15 results about "Dissipation factor" patented technology

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

A laminate comprising one or more conductive layers and one or more electrically insulating layers coupled to the conductive layers. Each conductive layer may include at least 90 wt% copper. Each electrically insulating layer may comprise a polymer aerogel layer. For at least one of the opposing front and rear surfaces of the laminate, at least a portion of the surface is defined by one of the conductive layers.

The present disclosure provides a compound represented by Formula (I) and a manufacturing method thereof, a resin composition comprising the compound, and an article made from the resin composition. The resin composition comprises the compound represented by Formula (I), vinyl group-containing polyphenylene ether resin and vinyl-containing crosslinking agent. The article comprises a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator that has improvements in one or more properties including glass transition temperature, dielectric constant, dissipation factor, thermal resistance after moisture absorption, flame retardancy, inner resin flow, and drop ball test.

Provided is a resin sheet which withstands adsorption and transportation by a vacuum adsorption pad for transportation, has low thermal expansion, and has a relative dielectric constant (Dk) of 2.50 to 3.30 in a high frequency band of 10 GHz band or more, and a dielectric dissipation factor (Df) of 0.0020 or less in a high frequency band of 10 GHz band or more. In addition, provided are a laminate, a printed wiring board, and a semiconductor package produced using the resin sheet. The resin sheet is specifically a resin sheet including a resin component (A), and an inorganic filler (B), in which the component (A) contains an elastomer (A1) having a number-average molecular weight of 10,000 or more, a content of the component (B) is 25 to 70 volume % based on a total amount of the resin sheet, and a breaking energy is 0.1 mJ / mm3 or more.

The present invention provides a parallel binary model for measuring a capacitance value of a gate oxide layer of a gate oxide MOS device. The parallel binary model is a parallel circuit model formed through parallel connection of a parallel capacitor Cp and an equivalent resistor Rp. The parallel binary model is used to measure the gate oxide MOS device through an LCR meter by adopting frequency f1 to obtain parallel capacitance Cp1 and parallel conductance Gp1. A dissipation factor D1 is calculated. In a case that D1<0.1, the measured parallel capacitance Cp1 is the capacitance value of the gate oxide layer of the gate oxide MOS device. In a case that D1>0.1, the parallel binary model is used to measure the gate oxide MOS device through the LCR meter by adopting frequency f2 to obtain parallel capacitance Cp2 and parallel conductance Gp2.

A process for manufacturing a copper-clad laminate comprises forming a thermoplastic layer, forming a stack by laying up at least a first copper foil layer and the thermoplastic layer, and laminating the stack by application of heat and pressure for a time sufficient to form the copper-clad laminate. The thermoplastic layer is made from a composite comprising from 15 wt. %to 75 wt. %of a thermoplastic resin comprising a liquid crystal polymer having a melting temperature in a range of from 250℃ to 370℃; from 20 wt. %to 80 wt. %of a filler component comprising a first filler having an aspect ratio greater than 1, a second filler having a dielectric constant greater than 4.0 under 2.5 GHz, a third filler different from the first and the second filler, or any combinations thereof; and from 0 wt. %to 2 wt. %of an additive. The thermoplastic layer has a dielectric constant of greater than 3.5 under 2.5 GHz, a dielectric dissipation factor of no greater than 0.0050 under 2.5 GHz, a heat deflection temperature of higher than 240℃ and a fiexural strength of greater than about 100 MPa.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM / DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM / DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ / ε′r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz and ε′r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.

To provide hollow particles having a decreased dielectric dissipation factor and improved performance stability. Hollow particles comprising a shell, which contains at least one kind of polymer, and a hollow portion surrounded by the shell, wherein a content of a non-crosslinkable monomer unit in 100% by mass of all monomer units forming a whole of the polymer contained in the shell, is 15% by mass or more and 60% by mass or less, and wherein the hollow particles have a dielectric dissipation factor of 5.00×10-4 or less at a frequency of 10 GHz.

The invention provides a method, a device and a system for evaluating the peel strength of a photovoltaic adhesive film and glass. The method is applied to a system for testing the peel strength of the photovoltaic adhesive film and the glass. The method comprises the following steps: acquiring a multi-mode response signal when a photovoltaic adhesive film is stripped from glass through a distributed sensing system; the multi-modal response signal comprises a stripping force signal, an interface acoustic emission signal and local deformation field data; the multi-modal response signal is acquired when multi-frequency composite dynamic stress excitation containing a fundamental wave and a plurality of harmonic components is applied to the stripping interface; carrying out preprocessing operation on the multi-mode response signal; the preprocessing operation comprises zero equalization, normalization processing and filtering and denoising; and performing fusion processing analysis based on the preprocessed multi-modal response signal, and determining interface performance evaluation indexes including an interface stiffness coefficient, an energy dissipation factor and an interface damage index. The evaluation accuracy and repeatability of the peeling strength of the photovoltaic adhesive film and the glass can be improved.

A controller for an ultrasonic handpiece having a load in the form of at least one piezo-driven crystal includes a processor and a computer-readable memory having a computer-readable instruction set recorded thereon. Execution of the instruction set during real-time operation of the handpiece causes the processor to execute an associated method during which the processor calculates a load capacitance of the load and a dissipation factor of the load capacitance. The processor also records the load capacitance and the dissipation factor in memory as a recorded capacitance history over time. The processor then performs a control action of the handpiece using the recorded capacitance history and possibly one or more additional recorded electrical parameters (such as estimated resistance, estimated inductance, and / or measured temperature) or a correlation of measured temperature to resonant frequency over time.

Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, melamine, fillers such as hexagonal boron nitride or silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire-retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.

The present disclosure relates to a resin composition, an article made therefrom, and a use thereof. The resin composition comprises: 100 parts by weight of a thermosetting resin and 100 to 300 parts by weight of an inorganic filler; the resin composition has an organic volatile matters as measured by reference to IPC-TM-650 2.4.24.6 of ≤2.0%, the resin composition has a shear viscosity variation rate as measured by reference to GB / T 2794-2022 7.3 of 9 to 56%, and a resin cured product obtained by curing the resin composition has a dissipation factor at a frequency of 10 GHz as measured by reference to JIS C2565 of ≤0.0080. When the resin composition is applied in a resin filling process of a printed circuit board, the printed circuit board produced thereby achieves significant improvements in impedance stability, solder floating crack rate, and varnish scraping stability.

A center conductor 20 has an abutment portion 22A placed in surface contact with a dielectric body 30 from below, the dielectric body 30 has a first dielectric body 31 and a second dielectric body 32 provided in contact with the first dielectric body 31 from below, the first dielectric body 31 has a lower dielectric dissipation factor than the dielectric dissipation factor of the second dielectric body 32, the second dielectric body 32 has a higher deflection temperature under load than the first dielectric body 31, and the surface area of the top face placed in surface contact with the bottom face of the first dielectric body 31 is larger than the surface area of the top face of the abutment portion 22A placed in surface contact with the bottom face of the second dielectric body 32.

The application discloses a network-constructing type doubly-fed wind turbine shaft torsional vibration damping evaluation-inhibition method and device based on dissipated energy, and relates to the technical field of power system damping control. The method first acquires unit operation electrical quantity data, judges whether shaft torsional vibration occurs or not; if the shaft torsional vibration occurs, the data is preprocessed, the shaft dissipated energy is calculated, the energy dissipation factor is obtained through Hilbert transform and normalization, and the damping size and property are evaluated; then, the damping controller compensation angle is determined by using the measured data, the parameter of a phase shifter is set by using the residue method, the controller gain is adaptively adjusted according to the energy dissipation factor, and the controller is put into operation as needed to inhibit the torsional vibration. The method can effectively improve the shaft torsional vibration damping, inhibit the torsional vibration phenomenon, adapt to the weak damping and negative damping scene, and guarantee the stable operation of a power system containing the network-constructing type doubly-fed wind turbine.

The invention discloses a thin film spin-coating system and method capable of monitoring quality and viscoelasticity changes in real time. According to the thin film spin-coating system and method, a quartz crystal microbalance and a QCM-D are integrated in the spin-coating system; the spin coating system comprises a quartz crystal oscillator, a monitoring unit capable of synchronously detecting frequency and dissipation factor changes, a heating plate integrated on a non-working face of the quartz crystal oscillator, and a temperature sensor. The heating sheet is used for carrying out in-situ heating on the quartz crystal oscillation sheet and a surface film of the quartz crystal oscillation sheet, and the low-noise conductive slip ring is used for signal transmission; according to the method, the mass change (delta f) and the dissipation factor change (delta D) of the film are synchronously monitored in real time and in situ in the spin-coating process; by analyzing a coupling curve of delta f and delta D, the quality of the dry film can be accurately obtained, and viscoelastic evolution and structural transformation key points of the film can be disclosed; the problem that the mechanical characteristics of the thin film cannot be obtained in real time through a traditional spin-coating process is solved, and a powerful quantitative analysis tool is provided for film forming mechanism research and process optimization of the thin film prepared through a perovskite solution method and the like.