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Consumption and junction temperature simulation system for power module

A technology for power modules and simulation systems, used in design optimization/simulation, special data processing applications, instruments, etc.

Active Publication Date: 2016-05-11
HANGZHOU SILAN INTEGRATED CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a power module loss and junction temperature simulation system to solve the existing technical problems

Method used

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  • Consumption and junction temperature simulation system for power module
  • Consumption and junction temperature simulation system for power module
  • Consumption and junction temperature simulation system for power module

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Embodiment Construction

[0091] The power module loss and junction temperature simulation system proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0092] Firstly, the concept of power module is introduced. The power module usually includes several IGBTs and several diodes. Each IGBT is paralleled with a diode. The loss of the power module includes the conduction loss of the IGBT, the switching loss of the IGBT, and the conduction loss of the diode. As well as the switching loss of the diode, the junction temperature of the power module includes the junction temperature of the IGBT a...

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Abstract

The invention provides a consumption and junction temperature simulation temperature for a power module. The consumption and junction temperature simulation system comprises a user interface unit and a background processing unit, wherein the user interface unit is used for receiving electric parameters and heat parameters of the power module, a model of the power module selected by a user, and a control algorithm used by the power module; the background processing unit is used for calculating consumption and junction temperature of the power module according to the electric parameters and the heat parameters of the power module, the model of the power module and the control algorithm used by the power module, and used for displaying the consumption and the junction temperature of the power module through the user interface unit. By adopting the consumption and junction temperature simulation system of the power module, calculation on the consumption and the junction temperature of the power module can be conveniently and rapidly achieved, precise results of the consumption and the junction temperature can be acquired, and convenience can be brought for engineers to simulate the thermal reliability situation of a system in circuit design.

Description

technical field [0001] The invention relates to the field of power modules, in particular to a power module loss and junction temperature simulation system. Background technique [0002] With the requirements of social development of energy conservation and environmental protection, energy conservation and emission reduction has become a technology vigorously promoted by enterprises. Converter is an important technology in the process of energy saving and emission reduction. Converters are used in various industries, such as switching power supply, motor drive, UPS and other fields. The power module is the core of the converter, and its thermal reliability is directly related to the reliability of the entire converter. [0003] Power modules usually include power switches and diodes. During use, the power consumption of the power module mainly comes from the internal power switch tube and diode. The loss of the power switch tube and diode includes conduction loss and swit...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/20G06F30/398
Inventor 柯攀胡一峰李祥
Owner HANGZHOU SILAN INTEGRATED CIRCUIT
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