59 results about "Thermal reliability" patented technology

The invention discloses a heat dissipation method of a processor, computer equipment, a storage medium and a program product, and relates to the technical field of processor heat dissipation, and the method comprises the following steps: when a target processor power consumption mode is a high power consumption mode, obtaining a target temperature difference and a target processor utilization rate, mapping the target temperature difference and the target processor utilization rate to a corresponding fuzzy set by utilizing a Gaussian function, determining and determining a target value of a heat dissipation parameter combination based on a target temperature difference membership degree and a target processor utilization rate membership degree, and further adjusting the rotating speed of a fan corresponding to a target processor; when the power consumption mode of the target processor is a low-power-consumption mode, a first value of a current temperature set point of the target processor and a second value of an expected temperature set point of the target processor are obtained, and the wind direction of a fan corresponding to the target processor is adjusted based on the first value and the second value. The technical problem that a single heat dissipation strategy is difficult to meet the heat dissipation requirements of different processors is solved, and the technical effect of improving the heat dissipation reliability of the processors is achieved.

The invention belongs to the technical field of electric heating joint optimization scheduling, and discloses a cold region novel power system flexibility improvement method and system based on heat supply network inertia, and the method comprises the steps: fusing the inertia characteristics of a heat supply network, building an electric heating cooperation model, and achieving the whole-cycle cost minimization solving and flexibility quantitative evaluation through the combination of multiple constraints, and a heat storage adjusting space is provided for the system according to the heat delay and heat loss characteristics of heat supply network inertia, the CHP unit is allowed to preferentially respond to power dispatching on the premise that heat supply stability is guaranteed, the straight condensing thermal power unit is allowed to adjust power supply and demand through climbing, a heat pump supplements a heat supply gap, and the flexible adjusting capacity of the system is greatly improved. The whole-cycle cost optimization target reduces unit operation and wind and light abandoning losses, multi-dimensional flexibility index quantification verifies the remarkable improvement effect of heat supply network inertia on the flexibility of a power grid, the stable operation capacity of a power system under high-proportion new energy access is enhanced, and the winter heat supply reliability of the cold region is guaranteed.

This invention belongs to the field of oil supply, lubrication, and cooling technology for aero-engine bearings. It provides a method for temperature control and parameter optimization design of under-ring lubricated bearings. The method includes: generating sample data on total heat generation, bearing element temperature, and oil slingering temperature of the bearing through experiments or simulations based on bearing structural parameters and operating condition parameters; constructing a predictive model with the parameters as input and thermal-fluid performance as output; quantifying the influence of input parameters using global sensitivity analysis, screening key design parameters, and constructing a multi-objective optimization model with the objectives of minimizing bearing element temperature control accuracy and total heat generation; solving the model to obtain the Pareto optimal solution set, and determining the optimal combination of structure and oil supply parameters that satisfies the oil slingering temperature safety constraint and bearing thermal reliability requirements while achieving optimal overall performance. This invention is applicable to the refined design of high-speed bearings in rotating machinery such as aero-engines, enabling precise temperature control and coordinated energy consumption optimization.

The invention discloses a heat supply system, method and equipment based on chemical looping electricity storage. The heat supply system comprises an energy storage unit and an energy release unit which achieve energy coupling through a metal-oxygen carrier exchange system. The energy storage unit comprises a heat pump assembly, a reduction reactor and a first heat exchange assembly, the heat pump assembly and the reduction reactor are both connected with the first heat exchange assembly, and water flowing through the heat pump assembly exchanges heat with oxygen discharged by the reduction reactor through the first heat exchange assembly; the energy release unit comprises an oxidation reactor and a second heat exchange assembly, the oxidation reactor is connected with the second heat exchange assembly, and water flowing into the second heat exchange assembly exchanges heat with flue gas discharged by the oxidation reactor. By combining a chemical looping electricity storage technology with a heat supply system, electric energy is converted into high-density chemical energy by using a reduction reactor and stored in a metal oxygen carrier in the period of sufficient green electricity; and during the period of insufficient green power, chemical energy stored in the metal oxygen carrier is released by using the oxidation reactor and is used for producing hot water or steam. According to the system, cross-time-space conversion and flexible scheduling among electric energy, chemical energy and heat energy are achieved, so that the comprehensive utilization efficiency of energy and the heat supply reliability are improved, and meanwhile the operation cost is reduced.

The invention discloses an intelligent optimization method for power-memory-computing three-dimensional packaging heat dissipation reliability based on heterogeneous integration, and belongs to the technical field of advanced packaging and thermal management of integrated circuits. The method comprises the following steps: firstly, determining packaging structure parameters, and obtaining a sample data set through a mixed horizontal orthogonal test and finite element thermal simulation; secondly, on the basis of signal-to-noise ratio and range analysis, the influence weight of each parameter on the junction temperature is quantified, key parameters and secondary parameters are distinguished, the secondary parameters are fixed to the optimal level, the key parameters are determined, and the thermal simulation model is corrected; then training a random forest regression model based on all test data, and constructing an agent model; and finally, performing automatic collaborative optimization on the specific size of each layer of chip by adopting an NSGA-II multi-target genetic algorithm according to the proxy model, so as to minimize the highest junction temperature at the same time. According to the method, high-cost physical simulation is converted into an efficient intelligent optimization process, and the thermal reliability, the design efficiency and the product performance stability of packaging are remarkably improved.

The invention discloses a preparation method of a silicon carbide trench gate type MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) power device. The preparation method comprises six steps of substrate buffer layer deposition, gate oxide layer preparation, trench etching, gate metal layer deposition, source and drain region ion implantation and source and drain metal layer deposition and annealing. In the preparation process, a multi-physics field coupling dynamic thermal resistance model, a multi-working-condition thermal reliability boundary algorithm, a full-working-area variable temperature parameter fitting model and a power device multi-parameter calibration platform are integrated, technological parameters of all steps are set through model calculation and algorithm analysis, and key performance parameters of the device are detected in real time and dynamically adjusted by means of the calibration platform. According to the method, the problems of non-uniform heat distribution, stress concentration, insufficient parameter fitting and calibration deficiency in traditional preparation are solved, the interface bonding quality of the buffer layer and the metal layer and the electrical property consistency of the device are improved, the thermal reliability and the working efficiency of the device are enhanced, and the application requirement of a high-voltage high-power power electronic system for a core device is met.

The invention provides a maintenance auxiliary device for improving the heat supply reliability of a heat supply network system. The filtering assembly is arranged at the top of the moving assembly, and the filtering assembly comprises a shell. According to the auxiliary maintenance device for improving the heat supply reliability of the heat supply network system, through mutual cooperation of the moving assembly, the filtering assembly, the flow guide assembly, the connecting assembly and other structures, when the auxiliary maintenance device is used, a connecting pipe can be directly in butt joint with a heat supply pipeline, and hot water containing impurities flows into a filter drum through an input pipe to be filtered; the filtered wastewater flows back to the pipeline through the output pipe, and a large amount of external water resources are not consumed, so that the water resources are recycled, and environmental pollution caused by wastewater discharge is avoided; meanwhile, the device can be conveniently and flexibly moved to different operation points through the moving assembly, temporary equipment building is not needed, the heat supply network pipeline impurity cleaning efficiency is improved, faults such as valve jamming and heat exchanger blockage are reduced, and the heat supply reliability of a heat supply network system is guaranteed.

The application relates to the technical field of H-bridge power devices, and provides an H-bridge power device based on a BCD process, which adopts a central symmetry layout on a semiconductor substrate and comprises parallel VDD and GND metal buses and an output metal port; the VDD and GND metal buses respectively extend a plurality of power metal strips which are parallel to each other and are alternately arranged towards the output port; each power metal strip has a width gradient structure and a round-corner transition edge corner which are continuous from the bus to the port direction; and the power metal strip is connected with an underlying power transistor active area through a contact hole array; the device is configured through specific shape and size, so that the metal path resistances from the VDD and the GND to the output end are equal, thereby realizing uniform distribution of current, reducing parasitic parameters, improving switching speed, and significantly improving the thermal reliability and overall reliability of the device.

To provide a composition for a clad from which an optical waveguide having improved thermal reliability can be obtained.SOLUTION: A composition for a clad, which is usable in a clad of an optical waveguide, contains a cyclic olefin resin (A), and polyfunctional (meth)acrylate (B).SELECTED DRAWING: None

The invention discloses a three-dimensional chip thermal perception optimization method based on tensor data flow, and relates to the field of integrated circuits, and the method comprises the steps: firstly, starting from the angle of tensor data flow, providing a collaborative thermal optimization process combining a network, an architecture, physics and packaging; then, based on a quantitative modeling tensor data flow energy optimization method, automatically identifying the most energy-saving tensor data flow under given three-dimensional chip constraints by using a heuristic optimization method; and finally, providing a thermal sensing three-dimensional architecture spatial layout method, simplifying the spatial layout problem of the SRAM macro block into an affine mapping optimization problem, and optimizing an affine mapping relationship through a heuristic optimization method to obtain the spatial layout with optimal thermal performance. According to the method, the tensor calculation characteristics are optimized in a targeted manner, so that the three-dimensional stacked SRAM chip meets the thermal reliability requirement in a high-density integration scene.

The invention belongs to the technical field of thermal management and reliability optimization, and particularly discloses a heterogeneous hybrid switch unit thermal reliability optimization method based on a safe operation area, and the method comprises the following steps: S1, obtaining a corresponding two-dimensional safe operation area projection under a rated parameter according to the safe operation area of a heterogeneous hybrid switch unit, extracting a current maximum value Imax20 according to the regional projection; s2, acquiring a current load current IF, comparing the size of Imax20 with the size of IF, if Imax20 is greater than or equal to IF, performing S3, and if Imax20lt, performing S3; when IF, performing S4; s3, single parameter adjustment is carried out; s4, carrying out two-parameter adjustment; and S5, inputting the target optimization parameters into a PWM signal generation module, and generating SiC-based device and Si-based device driving signals corresponding to the target switching frequency and the SiC interruption proportion through cooperative work of the DSP and the FPGA, thereby expanding the safe operation area of the hybrid switch unit. The over-temperature risk of the hybrid switch unit is avoided, and the reliability of the hybrid switch unit is improved.

The application discloses a kind of temperature test methods for integrated circuit using pipe type electric heating technology, the inlet and outlet of compressor are connected to temperature control circuit by manual valve, temperature control circuit includes instrument wind main road, refrigerated water circuit, compressed air circuit and steam circuit, refrigerated water circuit is in turn through and communicate mixed jar, reaction jar, condensate tank and constant pressure tank, form cooling medium circulation path, utilize the heat of integrated circuit test environment in reaction jar by refrigerated water absorption, and discharge waste heat by condensate tank;During temperature regulation process, integrated circuit is placed in reaction jar test station, and the current, voltage and frequency parameters of temperature point are recorded by data acquisition module, and thermal reliability evaluation report is generated.The application balances pressure fluctuation in real time by hierarchical compensation strategy, generates thermal reliability report by combining comprehensive data acquisition and professional evaluation algorithm.The scheme significantly improves test efficiency and result reliability.

A heating system and its control method based on a heat pump to enhance the temperature difference of energy storage, relating to the field of solar thermal energy storage heating technology. Solar collectors are connected to user-side hot water storage tanks to form a user-side decentralized heat collection-storage loop. The user-side hot water storage tanks are connected to hot water supply devices and radiant heat dissipation devices to form a user-side heating loop. The user-side hot water storage tanks are connected to the heating network to form a user-network loop. The auxiliary heating system includes buffer tanks, a water source heat pump, and a hot water storage tank. Based on the water temperature conditions of the solar collectors, user-side hot water storage tanks, buffer tanks, and hot water storage tanks, as well as changes in user demand, a suitable loop is selected for operation. The system offers multiple heating modes that can be switched according to user needs, enabling the sharing and absorption of heat from all users throughout the year, improving the system's heating reliability and overall energy utilization rate.

The invention relates to a transient liquid phase connection method based on a composite laminated structure, belongs to the technical field of power semiconductor packaging interconnection, and mainly solves the problems of poor joint reliability and poor high-temperature service performance caused by insufficient solder wettability and narrow process window in the traditional transient liquid phase connection technology. According to the method, a symmetric composite laminated structure of a Cu substrate / Sn-Cu soldering paste / Cu-Ni alloy sheet / Sn-Cu soldering paste / Cu substrate is constructed, optimized printing process parameters are combined, and the good wetting characteristic of the Sn-Cu soldering paste and the microalloying effect of the Ni element in the Cu-Ni alloy sheet are utilized in the welding process, so that the interface bonding quality is remarkably improved, and the formation of (Cu, Cu)-Cu-Ni alloy sheets at low temperature is promoted; and a high-melting-point and compact all-intermetallic compound joint mainly comprising Ni) Sn. The obtained joint is low in porosity and high in heat conductivity and has excellent mechanical and thermal reliability at high temperature, the process is compatible with an existing production line, and a high-feasibility and low-cost packaging solution is provided for a high-power semiconductor device.

The application discloses a GaN chip packaging structure and method based on vertical interconnection and gradient heat matching, which comprises a substrate, a wave-absorbing layer is embedded in the interior of the substrate, a copper wire layer is installed on the substrate, and a heat transition layer is sprayed on the copper wire layer; a GaN chip is installed on the heat transition layer, a vertical array of carbon nanotubes is arranged on the gate region of the GaN chip, and the output end of a driving chip is connected to the carbon nanotubes. High-frequency performance breakthrough: parasitic inductance is reduced by more than 95%, thermal reliability is improved: CTE mismatch problem is completely solved, high-frequency noise suppression: wide-band shielding efficiency is improved by 10 times.

The application provides a high-power-density PCB-based thermal design method, which comprises the following steps: firstly, a power loss mathematical model of a heat source on a PCB is established, and a PCB thermal simulation model is established according to the power loss mathematical model; secondly, chip-level, board-level and system-level thermal analysis is performed on the PCB according to the thermal simulation result; then, thermal-structure improvement is performed on the PCB according to the thermal analysis result, so that the power density of the PCB is improved while the heat dissipation capacity is ensured; finally, a heat dissipation device is added to the improved PCB corresponding to the heat source, and the structure parameters of the heat dissipation device are optimized through a genetic algorithm. The method can improve the power density of the PCB, so that the system has good heat dissipation capacity and high thermal reliability.

The application relates to a steady-state thermal simulation method based on a neural network and a medium thereof, and particularly relates to the technical field of thermal simulation. A multi-step convolutional neural network framework is constructed through a three-dimensional convolutional neural network, a heat source of an AI chip is decomposed into a GPU module and an HBM module, and non-parametric and parametric thermal simulations are respectively performed; through the introduction of physical information constraints, the thermal coupling effect between the GPU and the HBM is embedded into the network structure, and the training efficiency and the solving accuracy are improved; based on dataset generation and three-dimensional convolutional feature extraction, fast temperature field prediction is realized. Under the premise of ensuring accuracy, the application significantly reduces the consumption of computing resources, and is suitable for thermal reliability verification of a complex chip system.

Provided in the present invention is a heat dissipation structure for an on-board power transistor, the heat dissipation structure comprising: a PCB, power transistors attached to the PCB, and a heat sink corresponding to heat dissipation surfaces of the power transistors, wherein one or more dam structures are provided on the surface of the heat sink attached to the heat dissipation surfaces of the power transistors; thermal interface materials are provided in an area enclosed by the dam structures; and the heat dissipation surfaces of the power transistors are attached to the thermal interface materials. In the present invention, by means of integrating a thermally conductive insulating layer and the heat sink, it is unnecessary to additionally mount an insulating member, thereby simplifying the manufacturing process and improving production efficiency; and by means of using the dam structures arranged on the heat sink to confine thermally conductive materials inside dams, the problems of lateral shifting, sagging, etc., of the thermally conductive materials caused by the impact of temperature change and vibration factors are prevented, thereby improving the thermal reliability of a power supply device.

The application discloses a kind of hybrid device conduction mode threshold self-adaptive adjustment method based on temperature feedback, belong to new energy automobile inverter technical field.The present application includes sampling, temperature of SIC MOSFET and temperature of IGBT are calculated in turn, the inflection point voltage of SIC MOSFET conduction resistance resistance and IGBT is calculated, switching current threshold is obtained, finally, switching of switch element conduction mode according to established rule.The present application dynamically adjusts switching current threshold I knee , so that under high temperature condition, hybrid power device can enter by conduction mode 2 under lower load current, and IGBT can effectively share the thermal load of SIC MOSFET.This method realizes the dynamic balance of heat distribution between devices, reduces the thermal stress of SIC MOSFET, while ensuring the thermal reliability of the system without increasing overall power loss.

The invention belongs to the technical field of three-dimensional integrated circuit thermal management. The invention provides a TSV thermal modeling method based on a physical information neural network. According to the embodiment of the invention, the PINN model is constructed, and the multi-stage training strategy and the systematized sensitivity analysis experiment are combined, so that high-precision and high-efficiency prediction of the TSV temperature field is realized. According to the method, the precision better than that of a traditional machine learning method can be achieved only through a small amount of training data, the extrapolation capability is excellent, the prediction result strictly follows the physical law, a novel technical means is provided for thermal reliability design of a three-dimensional integrated circuit, and the design efficiency and the model credibility are remarkably improved.

The invention provides a vehicle-mounted power tube heat dissipation structure which comprises a PCB, a power tube attached to the PCB and a radiator corresponding to the heat dissipation face of the power tube, one face, attached to the heat dissipation face of the power tube, of the radiator is provided with one or more cofferdam structures, and a heat conduction interface material is arranged in an area defined by the cofferdam structures. The heat dissipation surface of the power tube is attached to the heat conduction interface material. The heat conduction insulating layer and the radiator are integrated, no extra insulating part needs to be installed, the manufacturing process is simplified, and the production efficiency is improved. And through the cofferdam structure arranged on the radiator, the heat conduction material is limited in the cofferdam, so that the problems of horizontal slippage, vertical flow and the like of the heat conduction material under the influence of temperature change and vibration factors are prevented, and the thermal reliability of the power supply device is improved.

This invention discloses a heat recovery air conditioning unit and its control method, device, and storage medium, belonging to the field of air conditioning technology. When the heat recovery air conditioning unit meets the overall electrical control overheating protection conditions, this invention detects the outdoor ambient temperature sensor temperature of the outdoor unit, the outlet water temperature of the water tank, and the ambient temperature of the indoor unit; and adjusts the operating frequency of the compressor of the heat recovery air conditioning unit based on these parameters. In this way, when the heat recovery air conditioning unit meets the electrical control overheating protection conditions, the compressor operating frequency is adjusted while simultaneously considering the outlet water temperature of the water tank and the ambient temperature of the indoor unit, resulting in more accurate electrical control overheating and more efficient and reliable unit operation.

The invention provides a multi-heat-source load optimization scheduling method and system, and belongs to the technical field of multi-heat-source scheduling, and the method specifically comprises the steps: taking other heat sources of heat supply management heat users crossed with heat sources as associated heat sources, and taking associated heat sources which do not need to be subjected to cooperative load scheduling processing as other associated heat sources; determining scheduling influence types of other associated heat sources by utilizing a cooperative load scheduling processing strategy of the heat sources and other heat sources and the intersection condition of the heat sources and the other heat sources and heat supply management heat users of the other associated heat sources, and according to the scheduling influence types of the other associated heat sources of different heat sources and cooperative load scheduling processing data, scheduling the heat sources according to the scheduling influence types of the other associated heat sources and the cooperative load scheduling processing data. And the synchronous load scheduling processing strategy of the multiple heat sources is determined, so that the heat utilization reliability of the heat users is improved.

This invention relates to the field of thermal protection technology for hypersonic vehicle propulsion systems, and proposes a method for analyzing the flow and heat transfer characteristics of microchannels with different truncated fin configurations. The steps include: constructing regenerative cooling microchannels; introducing supercritical hydrocarbon fuel into the regenerative cooling microchannels and applying wall heat flux to the heated section; setting at least four different truncated fin arrangement configurations; obtaining the flow and heat transfer parameters of the microchannels under each configuration through numerical simulation; evaluating the ability of each configuration to suppress heat transfer degradation of supercritical hydrocarbon fuel, the degree of improvement in thermophysical stratification, and the overall heat transfer performance based on the flow and heat transfer parameters; and selecting the optimal truncated fin arrangement configuration based on the evaluation results. This invention successfully realizes the transformation from a state dominated by natural convection prone to heat transfer degradation to a state of efficient forced convection heat transfer, improving the thermal reliability of the regenerative cooling system and providing an important reference for topology optimization of high-performance aero-engine thermal protection systems.

The embodiment of the application provides an engine preheating method, a vehicle and a computer readable storage medium, the method comprises the following steps: in response to a preheating trigger signal, obtaining at least one temperature information affecting fuel volatility; in the case that the temperature indicated by the at least one temperature information meets a preset temperature threshold condition, determining a target heating power according to a preheating scene category and / or vehicle state information, wherein the preheating scene category is used to represent the urgency of the preheating demand, and the vehicle state information is used to represent the energy supply capacity of a power battery in the vehicle and the health degree of a heating module in the vehicle; and controlling the heating module to preheat the engine according to the target heating power. The application solves the technical problems of low energy utilization and poor preheating reliability caused by the fact that the engine preheating method in the related art mostly uses fixed heating power for preheating.

The invention relates to the technical field of power device packaging reliability evaluation, and discloses a packaging thermal reliability digital twin simulation method and system, and the method comprises the steps: constructing a digital twin constructing a packaging body geometric model and a multi-physical field finite element model, and generating an initial thermal resistance matrix; a temperature data acquisition and preprocessing step: acquiring temperature data and carrying out filtering processing; a parameter online fusion step: fusing the measured value and the simulation value by using an extended Kalman filter, and dynamically correcting the interface thermal resistance; a cumulative damage life prediction step: calculating cumulative damage based on the fatigue model, and generating residual life probability distribution; and a lightweight edge deployment step: training the proxy model through knowledge distillation and deploying the proxy model to an edge device. The method solves the problems of difficult parameter calibration, difficult tracking of thermal resistance drift and limited edge deployment in the prior art.

The application relates to the technical field of IGBT module packaging structure, in particular to an IGBT module low parasitic parameter packaging structure. The IGBT module low parasitic parameter packaging structure comprises a bottom plate, the bottom plate is detachably connected with a shell, the bottom plate is fixedly connected with a mounting shell, a plurality of chips are mounted on the mounting shell, the mounting shell is detachably connected with a sealing cover, a cooling water pipe is fixedly connected in the mounting shell, the cooling water pipe penetrates through the bottom plate and the sealing cover, the cooling water pipe is communicated with an automobile cooling device, and the cooling water pipe is fixedly connected with symmetrically-distributed water inlet pipes and symmetrically-distributed water outlet pipes. The flow path of the cooling liquid is adjusted by changing the communication state of the symmetrically-distributed water inlet pipes and the symmetrically-distributed water outlet pipes, the preferential cooling area of the cooling liquid is dynamically adjusted, the heat distribution in the IGBT module is more balanced, the formation of local hot spots is reduced, and the thermal reliability of the module as a whole is improved.

The application discloses a micro-reservoir anti-pumping thermal interface structure of a power module thermal interface material, which comprises a substrate, a micro-reservoir array arranged on the substrate and a thermal interface material filled in the micro-reservoirs and interface gaps. The micro-reservoir array is distributed in a region outside a heat spreading angle heat transfer range of the substrate and comprises a plurality of periodically arranged micro-reservoir units, each of which is a groove structure recessed to the inside of the substrate. The application realizes the self-supply function of the thermal interface material by using the capillary action of the micro-reservoirs, and the micro-reservoir structure plays a role of elastic buffering, reduces the rigidity of the connecting interface, effectively inhibits the pumping effect and reduces the thermal fatigue damage, thereby significantly improving the long-term thermal reliability of the power module while ensuring the high thermal conductivity.

This invention relates to the field of thermal insulation testing technology, and provides a semiconductor wafer thermal insulation testing device, including a base, a test chamber mounted on top of the base, and a base plate mounted on the bottom wall of the test chamber for positioning the semiconductor wafer at its initial position. A temperature measuring component is provided at the bottom of the base plate. The test chamber has a vertically movable cover platform inside, a heat flow assembly on the outside of the test chamber, and a localized instantaneous heating assembly inside the cover platform. The localized instantaneous heating assembly includes a toothed ring pillar rotatably disposed inside the cover platform and at least three thermal shock test plates evenly distributed along the circumference of the toothed ring pillar. A slidable thermal insulation base is provided at the bottom end of each thermal shock test plate. In use, this invention integrates global steady-state and localized transient thermal testing, enabling not only the evaluation of the wafer's macroscopic thermal insulation performance but also the identification of microscopic thermal stress defects by reproducing instantaneous overheating scenarios, thereby achieving a precise and comprehensive assessment of its thermal reliability.

The embodiment of the invention provides terminal equipment. The terminal equipment comprises a shell, a camera module, a ventilation channel and a fan. The shell comprises a cover body and a decorating part arranged on the cover body, the camera module can be placed in the decorating part, the ventilation channel is arranged in an accommodating cavity of the decorating part, and the air inlet and the air outlet of the decorating part can be communicated through the ventilation channel. When the fan works, airflow is generated in the ventilation channel, the airflow flows along the ventilation channel, heat generated by the preset heating device of the shell is discharged, efficient active heat dissipation of the preset heating device is achieved, and the thermal reliability of the terminal equipment is improved. The fan can be located at the bottom of the camera module or can be located between the adjacent camera modules, the fan serving as the heat dissipation structure occupies a small area of the inner side plane of the cover body, and the influence on the layout and appearance design of internal devices of the terminal equipment is small.