168results about How to "Low dissipation factor" patented technology

A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

A solid electrolytic capacitor that comprises an anode that contains a valve-action metal (e.g., tantalum, niobium, and the like) and a dielectric film overlying the anode is provided. The capacitor also comprises a protective coating overlying the dielectric film, wherein the protective coating contains a relatively insulative, resinous material. For example, in one embodiment, the resinous material can be a drying oil, such as olive oil, linseed oil, tung oil, castor oil, soybean oil, shellac, and derivatives thereof. The capacitor also comprises a conductive polymer coating overlying the protective coating. As a result of the present invention, it has been discovered that a capacitor can be formed that can have a relatively low leakage current, dissipation factor, and equivalents series resistance.

A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.

Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, extremely low moisture uptake and are very thermally stable. The combination of these materials in formulation along with functionalized polyethylene, polypropylene, polybutadiens have been found to be ideal for forming films and coatings for the microelectronic applications, multiplayer capacitors and interconnects, and high power cables and wire coatings. The addition of perfluorinated hydrocarbons, and POSS nanoparticles to the formulations have decreased the dielectric constant and dielectric dissipation factor further, and have also improved the flammability of the compositions.

The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.

Laminates have at least one resin-system layer, a low dielectric, low dissipation factor bond core having at least one surface that is treated for adhesion, such as by etching, plasma or Corona discharge or mechanical roughing to facilitate bonding to the at least one resin system layer and a conductive metal cladding on the at least one resin system layer. The bond core can be a fluoropolymer film or a fluoropolymer prepreg, having at least one etched or Corona discharge treated surface. Alternately, the bond core can be a polyetherimide film or a polyetherimide prepreg, having at least one etched or Corona discharge treated surface. The laminates are used, for example, high performance, low loss printed circuit boards. The laminates have the desired dielectric properties inherent to fluoropolymer materials and can be produced using conventional printed circuit board manufacturing processes, materials, and equipment. Methods of producing laminates are disclosed.

A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer, and an adhesive film and a wiring film using the same are disclosed.

A resin composition, including (A) a polyimide resin; (B) a pre-polymerised maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerised maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Conductive powder and paste compositions are formed having desirable electrical and physical properties. The conductive powder and paste compositions may be used in combination with dielectric powder and thick-film paste compositions, which are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties, to form capacitors and other fired-on-foil passive circuit components.

The invention belongs to the technical field of polymer composite materials, and particularly relates to a resin composition for a copper foil-clad base plate in the high-frequency and high-speed field and application thereof. The resin composition is prepared from 55 to 70 weight percent of active ingredients and 30 to 45 weight percent of solvents, wherein the active ingredients comprise the following raw materials in parts by weight: 15 to 45 parts of modified polyphenyl ether resin, 10 to 50 parts of cross-linking agents, 5 to 30 parts of TAIC, 5 to 20 parts of hydrocarbon resin, 10 to 15 parts of fire retardants, 0.5 to 2 parts of initiators and 15 to 30 parts of inorganic fillers. The obtained resin composite with various excellent properties can be applied to the preparation of high-performance copper-clad plates; and the copper-clad plates have the excellent dielectric property and high temperature-resistant performance, soldering-tin-resistant performance, heat-resistant performance and high glass transition temperature.

The present invention is related to a fabric reinforcement using a modified cyclic olefin copolymer and a resin substrate for a printed circuit board. Specifically, the current invention provides a fabric reinforcement using a modified cyclic olefin copolymer, which is prepared from filaments obtained by melting the modified cyclic olefin copolymer including a cyclic olefin copolymer backbone grafted with a monomer having at least one unsaturated carboxylic group, and a resin substrate for a printed circuit board.

The present invention, relates to the preparation of a patch antenna with a specific effective dielectric constant; and a reduced dissipation factor. In an exemplary embodiment of the invention, size requirements and the desired resonant signal frequency dictate the permittivity value of the dielectric material to be used between the patch plate and the ground plate. Instead of using a dielectric material with the calculated permittivity value and its given dissipation factors a two layer dielectric of the same size with an effective dielectric constant that is equal to the desired dielectric constant, is used to replace the dielectric material and reduce the dissipation factor.

An improved circuit substrate is provided wherein glass cloth is completely embedded within fluoropolymer by thermocompression to form a composite structure, which when containing an adhesive agent such as the combination of functional groups and liquid crystal polymer is self-adhering to a metal layer such as of copper.

The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an β-crystal structure and a β-crystal structure. The ratio of the β-crystal structure is 50% or more.

A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.