Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

US20050029109A1Inactive Publication Date: 2005-02-10UNIV OF SOUTHERN CALIFORNIA
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
UNIV OF SOUTHERN CALIFORNIA
Publication Date
2005-02-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
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Description

RELATED APPLICATIONS

[0001] This Application is a continuation-in-part of U.S. patent application Ser. No. 10 / 434,289 filed on May 7, 2003 and claims benefit of U.S. Provisional Patent Application No. 60 / 533,946 filed on Dec. 31, 2003, U.S. Provisional Patent Application No. 60 / 506,103 filed on Sep. 24, 2003, U.S. Provisional Patent Application No. 60 / 474,625, filed May 29, 2003, and to U.S. Provisional Patent Application No. 60 / 468,741, filed May 7, 2003; while the '289 application in turn claims benefit of U.S. Provisional Patent Application No. 60 / 379,129, filed on May 7, 2002. Each of these applications is hereby incorporated herein by reference as if set forth in full.GOVERNMENT SUPPORT

[0002] A portion of the inventions disclosed and claimed herein were made with Government support under Grant Number DABT63-97-C-0051 awarded by DARPA. The Government may have certain rights. Not all inventions disclosed herein and were developed or conceived with government funding and it is no...

Claims

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