49 results about "Dissipation factor" patented technology

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.

To provide hollow particles in which the dielectric dissipation factor is decreased, and the performance stability in high-humidity environment is improved. Hollow particles comprising a shell, which contains a resin, and a hollow portion surrounded by the shell, wherein the hollow particles have a void ratio of 50% or more; wherein the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more in 100% by mass of all monomer units of the polymer; and wherein an aqueous dispersion of the hollow particles, which is obtained by dispersing the hollow particles with a volume of 0.35 cm3 in 100 mL of deionized water, has a pH of 6.5 or more and 7.5 or less and a conductivity of 50 μS / cm or less.

The invention discloses a traction stretching motion state monitoring method based on signal processing, and relates to the technical field of signal processing, and the method comprises the following steps: collecting traction force, electrocardio, displacement and conductivity signals, carrying out normalization and filtering processing, extracting phase and amplitude components, and constructing a signal spectrum containing track change and time sequence characteristics; establishing a structure response mapping relation to generate a self-evolution feature map, and aligning the self-evolution feature map with the amplitude component to form a channel-level feature matrix and a multi-channel feature representation map; structural path perception convolution mapping is adopted, a path dissipation factor is introduced to extract deep features, direction enhancement is achieved in combination with an energy constraint factor and a scheduling matrix, and an energy adjustment feature map is obtained; finally, the features are spliced according to time steps to form a high-resolution sequence, signal optimization is achieved through iterative training, and the state recognition accuracy and stability are improved.

A laminate comprising one or more electrically conductive layers and one or more electrically insulating layers coupled to the electrically conductive layers. Each electrically conductive layer can comprise at least 90 wt% copper. Each electrically insulating layer can comprise a polymeric aerogel layer. For at least one of the opposing front and back surfaces of the laminate, at least a portion of the surface is defined by one of the electrically conductive layers.

To provide silica powder which has low frequency dependence of dielectric dissipation factor in a high frequency band.SOLUTION: Silica powder is kneaded at a ratio of 30 vol.% into a polypropylene resin to obtain a test composition which is then formed into a shape of a sheet having a thickness of 0.35 mm to 0.45 mm. The sheet, when measured for dielectric dissipation factor by a resonator method, has the ratio tanδ91 / tanδ10 between the dielectric dissipation factor tanδ10 measured at a frequency of 10 GHz and the dielectric dissipation factor tanδ91 measured at a frequency of 91 GHz of 1.6 or less.SELECTED DRAWING: None

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

A laminate comprising one or more conductive layers and one or more electrically insulating layers coupled to the conductive layers. Each conductive layer may include at least 90 wt% copper. Each electrically insulating layer may comprise a polymer aerogel layer. For at least one of the opposing front and rear surfaces of the laminate, at least a portion of the surface is defined by one of the conductive layers.

The present disclosure provides a compound represented by Formula (I) and a manufacturing method thereof, a resin composition comprising the compound, and an article made from the resin composition. The resin composition comprises the compound represented by Formula (I), vinyl group-containing polyphenylene ether resin and vinyl-containing crosslinking agent. The article comprises a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator that has improvements in one or more properties including glass transition temperature, dielectric constant, dissipation factor, thermal resistance after moisture absorption, flame retardancy, inner resin flow, and drop ball test.

Provided is a resin sheet which withstands adsorption and transportation by a vacuum adsorption pad for transportation, has low thermal expansion, and has a relative dielectric constant (Dk) of 2.50 to 3.30 in a high frequency band of 10 GHz band or more, and a dielectric dissipation factor (Df) of 0.0020 or less in a high frequency band of 10 GHz band or more. In addition, provided are a laminate, a printed wiring board, and a semiconductor package produced using the resin sheet. The resin sheet is specifically a resin sheet including a resin component (A), and an inorganic filler (B), in which the component (A) contains an elastomer (A1) having a number-average molecular weight of 10,000 or more, a content of the component (B) is 25 to 70 volume % based on a total amount of the resin sheet, and a breaking energy is 0.1 mJ / mm3 or more.

A glass substrate includes, in terms of molar percentage based on oxides: one or more alkaline-earth metal oxides in a total amount of 0.1 to 13%; Al2O3 and B2O3 in a total amount of 1 to 40%, in which a molar ratio of the contents represented by Al2O3 / (Al2O3+B2O3) is 0 to 0.45; at least one of ZnO and ZrO2 in a total amount of 1.5 to 4%; and SiO2 as a main component. The glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

The present invention provides a parallel binary model for measuring a capacitance value of a gate oxide layer of a gate oxide MOS device. The parallel binary model is a parallel circuit model formed through parallel connection of a parallel capacitor Cp and an equivalent resistor Rp. The parallel binary model is used to measure the gate oxide MOS device through an LCR meter by adopting frequency f1 to obtain parallel capacitance Cp1 and parallel conductance Gp1. A dissipation factor D1 is calculated. In a case that D1<0.1, the measured parallel capacitance Cp1 is the capacitance value of the gate oxide layer of the gate oxide MOS device. In a case that D1>0.1, the parallel binary model is used to measure the gate oxide MOS device through the LCR meter by adopting frequency f2 to obtain parallel capacitance Cp2 and parallel conductance Gp2.

The present invention provides a polyimide film having a dielectric constant (Dk) of 3.5 or less and a dielectric loss rate (Df) of 0.003 or less as measured at 10 GHz after being left for 24 hours in an environment of 85 DEG C and 85% RH.

The present disclosure relates to a composite film made of at least LCP and a fiber fabric, for example presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).

Embodiments in accordance with the present invention encompass compositions containing a blend of polymers formed from a variety of polycycloolefinic monomers at least one of which monomer contains an olefinic functionality and another monomer contains an anhydride functionality, melamine, montmorillonite and optionally other fillers such as silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.

A material sheet for circuit board fabrication is provided. The material sheet includes liquid crystal polymer (LCP) fibers impregnated in a dielectric having a dissipation factor between 0.004 and 0.0002.

To provide a resin sheet, a laminated sheet, a semiconductor device, and a method for producing the same that achieve superior productivity, allow excellent coatability even in cases where a plurality of semiconductor elements are covered collectively, and exhibit high reliability.SOLUTION: A resin sheet 12 for semiconductor sealing comprises a thermosetting composition containing a resin (A) and a crosslinking agent (B), the resin sheet 12 having an elongation at break of 10-400% at 23°C after being heated at 150°C for 1 hour, the resin sheet 12 having a relative permittivity of 3 or less at a frequency of 10 GHz and 23°C after being heated at 150°C for 1 hour, and also having a dielectric loss tangent of 0.01 or less at a frequency of 10 GHz and 23°C.SELECTED DRAWING: Figure 1

The present invention relates to a method, system, processing equipment and storage medium for measuring the acoustic dissipation factor of sediments. The method is characterized in that the method comprises: determining an excitation waveform for a simulation test on a pure waveguide phenomenon and an excitation waveform for an indoor transducer test on a test sample in a dissipation factor measurement system; based on the determined excitation waveform, performing a simulation test on the pure waveguide phenomenon to obtain a simulated receiving end voltage, and then determining a simulated maximum amplitude; based on the determined excitation waveform, performing an indoor transducer test on the test sample in the dissipation factor measurement system to obtain a wave velocity and a test receiving end signal, and then determining a test maximum amplitude; and calculating a dissipation factor that only considers absorption attenuation based on the simulated maximum amplitude and the test maximum amplitude. The present invention can be widely applied to the technical field of geotechnical testing.

A glass substrate for high-frequency devices includes, in terms of molar percentage based on oxides: one or more alkaline-earth metal oxides in a total amount of 0.1 to 13%; Al2O3 and B2O3 in a total amount of 1 to 40%, in which a molar ratio of the contents represented by Al2O3 / (Al2O3+B2O3) is 0 to 0.45; at least one oxide selected from the group consisting of Sc2O3, TiO2, ZnO, Ga2O3, GeO2, Y2O3, ZrO2, Nb2O5, In2O3, TeO2, HfO2, Ta2O5, WO3, Bi2O3, La2O3, Gd2O3, Yb2O3, and Lu2O3, in a total amount of 0.1 to 1.0%; and SiO2 as a main component. The glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ·cm or lower. The copper clad laminate is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board.

The present invention provides a multilayer polyimide film and a method for manufacturing same, the multilayer polyimide film comprising at least one skin layer, which is formed on at least one outer surface of a core layer, and having a dielectric dissipation factor of 0.003 or less and an adhesive force of 1,000 gf / cm or more.

A process for manufacturing a copper-clad laminate comprises forming a thermoplastic layer, forming a stack by laying up at least a first copper foil layer and the thermoplastic layer, and laminating the stack by application of heat and pressure for a time sufficient to form the copper-clad laminate. The thermoplastic layer is made from a composite comprising from 15 wt. %to 75 wt. %of a thermoplastic resin comprising a liquid crystal polymer having a melting temperature in a range of from 250℃ to 370℃; from 20 wt. %to 80 wt. %of a filler component comprising a first filler having an aspect ratio greater than 1, a second filler having a dielectric constant greater than 4.0 under 2.5 GHz, a third filler different from the first and the second filler, or any combinations thereof; and from 0 wt. %to 2 wt. %of an additive. The thermoplastic layer has a dielectric constant of greater than 3.5 under 2.5 GHz, a dielectric dissipation factor of no greater than 0.0050 under 2.5 GHz, a heat deflection temperature of higher than 240℃ and a fiexural strength of greater than about 100 MPa.

The application discloses a traction stretching motion state monitoring method based on signal processing and relates to the technical field of signal processing, which comprises the following steps: collecting traction force, electrocardio, displacement and conductivity signals, performing normalization and filtering processing, extracting phase and amplitude components, and constructing a signal atlas containing trajectory changes and timing characteristics; establishing a structural response mapping relationship to generate a self-evolution characteristic map, aligning the amplitude components to form a channel-level characteristic matrix and a multi-channel characteristic representation map; adopting structural path perception convolution mapping and introducing a path dissipation factor to extract deep features, combining an energy binding factor and a scheduling matrix to realize direction enhancement, and obtaining an energy regulation characteristic map; and finally, splicing the features according to time steps to form a high-resolution sequence, performing iterative training to realize signal optimization, and improving state recognition accuracy and stability.

A copper clad laminate is provided that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate. The copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHZ, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ·cm or lower.

A polymer composition that comprises a laser activatable additive, fibrous filler, and dielectric material distributed within a polymer matrix is provided. The polymer matrix contains at least one thermotropic liquid crystalline polymer. Further, the polymer composition exhibits a dielectric constant of about 10 or more and a dissipation factor of about 0.1 or less, as determined at a frequency of 2 GHz.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM / DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM / DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ / ε′r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz and ε′r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.

An apparatus for testing electrical characteristics of a multi-pin device includes a connector, a signal generator, a multiplexer, and a processor. The connector is connected to multiple pins of the multi-pin device. The signal generator is configured to generate a test signal. The multiplexer is arranged to output pin signals by selectively connecting the test signal to each of the pins through the connector. The processor is configured to determine electrical characteristics of the multi-pin device from the pin signals. The electrical characteristics are reactance and equivalent series resistance. The processor is arranged to determine capacitance and a dissipation factor for the multi-pin device from the determined reactance and equivalent series resistance.

To provide hollow particles having a decreased dielectric dissipation factor and improved performance stability. Hollow particles comprising a shell, which contains at least one kind of polymer, and a hollow portion surrounded by the shell, wherein a content of a non-crosslinkable monomer unit in 100% by mass of all monomer units forming a whole of the polymer contained in the shell, is 15% by mass or more and 60% by mass or less, and wherein the hollow particles have a dielectric dissipation factor of 5.00×10-4 or less at a frequency of 10 GHz.

Embodiments in accordance with the present invention encompass compositions containing a blend of polymers formed from a variety of polycycloolefinic monomers at least one of which monomer contains an olefinic functionality and another monomer contains an anhydride functionality, melamine, montmorillonite and optionally other fillers such as silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-l, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.

The present invention relates to liquid crystal polyesters (LCPs) and thermoplastic compositions comprising such LCPs that exhibit low dielectric constants and dissipation factors and are suitable for portable electronic device components, such as films or structural parts.

The invention provides a method, a device and a system for evaluating the peel strength of a photovoltaic adhesive film and glass. The method is applied to a system for testing the peel strength of the photovoltaic adhesive film and the glass. The method comprises the following steps: acquiring a multi-mode response signal when a photovoltaic adhesive film is stripped from glass through a distributed sensing system; the multi-modal response signal comprises a stripping force signal, an interface acoustic emission signal and local deformation field data; the multi-modal response signal is acquired when multi-frequency composite dynamic stress excitation containing a fundamental wave and a plurality of harmonic components is applied to the stripping interface; carrying out preprocessing operation on the multi-mode response signal; the preprocessing operation comprises zero equalization, normalization processing and filtering and denoising; and performing fusion processing analysis based on the preprocessed multi-modal response signal, and determining interface performance evaluation indexes including an interface stiffness coefficient, an energy dissipation factor and an interface damage index. The evaluation accuracy and repeatability of the peeling strength of the photovoltaic adhesive film and the glass can be improved.