2 results about "Parasitic impedance" patented technology

A high power density integrated circuit module packaging method and its packaging structure belong to the field of microelectronic device packaging technology. In the inner cavity assembly area of the ceramic packaging shell, the chip assembly area is provided with a heat sink area and a functional area, the heat sink area and the functional area are provided as flat bottom pits, the power of the chips in the circuit is graded, a two-stage or more stepped structure is adopted, the chips are distributed from deep flat bottom pits to shallow flat bottom pits according to the power from large to small, the heat sink area is lower than the functional area, the power type chip with large power is assembled in the heat sink area, and the functional type chip with small power is assembled in the functional area. A metal through hole penetrating through the ceramic base body is arranged below the heat sink area or the functional area to realize shortest path heat dissipation and shortest path internal and external electrical connection. The problems of low power density, low integration, large parasitic impedance and parasitic inductance, low reliability and high application cost of the existing high-power devices (assemblies or modules) are solved. It is widely used in the field of high-reliability power integrated circuit module integration technology.

According to various embodiments, an electronic device may comprise: a biological body contact circuit including four electrodes; a current-voltage measurement module including a power supply port, a current measurement port, a first voltage measurement port, a second voltage measurement port, an alternating current signal generator electrically connected to the power supply port, an ammeter electrically connected to the current measurement port, and a voltmeter interposed between and electrically connected to the first voltage measurement port and the second voltage measurement port; a processor; a memory electrically connected to the processor to store the characteristic impedance values of circuit elements interposed between and electrically connected to the current-voltage measurement module and the biological body contact circuit, and to store values for parasitic impedance stemming from parasitic elements existing between the biological body contact circuit and a ground; and a current-voltage path configuration module configured to electrically connect the biological body contact circuit to the power supply port, the current measurement port, the first voltage measurement port, and the second voltage measurement port such that the voltage path and current path of the biological body contact circuit can be changed under control of the processor. Various other embodiments are also possible.