93 results about "Dissipation factor" patented technology

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.

To provide hollow particles in which the dielectric dissipation factor is decreased, and the performance stability in high-humidity environment is improved. Hollow particles comprising a shell, which contains a resin, and a hollow portion surrounded by the shell, wherein the hollow particles have a void ratio of 50% or more; wherein the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more in 100% by mass of all monomer units of the polymer; and wherein an aqueous dispersion of the hollow particles, which is obtained by dispersing the hollow particles with a volume of 0.35 cm3 in 100 mL of deionized water, has a pH of 6.5 or more and 7.5 or less and a conductivity of 50 µS / cm or less.

The present invention relates to an oxide glass composition having a low dielectric constant and dielectric dissipation factor. The oxide glass composition according to the present invention can provide a glass material for PCBs, glass fibers and glass substrates having a low dielectric constant and dielectric dissipation factor properties. The oxide glass composition according to the present invention has a low softening temperature and excellent clarification characteristics, and thus can solve various problems of existing technologies.

To provide hollow particles in which the dielectric dissipation factor is decreased, and the performance stability in high-humidity environment is improved. Hollow particles comprising a shell, which contains a resin, and a hollow portion surrounded by the shell, wherein the hollow particles have a void ratio of 50% or more; wherein the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more in 100% by mass of all monomer units of the polymer; and wherein an aqueous dispersion of the hollow particles, which is obtained by dispersing the hollow particles with a volume of 0.35 cm3 in 100 mL of deionized water, has a pH of 6.5 or more and 7.5 or less and a conductivity of 50 μS / cm or less.

The present invention provides a parallel binary model for measuring a capacitance value of a gate oxide layer of a gate oxide MOS device. The parallel binary model is a parallel circuit model formed through parallel connection of a parallel capacitor Cp and an equivalent resistor Rp. The parallel binary model is used to measure the gate oxide MOS device through an LCR meter by adopting frequency f1 to obtain parallel capacitance Cp1 and parallel conductance Gp1. A dissipation factor D1 is calculated. In a case that D1<0.1, the measured parallel capacitance Cp1 is the capacitance value of the gate oxide layer of the gate oxide MOS device. In a case that D1>0.1, the parallel binary model is used to measure the gate oxide MOS device through the LCR meter by adopting frequency f2 to obtain parallel capacitance Cp2 and parallel conductance Gp2.

Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same.Spherical silica particles (X) are those having a surface fractal dimension of 1.0-2.3. The resin composition contains the spherical silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin. The specific surface area of the spherical silica particles (X) is preferably 0.1-2.0 m2 / g. The average particle diameter of the spherical silica particles (X) is preferably 1-30 μm.

The invention discloses a traction stretching motion state monitoring method based on signal processing, and relates to the technical field of signal processing, and the method comprises the following steps: collecting traction force, electrocardio, displacement and conductivity signals, carrying out normalization and filtering processing, extracting phase and amplitude components, and constructing a signal spectrum containing track change and time sequence characteristics; establishing a structure response mapping relation to generate a self-evolution feature map, and aligning the self-evolution feature map with the amplitude component to form a channel-level feature matrix and a multi-channel feature representation map; structural path perception convolution mapping is adopted, a path dissipation factor is introduced to extract deep features, direction enhancement is achieved in combination with an energy constraint factor and a scheduling matrix, and an energy adjustment feature map is obtained; finally, the features are spliced according to time steps to form a high-resolution sequence, signal optimization is achieved through iterative training, and the state recognition accuracy and stability are improved.

To provide a resin composition capable of improving a dissipation factor (Df), and to provide a prepreg, a resin film, a laminate, a printed wiring board and a semiconductor package obtained by using the resin composition.SOLUTION: A resin composition comprises (A) a thermosetting resin and (B) an inorganic filler, wherein the (B) component does not contain an inorganic filler having a (B1) particle size of 0.40 μm or less, or even if the (B) component contains an inorganic filler having a (B1) particle size of 0.40 μm or less, the content of the (B1) component is 0.6 mass% or less based on the total amount of the resin composition.SELECTED DRAWING: None

A laminate comprising one or more electrically conductive layers and one or more electrically insulating layers coupled to the electrically conductive layers. Each electrically conductive layer can comprise at least 90 wt% copper. Each electrically insulating layer can comprise a polymeric aerogel layer. For at least one of the opposing front and back surfaces of the laminate, at least a portion of the surface is defined by one of the electrically conductive layers.

To provide silica powder which has low frequency dependence of dielectric dissipation factor in a high frequency band.SOLUTION: Silica powder is kneaded at a ratio of 30 vol.% into a polypropylene resin to obtain a test composition which is then formed into a shape of a sheet having a thickness of 0.35 mm to 0.45 mm. The sheet, when measured for dielectric dissipation factor by a resonator method, has the ratio tanδ91 / tanδ10 between the dielectric dissipation factor tanδ10 measured at a frequency of 10 GHz and the dielectric dissipation factor tanδ91 measured at a frequency of 91 GHz of 1.6 or less.SELECTED DRAWING: None

The present disclosure relates to a glass cloth, prepreg, and printed circuit board. There is provided a glass cloth including woven glass yarns, wherein a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less, a bending rigidity (gf·cm2 / cm) per warp direction basis weight (g / m2) of the glass cloth is in the range of 0.0002 to 0.0014, and a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.

A controller for an ultrasonic handpiece having a load in the form of at least one piezoelectric drive crystal includes a processor and a computer-readable storage memory on which is recorded a computer-readable instruction set. Execution of the instruction set during real-time operation of the handpiece causes the processor to perform an associated method, during which the processor calculates a load capacitance of the load and a dissipation factor of the load capacitance. The processor also records the load capacitance and dissipation factor in memory over time as a recorded capacitance history. The processor then executes a control action of the handpiece using the recorded capacitance history and possibly one or more additional recorded electrical parameters such as estimated resistance, estimated inductance, and / or measured temperature, or correlations of the same with resonant frequency over time.

The invention provides a method for correcting a capacitance measurement value under large electric leakage, and provides a parallel binary model for measuring the capacitance value of a gate oxide layer of a gate oxide MOS (Metal Oxide Semiconductor) device, and the parallel binary model is a parallel circuit model formed by connecting a parallel capacitor Cp and an equivalent resistor Rp in parallel; selecting the parallel binary model through an LCP tester, and measuring the gate oxide MOS device by adopting a frequency f1 to obtain a parallel capacitance Cp1 and a parallel conductance Gp1; calculating a dissipation factor D1 when D1lt; when the value is 0.1, the measured shunt capacitance Cp1 is the capacitance value of the gate oxide layer in the gate oxide MOS device; when D1gt; when the capacitance value is 0.1, a parallel binary model is selected through an LCP tester, the gate oxide MOS device is measured by adopting the frequency f2, parallel capacitance Cp2 and parallel conductance Gp2 are obtained, and the actual capacitance value C of the gate oxide layer of the gate oxide MOS device is obtained.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

A laminate comprising one or more conductive layers and one or more electrically insulating layers coupled to the conductive layers. Each conductive layer may include at least 90 wt% copper. Each electrically insulating layer may comprise a polymer aerogel layer. For at least one of the opposing front and rear surfaces of the laminate, at least a portion of the surface is defined by one of the conductive layers.

An active ester resin comprising one or more of α-methylbenzyl groups per one molecule is capable of achieving an excellent dielectric dissipation factor in a high temperature environment.

Dielectric material layers including thermoplastic liquid crystal polymer (LCP) substrates coated or impregnated with a thermosetting resin. The dielectric material layers may have a dielectric constant (DK) value of less than about 3.4 and a dissipation factor of less than about 0.005 for use in printed circuit boards. The dielectric material layers may find particular utility in high density interconnect (HD I) printed circuit boards.

The invention provides a NiTiHf alloy for an aircraft bearing and a preparation method of the NiTiHf alloy. The method comprises the following steps: smelting Ni, Ti and Hf raw materials according to stoichiometry to obtain an alloy ingot; performing a thermal compression test on the alloy ingot to obtain stress-strain data of the alloy ingot; obtaining an energy dissipation diagram according to the relationship between the energy dissipation factor eta and the temperature as well as the strain rate, and obtaining a rheological instability diagram according to the relationship between the material rheological instability parameter xi and the temperature as well as the strain rate; and according to the energy dissipation diagram and the rheological instability diagram phase, a hot working diagram of the alloy ingot is obtained through superposition, hot working technological parameters of the alloy ingot are determined, and the hot working technological parameters comprise the hot working temperature and the strain rate. According to the method, the hot working parameters of the NiTiHf alloy with the specific stoichiometric ratio can be simply and conveniently determined, and therefore the problem that hot working is difficult due to the fact that the Hf element is introduced into the NiTi alloy can be solved.

The present disclosure provides a compound represented by Formula (I) and a manufacturing method thereof, a resin composition comprising the compound, and an article made from the resin composition. The resin composition comprises the compound represented by Formula (I), vinyl group-containing polyphenylene ether resin and vinyl-containing crosslinking agent. The article comprises a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator that has improvements in one or more properties including glass transition temperature, dielectric constant, dissipation factor, thermal resistance after moisture absorption, flame retardancy, inner resin flow, and drop ball test.

A polymer composition comprising a liquid crystalline polymer that contains repeating units derived from naphthenic hydroxycarboxylic and / or dicarboxylic acids in an amount of about 50 mol. % or more is provided. The polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.05 or less at a frequency of 10 GHz.

Provided is a resin sheet which withstands adsorption and transportation by a vacuum adsorption pad for transportation, has low thermal expansion, and has a relative dielectric constant (Dk) of 2.50 to 3.30 in a high frequency band of 10 GHz band or more, and a dielectric dissipation factor (Df) of 0.0020 or less in a high frequency band of 10 GHz band or more. In addition, provided are a laminate, a printed wiring board, and a semiconductor package produced using the resin sheet. The resin sheet is specifically a resin sheet including a resin component (A), and an inorganic filler (B), in which the component (A) contains an elastomer (A1) having a number-average molecular weight of 10,000 or more, a content of the component (B) is 25 to 70 volume % based on a total amount of the resin sheet, and a breaking energy is 0.1 mJ / mm3 or more.

An electrical connector is disclosed that comprises at least two opposing walls between which a passageway is defined for receiving a contact pin, wherein the walls have a width of about 500 micrometers or less and are formed from a polymer composition that comprises a polymer matrix containing at least one polymer having a glass transition temperature of about 30° C. or more in an amount of 30 wt. % or more of the composition. The polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.

A glass substrate includes, in terms of molar percentage based on oxides: one or more alkaline-earth metal oxides in a total amount of 0.1 to 13%; Al2O3 and B2O3 in a total amount of 1 to 40%, in which a molar ratio of the contents represented by Al2O3 / (Al2O3+B2O3) is 0 to 0.45; at least one of ZnO and ZrO2 in a total amount of 1.5 to 4%; and SiO2 as a main component. The glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

Dielectric material layers including thermoplastic liquid crystal polymer (LCP) substrates coated or impregnated with a thermosetting resin. The dielectric material layers may have a dielectric constant (DK) value of less than about 3.4 and a dissipation factor of less than about 0.005 for use in printed circuit boards. The dielectric material layers may find particular utility in high density interconnect (HDI) printed circuit boards.

A controller for an ultrasonic handpiece having a load in the form of at least one piezoelectric drive crystal includes a processor and a computer-readable storage memory on which is recorded a computer-readable instruction set. Execution of the instruction set during real-time operation of the handpiece causes the processor to perform an associated method, during which the processor calculates a load capacitance of the load and a dissipation factor of the load capacitance. The processor also records the load capacitance and dissipation factor in memory over time as a recorded capacitance history. The processor then executes a control action of the handpiece using the recorded capacitance history and possibly one or more additional recorded electrical parameters such as estimated resistance, estimated inductance, and / or measured temperature, or correlations of the same with resonant frequency over time.

The present invention provides a parallel binary model for measuring a capacitance value of a gate oxide layer of a gate oxide MOS device. The parallel binary model is a parallel circuit model formed through parallel connection of a parallel capacitor Cp and an equivalent resistor Rp. The parallel binary model is used to measure the gate oxide MOS device through an LCR meter by adopting frequency f1 to obtain parallel capacitance Cp1 and parallel conductance Gp1. A dissipation factor D1 is calculated. In a case that D1<0.1, the measured parallel capacitance Cp1 is the capacitance value of the gate oxide layer of the gate oxide MOS device. In a case that D1>0.1, the parallel binary model is used to measure the gate oxide MOS device through the LCR meter by adopting frequency f2 to obtain parallel capacitance Cp2 and parallel conductance Gp2.

The present invention provides a polyimide film having a dielectric constant (Dk) of 3.5 or less and a dielectric loss rate (Df) of 0.003 or less as measured at 10 GHz after being left for 24 hours in an environment of 85 DEG C and 85% RH.

The present disclosure relates to a composite film made of at least LCP and a fiber fabric, for example presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).

The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.

Embodiments in accordance with the present invention encompass compositions containing a blend of polymers formed from a variety of polycycloolefinic monomers at least one of which monomer contains an olefinic functionality and another monomer contains an anhydride functionality, melamine, montmorillonite and optionally other fillers such as silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.