Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

a multi-layer structure and electrochemical technology, applied in the field of three-dimensional structure formation, can solve the problems of destructive separation of masking material from substrate, and achieve the effect of improving the properties of fabricated structures
US20050045585A1Inactive Publication Date: 2005-03-03UNIV OF SOUTHERN CALIFORNIA
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
UNIV OF SOUTHERN CALIFORNIA
Publication Date
2005-03-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
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Description

RELATED APPLICATIONS

[0001] This Application is a continuation-in-part of U.S. patent application Ser. No. 10 / 434,289 filed on May 7, 2003, and claims benefit of U.S. Provisional Patent Application No. 60 / 533,946 filed on Dec. 31, 2003, U.S. Provisional Patent Application No. 60 / 506,103 filed on Sep. 24, 2003, U.S. Provisional Patent Application No. 60 / 474,625 filed May 29, 2003, and to U.S. Provisional Patent Application No. 60 / 468,741 filed May 7, 2003; and the '289 application in turn claims benefit of U.S. Provisional Patent Application No. 60 / 379,129, filed on May 7, 2002. Each of these applications is hereby incorporated herein by reference as if set forth in full.FIELD OF THE INVENTION

[0002] The embodiments of various aspects of the invention relate generally to the formation of three-dimensional structures (e.g. meso-scale or microscale structures) using electrochemical fabrication methods wherein heat treatment is provided to improve interlayer adhesion. BACKGROUND

[0003] ...

Claims

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