Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Abstract

The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

Description

CROSS-REFERENCE TO PRIOR APPLICATION [0001] This application is a Divisional of U.S. patent application Ser. No. 11 / 361,078, filed Feb. 6, 2006, which claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2005-0035626 filed on Apr. 28, 2005. The contents of both applications are incorporated herein by reference in their entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates, generally, to a printed circuit board (PCB) having embedded capacitors using a hybrid material and a method of manufacturing the same. More particularly, the present invention relates to a PCB having embedded capacitors, in which a hybrid material, comprising liquid crystal polymer and high-frequency ceramic powder dispersed therein, is formed in a sheet shape for use in a capacitor layer, which is then embedded in the PCB, thereby decreasing the variation of capacitance depending on temperature and reducing signal transmission loss by virtue...

AI Technical Summary

Benefits of technology

The hybrid material-based PCB achieves stable dielectric properties and reduced signal loss, enabling effective signal matching and impedance matching in high-frequency circuits, overcoming the limitations of conventional PCBs.

Problems solved by technology

Although passive components such as capacitors have been manufactured in various forms such as chips or disks to be mounted on PCBs to date, electronic devices have recently been required to be miniaturized and complicated, and thus, the areas for mounting the passive components on the PCB are decreasing.

Further, while frequencies increase in accordance with high speed electronic devices, parasitic impedance is generated by the conductors, solders, etc., between the passive components and the IC, thus causing several problems.

However, since most materials for PCBs having embedded capacitors developed by the manufacturers to date have unstable capacitance depending on the temperature and humidity, they have been limitedly studied only for use in decoupling and bypassing.

Although such a thin film has relatively high capacitance, it entails large variation of capacitance depending on the temperature, and also a high dissipation factor, and is therefore unsuitable for use in embedding the capacitor which has been presently mounted on the PCB for signal matching and impedance matching in high frequency circuits.

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