127results about How to "Strengthen interconnection" patented technology

This invention describes a new methodology for a cell reselection by a mobile station (MS) for improving network interconnection and interoperability in a limited mobile access environment. The invention is applicable to any kind of networks and their interconnections. The invention describes how the MS can better recover from failed intersystem cell reselection attempts so that there are fewer subsequent failed attempts using two major improvements. First, the MS takes into consideration during cell reselection evaluation and candidate-cell selection, whether the MS had previously been unsuccessful in reselecting the considered cell. This means treating neighbor cells to which the MS had failed reselection before with a lower priority in subsequent cell reselection evaluations. Second, the MS is allowed to stop monitoring and thus, to stop evaluating cells if it was earlier found that the access to those cells is forbidden.

An elastomeric device for interconnecting two or more electrical components, comprising, an elastomeric matrix having one or more outer surfaces; one or more electrically conductive pathways through the matrix; and one or more electrically conductive contact pads, wherein at least a portion of one or more of the pads is flush with or extends outward from one or more of the outer surfaces of the matrix, and wherein at least a portion of the pad is in at least intimate contact with one or more of the pathways; and methods for making same.

A method for fabricating a chip-embedded interposer may comprise forming at least one cavity on a silicon substrate, forming a plurality of through vias penetrating the silicon substrate, providing an integrated circuit chip having a plurality of I / O pads, and forming rerouting conductors connected to the I / O pads and the through vias. A stack structure having different kinds of chips may be incorporated at wafer level using the described interposer.

A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorporation of the flexible film interposer achieves densely packaged semiconductor devices, without the need for a redistribution layer (RDL).

A system for reducing reflection of an optical system can reduce or eliminate reflection at facets of a semiconductor gain medium and can suppress natural longitudinal modes produced within the semiconductor gain medium. In combination with external feedback, the system can allow more precise wavelength control of the light output of a laser, thereby allowing the laser to be used in a dense wavelength division multiplexing system. The system employs a patterned relief surface disposed on a facet of a gain medium. The patterned relief surface may be a "motheye" pattern having a plurality of conical posts disposed on the surface of the facet. The system may be combined with conventional devices, such as a Bragg reflector or a microelectromechanical component, to further improve wavelength control of a resonant optical cavity, thereby improving the operation of optical communications systems.

An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a support member over the recess configured to electrically engage a bumped contact. The support member is suspended over the recess on spiral leads formed on a surface of the substrate. The spiral leads allow the support member to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the spiral leads twist the support member relative to the bumped contact to facilitate penetration of oxide layers thereon. The spiral leads can be formed by attaching a polymer substrate with the leads thereon to the substrate, or by forming a patterned metal layer on the substrate. In an alternate embodiment contact, the support member is suspended over the surface of the substrate on raised spring segment leads.

A driving apparatus for over-drive driving includes a display memory, a memory control circuit performing control for receiving input image data supplied from an image rendering device, reading out image data one frame before of the input image data from the display memory and for writing the input image data in the display memory as write image data for the display memory, and a image data control circuit for verifying whether or not the input image data from the memory control circuit coincides with the readout image data one frame before read out from the display memory. The apparatus also includes an LUT for outputting converted image data, a transfer data control circuit for selectively outputting the input image data or the converted image data, and latch circuits for latching image data of one horizontal line equivalent of pixels. A shift register circuit generates latch signal for image data.

This invention describes a new methodology for a cell reselection by a mobile station (MS) for improving network interconnection and interoperability in a limited mobile access environment. The invention is applicable to any kind of networks and their interconnections. The invention describes how the MS can better recover from failed intersystem cell reselection attempts so that there are fewer subsequent failed attempts using two major improvements. First, the MS takes into consideration during cell reselection evaluation and candidate-cell selection, whether the MS had previously been unsuccessful in reselecting the considered cell. This means treating neighbor cells to which the MS had failed reselection before with a lower priority in subsequent cell reselection evaluations. Second, the MS is allowed to stop monitoring and thus, to stop evaluating cells if it was earlier found that the access to those cells is forbidden.

A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.

An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

An electrical interconnection device (100) includes a first connector (1) having an insulated housing (14) and at least a pogo type contact (15) mounted to the insulated housing; a second connector (2) having base portion (20) and a terminal (25) assembled to the base portion, said terminal having an arc-shaped mating segment; and the first connector pivotally linked to the second connector, with the insulated housing of the first connector disposed adjacent to the base portion of the second connector, the contact (15) pressing onto and sliding along the mating segment of the terminal (25) while the first connector and the second connector are swiveled with respect to one another.

A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching or for RF isolation, an antenna, and a matching network comprised of passive elements. A second thermal spreading substrate may be bonded to the remaining portion of the semiconductor device. Interconnections may be made through the first or second substrates. The method may also include bonding a plurality of semiconductor devices to an element, and the element may have recesses in which the semiconductor devices are disposed. A conductor array having a plurality of contact structures may be formed on an exposed surface of the semiconductor device, vias may be formed through the semiconductor device to device regions, and interconnection may be formed between said device regions and said contact structures.

An improved pedestal for a flooring system of the type which utilizes prefabricated base panels installed in side by side relationship to support a series of upstanding pedestals positioned in a geometric pedestal array is disclosed. The pedestals support further panels which define chases. Working floor panels are mounted atop caps which form tops of the pedestals. In one embodiment the caps each thread into a threaded bore in a pedestal body for leveling adjustments. Novel feet project downwardly from the pedestal bodies to provide positive locks with the base panels.

The invention relates to a portable cartridge that stores a fuel for use with a fuel cell system. Cartridges described herein improve mechanical interface between a cartridge and a device that couples to the cartridge. The interface may include one or more of: a sliding interface between a cartridge and device, a latching interface that holds the cartridge in one or more positions relative to the device, and / or keyed access and security features that prevent unintended access to the fuel. Multiple valves may also be included to further control access to the fuel.

A seat mounting rail suitable for mounting passenger seats to a floor, for example an aircraft cabin floor, is divided into an upper section for securing a seat and a lower section for mounting the rail to the floor. The upper section is preferably made of a titanium alloy. The lower section is preferably made of an aluminum alloy. Both sections are connected to each other by an interconnection preferably in the form of a metallurgical bond formed under heat and pressure. A bonding metal foil compatible with the metals of which the rail sections are made is used for enhancing the bonding strength of the interconnection.

A facial expression identification method based on a Gabor wavelet and a gray-level co-occurrence matrix. According to the method, firstly, a pure face region in an expression image is extracted by a manual partitioning method and color image gray processing, histogram equalization and scale normalization processing are carried out; then data redundancies of conventional Gabor features are greatly reduced by a method for carrying out block extraction on a Gabor feature statistic, and the gray-level co-occurrence matrix which reflects the image texture features is introduced into the field of expression identification for the first time so as to make up the defect of deficiency of pixel spatial relativity, which is caused by Gabor feature block processing; and finally, a set of low-dimension feature vectors for feature expression are generated and on the premise of ensuring a high expression identification rate, the expression identification rate is greatly improved.

The invention relates to a portable cartridge that stores a fuel for use with a fuel cell system. Cartridges described herein improve mechanical interface between a cartridge and a device that couples to the cartridge. The interface may include one or more of: a sliding interface between a cartridge and device, a latching interface that holds the cartridge in one or more positions relative to the device, and / or keyed access and security features that prevent unintended access to the fuel. Multiple valves may also be included to further control access to the fuel.

A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching or for RF isolation, an antenna, and a matching network comprised of passive elements. A second thermal spreading substrate may be bonded to the remaining portion of the semiconductor device. Interconnections may be made through the first or second substrates. The method may also include bonding a plurality of semiconductor devices to an element, and the element may have recesses in which the semiconductor devices are disposed. A conductor array having a plurality of contact structures may be formed on an exposed surface of the semiconductor device, vias may be formed through the semiconductor device to device regions, and interconnection may be formed between said device regions and said contact structures.

A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.

A stablized retaining wall structure comprising concrete blocks stacked in an array of superimposed rows, and with a stable anchoring assembly being in restraining contact with selected blocks. An access bore extends from the rear surface of the block to the surface of the wall comprising the hollow core. An earthen fill zone is arranged in spaced apart relationship to the rear surface of the wall and clean granular back-fill is interposed between the wall and the earthen fill zone. A keeper device is provided to couple selected wall blocks to the stable anchoring assembly, with the keeper device being configured to be restrainably held within the hollow core. An elongated fastener is coupled to the keeper device, with the fastener extending through the access bore and secured to the stable anchoring assembly.

An electrical interconnection device (100) includes a first connector (1), a second connector (2) electrically connected to the first connector via a number of wires (26); a hinge member (3) including a first engaging portion (30) connected with a second engaging portion (32), said first engaging portion fixed to the first connector, the second engaging portion pivoted with the second connector; and a positioning member (305) unitarily formed with the hinge member, said positioning member selectively engaged with corresponding positioning grooves (202) of the second connector while the first connector and the second connector rotated with respect to one another.

A semiconductor die and an associated low resistance interconnect located primarily on the bottom surface of such die is disclosed. This arrangement provides a flexible packaging structure permitting easy interconnected with other integrated circuits; in this manner, a number of such circuits can be stacked to create high circuit density multi-chip modules. A process for making the device is further disclosed. To preserve structural integrity of a wafer containing such die during manufacturing, a through-hole via formed as part of the interconnect is filled with an inert material during operations associated with subsequent active device formation on such die.

A semiconductor die and an associated low resistance interconnect located primarily on the bottom surface of such die is disclosed. This arrangement provides a flexible packaging structure permitting easy interconnected with other integrated circuits; in this manner, a number of such circuits can be stacked to create high circuit density multi-chip modules. A process for making the device is further disclosed. To preserve structural integrity of a wafer containing such die during manufacturing, a through-hole via formed as part of the interconnect is filled with an inert material during operations associated with subsequent active device formation on such die.

A solid oxide fuel assembly is made, wherein rows (14, 25) of fuel cells (17, 19, 21, 27, 29, 31), each having an outer interconnection (20) and an outer electrode (32), are disposed next to each other with corrugated, electrically conducting expanded metal mesh member (22) between each row of cells, the corrugated mesh (22) having top crown portions and bottom portions, where the top crown portion (40) have a top bonded open cell nickel foam (51) which contacts outer interconnections (20) of the fuel cells, said mesh and nickel foam electrically connecting each row of fuel cells, and where there are no more metal felt connections between any fuel cells.

An apparatus and method for interconnecting concrete precast floor and wall panels is provided. More specifically, one embodiment of the present invention includes an adjustable connector with a captive nut that is embedded into a wall panel. A floor panel that includes an aperture integrated therethrough is placed adjacent to the adjustable connector wherein the captive nut therein may be positioned in line with the aperture. A threaded rod is then placed through the aperture of the floor panel and a nut is placed thereon thus providing a secure interconnection between the floor panel and the wall panel.

A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

The invention discloses a text information extraction method based on the Domain adaptation, comprises the following steps of:preprocessing the input text to obtain a text vector; between the second domain and the first domain,extracting a common feature of a text vector according to a common feature extraction parameter,and in the first domain extracting a private feature of the text vector according to the private feature extraction parameter; carrying out field classification on common features after a field blurring is carried out; analyzing and correcting a common feature extraction parameters according to a classification result and a domain information of a first field; performing adjacent word prediction on the text vector according to a private feature; analyzing and correcting the private feature extraction parameters according to a prediction result and a adjacent words in the text. The method can improve text analysis and extraction capability in social media and other fields. The invention also discloses a text information extraction device and system based on a field adaptation and a readable storage medium, and a text information extraction device has the above beneficial effects.

A drain assembly including a drain pipe with a threaded portion and a nut is provided. The drain pipe includes a first end, an elbow portion, and a second end. The first end includes an annular flange and the threaded portion. To interconnect the drain assembly to a bathtub, the second end of the drain pipe is inserted through a drain port of the tub until the annular flange abuts a bottom wall of the tub. The nut is then threaded onto the threaded portion of the drain pipe to secure the drain pipe to the bathtub. The second end of the drain pipe is then interconnected to drain plumbing.

A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.

A semiconductor die and an associated low resistance interconnect located primarily on the bottom surface of such die is disclosed. This arrangement provides a flexible packaging structure permitting easy interconnected with other integrated circuits; in this manner, a number of such circuits can be stacked to create high circuit density multi-chip modules. A process for making the device is further disclosed. To preserve structural integrity of a wafer containing such die during manufacturing, a through-hole via formed as part of the interconnect is filled with an inert material during operations associated with subsequent active device formation on such die.