into a first material that is overlapping a second material, wherein after the pin has cut to a sufficient depth, the rotational speed of the tool is increased to thereby enable plasticization of the consumable pin, the first material, and the second material, wherein the tool is then rapidly decelerated until stopped, enabling diffusion bonding between the pin, the first material and the second material.

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

The invention provides a method capable of manufacturing a micropump check valve, inexpensively and without much trouble or time, which does not cause disadvantages even if a material that dissolves an adhesive is contained in the fluid, and which allows bonding with high accuracy. After a valve forming member and a valve receiving member are bonded, a valve receptor is projected towards a valve part and pretension is applied. Thus, the valve forming member and the valve receiving member can be satisfactorily bonded through a solid phase diffusion bonding method and the like using a relatively inexpensive material, such as stainless steel, without using an adhesive, and the pretension is not reduced when in the annealing state.

The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.

A method of forming a metal product. A metal alloy workpiece substrate is provided have pre-process dimensions. The dimensional differences are determined between the pre-process dimensions of the workpiece substrate and desired post-process dimensions of a post-process metal product formed from the workpiece substrate. A build-up thickness is determined of coating material required to obtain the desired post-process dimensions of the post-process metal product. A high-density coating process is performed to coat the workpiece substrate with a coating material to build-up a thickness of coating material effective to obtain desired finished dimensions after performing a sintering heat treatment process and/or a hot isostatic pressing treatment. The sintering heat treatment is performed on the coated workpiece substrate to densify the coating material. Then, the hot isostatic pressing treatment is performed to obtain the post-process metal product having the desired post-process dimensions and having diffusion bonding between the coating material and the workpiece substrate.

The invention belongs to the technical field of metal plastic processing, and aims at providing a superplastic forming/diffusion bonding forming method for a heat-resistant titanium alloy envelope with high material utilization ratio, high dimension control precision and high product performance. As a mould is adopted to control the appearance and dimension of a workpiece, the forming of a titanium alloy workpiece provided with a complex profile is completed, the production process of the heat-resistant envelope workpiece is shortened, and production cost is lowered; as the process of diffusion bonding followed by superplastic forming is adopted, the diffusion bonding is realized at the contact part of an inner envelope and an outer envelope, and the superplastic forming is realized at a separated part, the once-formed heat-resistant envelope with the complex profile and a hollow structure has the advantages of greatly improved structural integrity of a component, enhanced specific strength and specific stiffness of the component and increased welding rate of the diffusion bonding; the processed workpiece has the advantages of high dimension accuracy, high integral performance, light weight and the like; and the method disclosed by the invention has the advantages of shortened processing period, high material utilization ratio and lowered production cost.