78 results about "Thermal reliability" patented technology

The invention relates to the technical field of chip testing, and provides a chip temperature characteristic testing method, system and equipment, and the method comprises the steps: obtaining transient thermal response data and steady-state thermal distribution data of a chip, carrying out the feature extraction of the transient thermal response data, obtaining a feature thermal mode set, and carrying out the feature extraction of the feature thermal mode set; performing heat transfer analysis on the steady-state heat distribution data by utilizing the characteristic heat mode set to obtain a long-term temperature drift curve; and evaluating the long-term temperature drift curve to obtain a thermal reliability score and a thermal degradation prediction parameter, and generating life prediction data of the chip based on the thermal reliability score and the thermal degradation prediction parameter. By combining the analysis of transient thermal response data and steady-state thermal distribution data, the accuracy and reliability of temperature characteristic test are improved, and the problem that the traditional method is difficult to accurately capture the transient change characteristic of the chip temperature and identify the long-term temperature drift trend under a dynamic working condition or a complex load condition, and the test accuracy is insufficient is solved.

The invention provides a test method for evaluating thermal cycle failure of a silver sintering interconnection structure. The test method comprises the following steps: constructing a silver sintering acceleration function and designing acceleration parameters; setting up an acceleration test device; characterizing the sintered sample to be detected; carrying out an accelerated thermal shock experiment on the to-be-tested sintered sample; judging whether the to-be-tested sintered sample subjected to the accelerated thermal shock test is invalid, if so, performing the next step, and if not, returning to the previous step; and characterizing the failed sintering sample to be detected. The method and the device are simple and easy to implement, the number of thermal cycles is shortened on the basis that the thermal failure of the silver sintering interconnection product can be reflected, the thermal reliability of the product can be evaluated within one day, and the failure life of the product can be predicted.

The invention discloses an integrated circuit 3D packaging structure based on general IPs and a packaging method thereof, and belongs to the technical field of semiconductors. Hot spot areas of all layers of general IPs can be accurately identified through thermal simulation, stress concentration areas are identified in combination with simulation, then through-silicon-via parameters are adjusted, heat conduction paths are optimized, local temperature is effectively reduced, and the packaging efficiency is improved. Mechanical stress is relieved while the thermal reliability of the chip is improved, chip cracking or failure caused by stress concentration is avoided, and the structural reliability of packaging is improved; and comparing the cross-sectional view of the through-silicon via with a corresponding expected cross-sectional view of the through-silicon via, identifying abnormal depth points, adjusting etching parameters of the corresponding through-silicon via at the abnormal depth points, and repeatedly adjusting the etching parameters until the number of the abnormal depth points is zero, so that the aperture of the etched through-silicon via is close to an expected value, and the packaging quality is improved. The finished product performance is ensured.

The invention discloses a heat dissipation method of a processor, computer equipment, a storage medium and a program product, and relates to the technical field of processor heat dissipation, and the method comprises the following steps: when a target processor power consumption mode is a high power consumption mode, obtaining a target temperature difference and a target processor utilization rate, mapping the target temperature difference and the target processor utilization rate to a corresponding fuzzy set by utilizing a Gaussian function, determining and determining a target value of a heat dissipation parameter combination based on a target temperature difference membership degree and a target processor utilization rate membership degree, and further adjusting the rotating speed of a fan corresponding to a target processor; when the power consumption mode of the target processor is a low-power-consumption mode, a first value of a current temperature set point of the target processor and a second value of an expected temperature set point of the target processor are obtained, and the wind direction of a fan corresponding to the target processor is adjusted based on the first value and the second value. The technical problem that a single heat dissipation strategy is difficult to meet the heat dissipation requirements of different processors is solved, and the technical effect of improving the heat dissipation reliability of the processors is achieved.

The invention discloses a drive control method and system for a Si / SiC hybrid device, and relates to the technical field of semiconductors, and the method comprises the steps: obtaining the conduction current of the Si / SiC hybrid device; a current interval where the conduction current is located is determined, one current interval corresponds to one driving mode, and the driving modes include only driving the Si IGBT device, only driving the SiC MOSFET device and driving the Si IGBT device or the SiC MOSFET device for different times in one switching period; and driving the Si / SiC hybrid device according to the driving mode of the current interval where the conduction current is located. According to the invention, the dynamic adjustment of the driving control mode is realized, the driving flexibility of the Si / SiC hybrid device is improved, the switching efficiency of the Si / SiC hybrid device switch is also improved, the loss of the Si / SiC hybrid device is reduced, and the compromise optimization operation of the thermal reliability and the electromagnetic compatibility is realized.

The invention belongs to the technical field of electric heating joint optimization scheduling, and discloses a cold region novel power system flexibility improvement method and system based on heat supply network inertia, and the method comprises the steps: fusing the inertia characteristics of a heat supply network, building an electric heating cooperation model, and achieving the whole-cycle cost minimization solving and flexibility quantitative evaluation through the combination of multiple constraints, and a heat storage adjusting space is provided for the system according to the heat delay and heat loss characteristics of heat supply network inertia, the CHP unit is allowed to preferentially respond to power dispatching on the premise that heat supply stability is guaranteed, the straight condensing thermal power unit is allowed to adjust power supply and demand through climbing, a heat pump supplements a heat supply gap, and the flexible adjusting capacity of the system is greatly improved. The whole-cycle cost optimization target reduces unit operation and wind and light abandoning losses, multi-dimensional flexibility index quantification verifies the remarkable improvement effect of heat supply network inertia on the flexibility of a power grid, the stable operation capacity of a power system under high-proportion new energy access is enhanced, and the winter heat supply reliability of the cold region is guaranteed.

This invention belongs to the field of oil supply, lubrication, and cooling technology for aero-engine bearings. It provides a method for temperature control and parameter optimization design of under-ring lubricated bearings. The method includes: generating sample data on total heat generation, bearing element temperature, and oil slingering temperature of the bearing through experiments or simulations based on bearing structural parameters and operating condition parameters; constructing a predictive model with the parameters as input and thermal-fluid performance as output; quantifying the influence of input parameters using global sensitivity analysis, screening key design parameters, and constructing a multi-objective optimization model with the objectives of minimizing bearing element temperature control accuracy and total heat generation; solving the model to obtain the Pareto optimal solution set, and determining the optimal combination of structure and oil supply parameters that satisfies the oil slingering temperature safety constraint and bearing thermal reliability requirements while achieving optimal overall performance. This invention is applicable to the refined design of high-speed bearings in rotating machinery such as aero-engines, enabling precise temperature control and coordinated energy consumption optimization.

The invention discloses a heat supply system, method and equipment based on chemical looping electricity storage. The heat supply system comprises an energy storage unit and an energy release unit which achieve energy coupling through a metal-oxygen carrier exchange system. The energy storage unit comprises a heat pump assembly, a reduction reactor and a first heat exchange assembly, the heat pump assembly and the reduction reactor are both connected with the first heat exchange assembly, and water flowing through the heat pump assembly exchanges heat with oxygen discharged by the reduction reactor through the first heat exchange assembly; the energy release unit comprises an oxidation reactor and a second heat exchange assembly, the oxidation reactor is connected with the second heat exchange assembly, and water flowing into the second heat exchange assembly exchanges heat with flue gas discharged by the oxidation reactor. By combining a chemical looping electricity storage technology with a heat supply system, electric energy is converted into high-density chemical energy by using a reduction reactor and stored in a metal oxygen carrier in the period of sufficient green electricity; and during the period of insufficient green power, chemical energy stored in the metal oxygen carrier is released by using the oxidation reactor and is used for producing hot water or steam. According to the system, cross-time-space conversion and flexible scheduling among electric energy, chemical energy and heat energy are achieved, so that the comprehensive utilization efficiency of energy and the heat supply reliability are improved, and meanwhile the operation cost is reduced.

The invention discloses an intelligent optimization method for power-memory-computing three-dimensional packaging heat dissipation reliability based on heterogeneous integration, and belongs to the technical field of advanced packaging and thermal management of integrated circuits. The method comprises the following steps: firstly, determining packaging structure parameters, and obtaining a sample data set through a mixed horizontal orthogonal test and finite element thermal simulation; secondly, on the basis of signal-to-noise ratio and range analysis, the influence weight of each parameter on the junction temperature is quantified, key parameters and secondary parameters are distinguished, the secondary parameters are fixed to the optimal level, the key parameters are determined, and the thermal simulation model is corrected; then training a random forest regression model based on all test data, and constructing an agent model; and finally, performing automatic collaborative optimization on the specific size of each layer of chip by adopting an NSGA-II multi-target genetic algorithm according to the proxy model, so as to minimize the highest junction temperature at the same time. According to the method, high-cost physical simulation is converted into an efficient intelligent optimization process, and the thermal reliability, the design efficiency and the product performance stability of packaging are remarkably improved.

The invention provides a resin composition, a metal foil-coated laminated board containing the resin composition and application of the metal foil-coated laminated board, and the resin composition comprises the following components in parts by mass: 30-60 parts of epoxy resin, 15-30 parts of a reactive phosphorus-containing flame retardant, 3-15 parts of a curing agent and 180-300 parts of spherical composite silicon micro powder on the basis that the total mass of organic resin is 100 parts; the mass percentage of silicon dioxide in the spherical composite silicon micropowder is 50-70%, and the D50 particle size of the spherical composite silicon micropowder is less than or equal to 5 microns. Through the design of the spherical composite silica powder, the epoxy resin, the reactive phosphorus-containing flame retardant and the curing agent and the compounding of the spherical composite silica powder, the epoxy resin, the reactive phosphorus-containing flame retardant and the curing agent in specific dosages, the resin composition and the metal foil-clad laminated board containing the resin composition realize halogen-free flame retardance, high glass transition temperature and low linear thermal expansion coefficient; and the adhesive has excellent interlayer adhesive force and drilling processability, and can fully meet the requirement of a high-density communication substrate for thermal reliability.

The invention discloses a preparation method of a silicon carbide trench gate type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) power device. The preparation method comprises six steps of substrate buffer layer deposition, gate oxide layer preparation, trench etching, gate metal layer deposition, source and drain region ion implantation and source and drain metal layer deposition and annealing. In the preparation process, a multi-physics field coupling dynamic thermal resistance model, a multi-working-condition thermal reliability boundary algorithm, a full-working-area variable temperature parameter fitting model and a power device multi-parameter calibration platform are integrated, technological parameters of all steps are set through model calculation and algorithm analysis, and key performance parameters of the device are detected in real time and dynamically adjusted by means of the calibration platform. According to the method, the problems of non-uniform heat distribution, stress concentration, insufficient parameter fitting and calibration deficiency in traditional preparation are solved, the interface bonding quality of the buffer layer and the metal layer and the electrical property consistency of the device are improved, the thermal reliability and the working efficiency of the device are enhanced, and the application requirement of a high-voltage high-power power electronic system for a core device is met.

The invention provides a maintenance auxiliary device for improving the heat supply reliability of a heat supply network system. The filtering assembly is arranged at the top of the moving assembly, and the filtering assembly comprises a shell. According to the auxiliary maintenance device for improving the heat supply reliability of the heat supply network system, through mutual cooperation of the moving assembly, the filtering assembly, the flow guide assembly, the connecting assembly and other structures, when the auxiliary maintenance device is used, a connecting pipe can be directly in butt joint with a heat supply pipeline, and hot water containing impurities flows into a filter drum through an input pipe to be filtered; the filtered wastewater flows back to the pipeline through the output pipe, and a large amount of external water resources are not consumed, so that the water resources are recycled, and environmental pollution caused by wastewater discharge is avoided; meanwhile, the device can be conveniently and flexibly moved to different operation points through the moving assembly, temporary equipment building is not needed, the heat supply network pipeline impurity cleaning efficiency is improved, faults such as valve jamming and heat exchanger blockage are reduced, and the heat supply reliability of a heat supply network system is guaranteed.

The application relates to the technical field of H-bridge power devices, and provides an H-bridge power device based on a BCD process, which adopts a central symmetry layout on a semiconductor substrate and comprises parallel VDD and GND metal buses and an output metal port; the VDD and GND metal buses respectively extend a plurality of power metal strips which are parallel to each other and are alternately arranged towards the output port; each power metal strip has a width gradient structure and a round-corner transition edge corner which are continuous from the bus to the port direction; and the power metal strip is connected with an underlying power transistor active area through a contact hole array; the device is configured through specific shape and size, so that the metal path resistances from the VDD and the GND to the output end are equal, thereby realizing uniform distribution of current, reducing parasitic parameters, improving switching speed, and significantly improving the thermal reliability and overall reliability of the device.

To provide a composition for a clad from which an optical waveguide having improved thermal reliability can be obtained.SOLUTION: A composition for a clad, which is usable in a clad of an optical waveguide, contains a cyclic olefin resin (A), and polyfunctional (meth)acrylate (B).SELECTED DRAWING: None

The invention discloses a three-dimensional chip thermal perception optimization method based on tensor data flow, and relates to the field of integrated circuits, and the method comprises the steps: firstly, starting from the angle of tensor data flow, providing a collaborative thermal optimization process combining a network, an architecture, physics and packaging; then, based on a quantitative modeling tensor data flow energy optimization method, automatically identifying the most energy-saving tensor data flow under given three-dimensional chip constraints by using a heuristic optimization method; and finally, providing a thermal sensing three-dimensional architecture spatial layout method, simplifying the spatial layout problem of the SRAM macro block into an affine mapping optimization problem, and optimizing an affine mapping relationship through a heuristic optimization method to obtain the spatial layout with optimal thermal performance. According to the method, the tensor calculation characteristics are optimized in a targeted manner, so that the three-dimensional stacked SRAM chip meets the thermal reliability requirement in a high-density integration scene.

The invention discloses a GaN chip packaging structure and method based on vertical interconnection and gradient thermal matching. The GaN chip packaging structure comprises a substrate, a wave absorbing layer is installed in the substrate in an embedded mode, a copper wire layer is installed on the substrate, and a thermal transition layer is sprayed on the copper wire layer; a GaN chip is mounted on the thermal transition layer, carbon nanotubes are vertically arrayed on a gate region of the GaN chip, and the carbon nanotubes are connected with an output end of a driving chip. The high-frequency performance breakthrough is that the parasitic inductance is reduced by more than 95%, the thermal reliability is improved, the CTE mismatch problem is thoroughly solved, the high-frequency noise is suppressed, and the wide-band shielding effectiveness is improved by 10 times.

The invention belongs to the technical field of thermal management and reliability optimization, and particularly discloses a heterogeneous hybrid switch unit thermal reliability optimization method based on a safe operation area, and the method comprises the following steps: S1, obtaining a corresponding two-dimensional safe operation area projection under a rated parameter according to the safe operation area of a heterogeneous hybrid switch unit, extracting a current maximum value Imax20 according to the regional projection; s2, acquiring a current load current IF, comparing the size of Imax20 with the size of IF, if Imax20 is greater than or equal to IF, performing S3, and if Imax20lt, performing S3; when IF, performing S4; s3, single parameter adjustment is carried out; s4, carrying out two-parameter adjustment; and S5, inputting the target optimization parameters into a PWM signal generation module, and generating SiC-based device and Si-based device driving signals corresponding to the target switching frequency and the SiC interruption proportion through cooperative work of the DSP and the FPGA, thereby expanding the safe operation area of the hybrid switch unit. The over-temperature risk of the hybrid switch unit is avoided, and the reliability of the hybrid switch unit is improved.

The application discloses a kind of temperature test methods for integrated circuit using pipe type electric heating technology, the inlet and outlet of compressor are connected to temperature control circuit by manual valve, temperature control circuit includes instrument wind main road, refrigerated water circuit, compressed air circuit and steam circuit, refrigerated water circuit is in turn through and communicate mixed jar, reaction jar, condensate tank and constant pressure tank, form cooling medium circulation path, utilize the heat of integrated circuit test environment in reaction jar by refrigerated water absorption, and discharge waste heat by condensate tank;During temperature regulation process, integrated circuit is placed in reaction jar test station, and the current, voltage and frequency parameters of temperature point are recorded by data acquisition module, and thermal reliability evaluation report is generated.The application balances pressure fluctuation in real time by hierarchical compensation strategy, generates thermal reliability report by combining comprehensive data acquisition and professional evaluation algorithm.The scheme significantly improves test efficiency and result reliability.

A heating system and its control method based on a heat pump to enhance the temperature difference of energy storage, relating to the field of solar thermal energy storage heating technology. Solar collectors are connected to user-side hot water storage tanks to form a user-side decentralized heat collection-storage loop. The user-side hot water storage tanks are connected to hot water supply devices and radiant heat dissipation devices to form a user-side heating loop. The user-side hot water storage tanks are connected to the heating network to form a user-network loop. The auxiliary heating system includes buffer tanks, a water source heat pump, and a hot water storage tank. Based on the water temperature conditions of the solar collectors, user-side hot water storage tanks, buffer tanks, and hot water storage tanks, as well as changes in user demand, a suitable loop is selected for operation. The system offers multiple heating modes that can be switched according to user needs, enabling the sharing and absorption of heat from all users throughout the year, improving the system's heating reliability and overall energy utilization rate.

The invention relates to a transient liquid phase connection method based on a composite laminated structure, belongs to the technical field of power semiconductor packaging interconnection, and mainly solves the problems of poor joint reliability and poor high-temperature service performance caused by insufficient solder wettability and narrow process window in the traditional transient liquid phase connection technology. According to the method, a symmetric composite laminated structure of a Cu substrate / Sn-Cu soldering paste / Cu-Ni alloy sheet / Sn-Cu soldering paste / Cu substrate is constructed, optimized printing process parameters are combined, and the good wetting characteristic of the Sn-Cu soldering paste and the microalloying effect of the Ni element in the Cu-Ni alloy sheet are utilized in the welding process, so that the interface bonding quality is remarkably improved, and the formation of (Cu, Cu)-Cu-Ni alloy sheets at low temperature is promoted; and a high-melting-point and compact all-intermetallic compound joint mainly comprising Ni) Sn. The obtained joint is low in porosity and high in heat conductivity and has excellent mechanical and thermal reliability at high temperature, the process is compatible with an existing production line, and a high-feasibility and low-cost packaging solution is provided for a high-power semiconductor device.

The application discloses a GaN chip packaging structure and method based on vertical interconnection and gradient heat matching, which comprises a substrate, a wave-absorbing layer is embedded in the interior of the substrate, a copper wire layer is installed on the substrate, and a heat transition layer is sprayed on the copper wire layer; a GaN chip is installed on the heat transition layer, a vertical array of carbon nanotubes is arranged on the gate region of the GaN chip, and the output end of a driving chip is connected to the carbon nanotubes. High-frequency performance breakthrough: parasitic inductance is reduced by more than 95%, thermal reliability is improved: CTE mismatch problem is completely solved, high-frequency noise suppression: wide-band shielding efficiency is improved by 10 times.

The application provides a high-power-density PCB-based thermal design method, which comprises the following steps: firstly, a power loss mathematical model of a heat source on a PCB is established, and a PCB thermal simulation model is established according to the power loss mathematical model; secondly, chip-level, board-level and system-level thermal analysis is performed on the PCB according to the thermal simulation result; then, thermal-structure improvement is performed on the PCB according to the thermal analysis result, so that the power density of the PCB is improved while the heat dissipation capacity is ensured; finally, a heat dissipation device is added to the improved PCB corresponding to the heat source, and the structure parameters of the heat dissipation device are optimized through a genetic algorithm. The method can improve the power density of the PCB, so that the system has good heat dissipation capacity and high thermal reliability.

The application relates to a steady-state thermal simulation method based on a neural network and a medium thereof, and particularly relates to the technical field of thermal simulation. A multi-step convolutional neural network framework is constructed through a three-dimensional convolutional neural network, a heat source of an AI chip is decomposed into a GPU module and an HBM module, and non-parametric and parametric thermal simulations are respectively performed; through the introduction of physical information constraints, the thermal coupling effect between the GPU and the HBM is embedded into the network structure, and the training efficiency and the solving accuracy are improved; based on dataset generation and three-dimensional convolutional feature extraction, fast temperature field prediction is realized. Under the premise of ensuring accuracy, the application significantly reduces the consumption of computing resources, and is suitable for thermal reliability verification of a complex chip system.

Provided in the present invention is a heat dissipation structure for an on-board power transistor, the heat dissipation structure comprising: a PCB, power transistors attached to the PCB, and a heat sink corresponding to heat dissipation surfaces of the power transistors, wherein one or more dam structures are provided on the surface of the heat sink attached to the heat dissipation surfaces of the power transistors; thermal interface materials are provided in an area enclosed by the dam structures; and the heat dissipation surfaces of the power transistors are attached to the thermal interface materials. In the present invention, by means of integrating a thermally conductive insulating layer and the heat sink, it is unnecessary to additionally mount an insulating member, thereby simplifying the manufacturing process and improving production efficiency; and by means of using the dam structures arranged on the heat sink to confine thermally conductive materials inside dams, the problems of lateral shifting, sagging, etc., of the thermally conductive materials caused by the impact of temperature change and vibration factors are prevented, thereby improving the thermal reliability of a power supply device.

The application discloses a kind of hybrid device conduction mode threshold self-adaptive adjustment method based on temperature feedback, belong to new energy automobile inverter technical field.The present application includes sampling, temperature of SIC MOSFET and temperature of IGBT are calculated in turn, the inflection point voltage of SIC MOSFET conduction resistance resistance and IGBT is calculated, switching current threshold is obtained, finally, switching of switch element conduction mode according to established rule.The present application dynamically adjusts switching current threshold I knee , so that under high temperature condition, hybrid power device can enter by conduction mode 2 under lower load current, and IGBT can effectively share the thermal load of SIC MOSFET.This method realizes the dynamic balance of heat distribution between devices, reduces the thermal stress of SIC MOSFET, while ensuring the thermal reliability of the system without increasing overall power loss.

The present invention discloses a hybrid device driving voltage parameter design method considering thermal reliability optimization, comprising the following steps: step S1, real-time monitoring of the junction temperature of the hybrid device through a loss model and a thermal network model; step S2, determining whether the SiC MOSFET has an over-temperature phenomenon caused by a heavy load; step S3, in the case of determining that the over-temperature phenomenon is caused by a heavy load, if the actual adjustable driving voltage range is V min ~V max , then the design driving voltage parameter is V GM =V min 、V GT =V max , which minimizes the loss of SiC MOSFET and reduces its junction temperature; where V GM 、V GT are the driving voltages of SiC MOSFET and Si IGBT respectively. The present invention solves the problem of SiC MOSFET being prone to overheating under heavy load while ensuring converter efficiency.

The invention belongs to the technical field of three-dimensional integrated circuit thermal management. The invention provides a TSV thermal modeling method based on a physical information neural network. According to the embodiment of the invention, the PINN model is constructed, and the multi-stage training strategy and the systematized sensitivity analysis experiment are combined, so that high-precision and high-efficiency prediction of the TSV temperature field is realized. According to the method, the precision better than that of a traditional machine learning method can be achieved only through a small amount of training data, the extrapolation capability is excellent, the prediction result strictly follows the physical law, a novel technical means is provided for thermal reliability design of a three-dimensional integrated circuit, and the design efficiency and the model credibility are remarkably improved.

The utility model belongs to the field of electronic information equipment design, and particularly relates to light and thunder integrated reconnaissance equipment. The overall structural links of radar and photoelectric structures are bloated, the portable requirement cannot be met, and the heating problem is relatively prominent. The bottom end of a spindle of photoelectric azimuth assembly equipment is fixedly mounted on a base, a photoelectric servo shell is driven by photoelectric azimuth driving assembly equipment to perform azimuth rotation, and photoelectric pitching driving assembly equipment is mounted at one end of the photoelectric servo shell. The pitching C ring shaft and the rotating shaft at the other end of the photoelectric servo shell drive the photoelectric equipment to rotate in a pitching manner; a radar assembly equipment main shaft is fixedly installed on the upper side of a photoelectric azimuth assembly equipment main shaft, and a radar sensing unit is installed at the upper end of a radar servo shell. A heat absorbing body is installed in the internal heat source area, and heat is guided out to a heat dissipation body outside the case through a heat pipe for natural heat dissipation. The design link of the servo mechanism is simplified, and light weight of the servo mechanism is ensured; and thermal reliability of equipment is ensured.

The invention provides a vehicle-mounted power tube heat dissipation structure which comprises a PCB, a power tube attached to the PCB and a radiator corresponding to the heat dissipation face of the power tube, one face, attached to the heat dissipation face of the power tube, of the radiator is provided with one or more cofferdam structures, and a heat conduction interface material is arranged in an area defined by the cofferdam structures. The heat dissipation surface of the power tube is attached to the heat conduction interface material. The heat conduction insulating layer and the radiator are integrated, no extra insulating part needs to be installed, the manufacturing process is simplified, and the production efficiency is improved. And through the cofferdam structure arranged on the radiator, the heat conduction material is limited in the cofferdam, so that the problems of horizontal slippage, vertical flow and the like of the heat conduction material under the influence of temperature change and vibration factors are prevented, and the thermal reliability of the power supply device is improved.

This invention discloses a heat recovery air conditioning unit and its control method, device, and storage medium, belonging to the field of air conditioning technology. When the heat recovery air conditioning unit meets the overall electrical control overheating protection conditions, this invention detects the outdoor ambient temperature sensor temperature of the outdoor unit, the outlet water temperature of the water tank, and the ambient temperature of the indoor unit; and adjusts the operating frequency of the compressor of the heat recovery air conditioning unit based on these parameters. In this way, when the heat recovery air conditioning unit meets the electrical control overheating protection conditions, the compressor operating frequency is adjusted while simultaneously considering the outlet water temperature of the water tank and the ambient temperature of the indoor unit, resulting in more accurate electrical control overheating and more efficient and reliable unit operation.