372results about How to "Improve long-term reliability" patented technology

The invention discloses a multi-working-condition-oriented equipment fault diagnosis method based on unbalanced learning, and the method comprises the following steps: collecting the operation data of equipment under different working conditions through a plurality of sensors, carrying out the preprocessing, feature extraction and feature selection of the collected original operation data, and obtaining a feature set; processing the feature set by adopting an unbalanced learning technology and a cost-sensitive learning algorithm to obtain a balanced data set; constructing a multi-working-condition fault diagnosis model based on learning, and optimizing model parameters by adopting a method of combining cross validation and grid search according to a balanced data set in a model training process; deploying a multi-working-condition fault diagnosis model obtained through training, carrying out the online diagnosis of equipment faults, and continuously updating and optimizing the model through a continuous learning mechanism. According to the method, the unbalanced learning technology is applied to multi-working-condition fault diagnosis, the accuracy and robustness of diagnosis can be remarkably improved, and real-time monitoring and predictive maintenance of the equipment health state are achieved.

The invention relates to the technical field of microelectronic packaging, and discloses a packaging method of a multi-layer stacked memory chip, which comprises the following steps: constructing a 3D packaging structure layout of a memory chip to be packaged; constructing a physical field of the 3D packaging structure layout, and integrating the physical field and the field action relationship into the 3D packaging structure layout to obtain a coupled 3D packaging structure layout; calculating a hot spot, a high stress area and a high electric field area of the coupled 3D packaging structure layout, and optimizing the coupled 3D packaging structure layout to obtain a target packaging structure layout; performing multi-layer stacking on the to-be-packaged storage chip to obtain a multi-layer stacked storage chip; and packaging the multi-layer stacked memory chip to obtain a packaged multi-layer stacked memory chip, activating packaging repair of the self-repair material by using a preset material repair algorithm to obtain a packaging repair material, and performing multi-layer stacked packaging of the to-be-packaged memory chip based on the packaging repair material. According to the invention, the packaging stability of the multi-layer stacked storage chip can be improved.

The invention relates to the technical field of PCBs (printed circuit boards), in particular to an intelligent PCB detection and repair method, which comprises the following steps: S1, initializing module configuration: automatically identifying the type and structure information of a PCB; s2, a dynamic detection stage: collecting electrical parameters of the PCB, and generating fault position information; s3, circuit dynamic characteristic compensation: analyzing the nonlinear distortion characteristic of the circuit, and calculating and executing dynamic compensation; s4, an automatic repair stage: generating a repair scheme, including solder joint repair, line reconstruction or signal compensation; and S5, an intelligent recheck stage: performing comprehensive retest on the repaired PCB, verifying the performance of the repaired area, and generating a repair evaluation report. According to the invention, the repair precision and efficiency are improved, the whole repair process is intelligent and automatic, the risk of manual intervention is reduced, and the overall repair efficiency and the long-term reliability of the PCB circuit are improved.

The invention discloses a multi-output high-performance integrated laser driver driving method, relates to the technical field of integrated laser driver driving, and aims to solve the problem of poor signal stability of a multi-output channel of an existing laser driver. A monitoring module is installed on each output channel, the quality of output signals and the running state of a driver are monitored in real time, immediate feedback is provided, the reliability of the system is ensured, a driver control strategy is automatically adjusted and corrected according to early warning data, it is ensured that the system can be rapidly recovered to the optimal state after an abnormality occurs, and the reliability of the system is improved. The self-adaptive capability of the system is improved, the system performance can be further optimized through a secondary driver control strategy obtained through automatic adjustment and correction, manual intervention is reduced, the intelligent level of the system is improved, and a personalized control strategy for a specific application scene can be generated through deep performance analysis. Therefore, the driver is better in performance in a special application environment.

The invention relates to the technical field of railway line flaw detection, in particular to railway line automatic comprehensive flaw detection equipment which comprises two steel rails and a flaw detection car and further comprises a C-shaped mounting plate, a buffer assembly, a waist detection mechanism and a bottom detection mechanism. A first fixing rod is transversely arranged in the C-shaped mounting plate, fixing sleeves are slidably connected to the two ends of the first fixing rod correspondingly, and balance assemblies are arranged at the ends, away from each other, of the two fixing sleeves correspondingly. The device has the advantages that different detection assemblies are arranged for different detection areas, so that steel rail detection of different parts is more efficient and accurate, it is ensured that different types of defects can be detected, the detection period is shortened, the balance assembly and the buffer assembly cooperate with each other to enable the head detection assembly to keep a dynamic balance state, and the detection efficiency is improved. The probe is effectively protected from vibration damage, and the adaptability of the probe to the change of the steel rail and the detection stability of the probe are improved.

The invention discloses a preparation method of a perovskite-based thin film laminated solar cell, and the method comprises the following steps: S1, taking transparent conductive glass as a substrate, and carrying out the spin coating of an electron transmission material on the substrate to form an electron transmission layer; s2, a perovskite precursor solution prepared in advance is spin-coated, and a perovskite absorption layer is obtained after primary heat treatment; s3, depositing a nano silicon dioxide porous interface layer, spin-coating a self-repairing polymer containing ionic liquid, and performing secondary heat treatment to obtain a modified perovskite absorption layer; s4, spin-coating a hole transport layer; s5, performing vacuum evaporation on a metal counter electrode layer to obtain a perovskite top cell; and S6, stacking and compounding the perovskite-based thin film and a crystal silicon bottom cell to form the perovskite-based thin film laminated solar cell. According to the preparation method of the perovskite-based thin film laminated solar cell, the photoelectric conversion efficiency and the stability of the cell are improved, the self-repairing capability and the long-term durability of the cell are enhanced, and the high-standard requirement of commercial application can be met.

The invention relates to a self-adaptive firewall rule generation method and device based on real-time threat intelligence, and the method comprises the steps: carrying out the semantic analysis of a threat intelligence text, extracting attack indexes and attack technique and tactics labels, and generating an intelligence triple set and an attack technique and tactics label set; calling a language model to generate candidate rules based on an intelligence analysis result, carrying out credibility scoring, intercepting a low-scoring rule as a high-risk illusion rule, and entering other rules into a to-be-verified set; constructing a digital twinborn shadow sub-domain to perform real-time traffic verification on the rule set to be verified, and dividing the rule set to be verified into an effective rule set and an invalid rule set according to a verification result; constructing a rule dependence graph based on the invalid rule set to perform pollution traceability, and adding nodes with excessive pollution into an isolation list; and cleaning the historical training samples based on the isolation list and the interception rule log, and performing incremental training on the language model to generate an updated model.

The invention relates to the technical field of equipment heat dissipation, and provides an edge computing equipment heat dissipation control method and device, equipment and a storage medium. The method comprises the following steps: acquiring temperature data information, and generating a three-dimensional temperature distribution diagram of the edge computing equipment based on the temperature data information; performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field; obtaining state information of a heating part of the edge computing equipment; predicting a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset duration based on the temperature gradient field and the state information of the heating component; and based on the three-dimensional temperature prediction distribution diagram, generating operation parameters of the heat dissipation device in the preset duration, and based on the operation parameters, controlling the heat dissipation device to perform heat dissipation processing on the edge computing equipment in the preset duration. According to the method, the continuous operation time of the heat dissipation device is shortened, so that the total energy consumption of the edge computing equipment is effectively reduced.

The invention discloses a design method of an inner-layer circuit board. The design method comprises the following steps: optimizing the design of the minimum distance from a hole to copper; hole ring design: a welding ring is greater than or equal to 4mil before compensation of a copper thick circuit of 1oz and below, local cutting is performed at least 3.5 mil after compensation, and teardrop design is added to all inner-layer circuit hole rings; wire design: the wire width of the functional connection wire is greater than or equal to the finished product wire width of the minimum bottom copper design; designing a non-functional bonding pad, wherein a single-side welding ring is greater than or equal to 8mil, and a slotted hole is greater than or equal to 10mil; fine gaps are designed, wherein non-functional fine gaps smaller than or equal to 5 mil are subjected to copper filling treatment; the gaps with the isolated copper spacing smaller than 10 mil are filled with copper; a heat dissipation welding ring is larger than or equal to 6 mil, a heat dissipation copper bridge is larger than or equal to 6 mil, and a copper bridge base material ring finished product is larger than or equal to 5 mil; when the heat dissipation pad intersects the isolation pad, the integrity of the isolation pad is preferentially satisfied. According to the design method of the inner-layer circuit board provided by the invention, the long-term reliability of the circuit board can be improved.

The invention relates to the technical field of photovoltaic modules, in particular to an EPE packaging adhesive film, a preparation method of the EPE packaging adhesive film and a photovoltaic module. The EPE packaging adhesive film comprises a first EVA layer, a POE layer and a second EVA layer which are arranged in sequence, the first EVA layer and the second EVA layer respectively and independently comprise EVA resin, functional particles, a sulfydryl-containing silane coupling agent, a cross-linking agent, an assistant cross-linking agent, an antioxidant and a light stabilizer; the POE layer comprises POE resin, functional master batch, triethylamine, a cross-linking agent, an assistant cross-linking agent, an antioxidant and a light stabilizer; the functional particles comprise white carbon black, magnesium hydroxide and a sulfydryl-containing silane coupling agent according to the mass ratio of 1: (0.8 to 1.2): (0.002 to 0.1). After the EPE packaging adhesive film is applied to the photovoltaic module, the long-term reliability of the photovoltaic module can be effectively improved, and the service life of the photovoltaic module can be effectively prolonged.

The invention discloses a photovoltaic module with an edge creepage area and a preparation method thereof. The method comprises the following steps: providing upper glass, a battery piece, lower glass, a welding strip, a confluence plate and a confluence groove; a slot is formed in any end surface of the confluence groove; the battery piece is pasted on the upper glass, the lower glass is pasted on the battery piece, and one end of the battery piece is connected with the welding strip; the welding strip is bent by 90 degrees relative to the battery piece, so that part of the structure of the welding strip extends upwards along the lower glass and is perpendicular to the battery piece; arranging a bus board on a partial structure of the welding strip, and electrically connecting the battery piece with a bus bar on the bus board through the welding strip; inserting a part of the structure of the welding strip into the slot of the confluence groove, so that the welding strip and the confluence plate are sealed in the confluence groove, and the part of the structure of the confluence groove is arranged on the lower glass; the photovoltaic module can be connected with external equipment through the confluence groove; and filling a packaging adhesive layer between the welding strip and the glass under the condition that the welding strip is not contacted with the confluence groove to complete the preparation of the photovoltaic module.

The invention belongs to the technical field of photovoltaic backboards, and particularly relates to a high-reflection integrally-formed backboard for a single-glass assembly and a preparation method thereof.The preparation method comprises the following steps that S1, a PET film base material is provided, plasma surface treatment is conducted, then polyurethane coating is coated on the two sides to form an outer-layer weather-proof fluorine coating and an inner-layer functional coating respectively, and the outer-layer weather-proof fluorine coating and the inner-layer functional coating are formed; a CPC backboard base material is obtained; s2, white high-reflection EVA granules are fused and plasticized, a white EVA adhesive film is obtained through extrusion of a hanger type T-shaped flat die head, then the white EVA adhesive film is compounded with the inner functional coating of the CPC backboard base material, and a firm complex without a definite physical interface is obtained through rolling; s3, cooling the composite body through at least two stages of cooling rollers to obtain a coiled material; and S4, the coiled material is irradiated, and the high-reflection integrally-formed backboard is obtained.

The invention relates to the technical field of signal transmission, in particular to a wireless while-drilling pulse signal transmission system under a high-temperature condition. The system comprises a signal generation part, a signal transmission part and a signal receiving part, the signal generation part is used for sensing changes of temperature, pressure or vibration of an underground environment through a piezoelectric crystal, generating an initial electric signal, forming a mechanical signal and converting the mechanical signal into an initial pulse signal in an electric signal form again; the signal transmission part is used for performing mud pressure modulation on the initial pulse signal to obtain a phase change function; performing nonlinear correction to obtain a correction result; performing signal coding modulation based on the correction result; the modulation signal is sent to a signal receiving part at a far end; and the signal receiving part is used for receiving the modulation signal and demodulating the modulation signal to obtain a demodulated output signal. A complete, efficient and reliable solution is provided for wireless while-drilling pulse signal transmission under the high-temperature condition.

The utility model relates to a medium-voltage fire-resistant cable. The medium-voltage fire-resistant cable comprises a cable core and a protection unit. The cable core comprises a wire core, a first wrapping layer and a filling layer; the protection unit is arranged on the periphery of the filling layer and sequentially comprises an outer sheath, a second wrapping layer, an armor layer, a first oxygen isolation layer, a mineral fireproof layer and a second oxygen isolation layer from outside to inside. The mineral fireproof layer is filled between the first oxygen barrier layer and the second oxygen barrier layer, and the mineral fireproof layer can be decomposed under a heating condition to reduce the temperature of the cable core. The mineral fire-resistant layer does not need high-temperature vulcanization, damage to the cable core is avoided, the service life and long-term reliability of the medium-voltage fire-resistant cable are improved, the first oxygen barrier layer and the second oxygen barrier layer have fire resistance, the mineral fire-resistant layer can be decomposed under the heating condition, the cooling effect is achieved, and the service life of the medium-voltage fire-resistant cable is prolonged. The fire-resistant performance of the medium-voltage fire-resistant cable is improved through the synergistic effect of fire insulation, heat insulation and cooling.

The invention provides an electronic device, a ceramic substrate and a preparation method thereof, and relates to the technical field of semiconductors. The ceramic substrate comprises a ceramic base body and a liquid channel layer, the liquid channel layer is arranged in the ceramic base body, the liquid channel layer and the ceramic base body are integrally sintered and formed, the liquid channel layer comprises a liquid channel, the liquid channel is used for containing a cooling medium, and the liquid channel extends in the ceramic base body along a three-dimensional space path. The preparation method of the ceramic substrate comprises the following steps: preparing slurry containing ceramic powder, preparing a sacrificial template matched with a target liquid channel in shape, pouring the slurry to coat the sacrificial template, filling a mold with the slurry to obtain a ceramic blank, removing the sacrificial template to form a hollow channel in the ceramic blank, and sintering to form the ceramic substrate with the liquid channel. The electronic device comprises the ceramic substrate, a component and a liquid cooling circulation system.

The utility model relates to an inductor heat dissipation device and an electric energy conversion device, and relates to the field of new energy electrical equipment. The utility model provides an inductor heat dissipation device which comprises at least one inductor, a shell and a sealing and filling material. The shell is detachably connected with an external cabinet body, a flow channel used for circulating cooling liquid is arranged in the shell, the shell is further provided with an installation cavity, a first opening and a second opening, the first opening and the second opening are communicated with the flow channel, and the installation cavity is used for containing at least one inductor; and the sealing and filling material is filled in the mounting cavity and is used for conducting heat. By arranging the shell with the flow channel and the sealing and filling material, efficient heat dissipation of the inductor is achieved, then the working environment temperature and the internal hot spot temperature of the inductor are reduced, and the long-term reliability is improved; and meanwhile, the shell is detachably connected with the cabinet body of the electric energy conversion device, and the surface of the cabinet body does not need to be perforated to reserve an air duct, so that the reliability problems of radiator blockage, fan aging and the like are avoided, and the invalidation problems of corrosion, insulation aging and the like in the cabinet body can also be avoided.

The invention discloses a low-delay adaptive code rate control system for a meteorological monitoring video stream, and relates to the technical field of adaptive code rate control in video stream media transmission, and the system comprises a content importance analysis module which is used for carrying out the real-time analysis of a video block to be transmitted, generating a content importance score representing the meteorological information value; and the decision arbitration module is connected with the content importance analysis module and is used for receiving the content importance score, the network state information and the buffer area state information. According to the low-delay adaptive code rate control system for the meteorological monitoring video stream, bandwidth resources can be allocated according to the difference of meteorological information values of video contents, the quality of key monitoring pictures is guaranteed preferentially when network conditions fluctuate, unnecessary code rate switching is inhibited actively through internal look-ahead simulation and risk assessment, and the quality of the meteorological monitoring video stream is improved. Therefore, balance between continuous and clear transmission of high-value information and overall watching fluency is realized in a complex network environment.

The invention discloses an electronic component reliability digital design method based on multi-physics field coupling simulation, and belongs to the technical field of reliability analysis, and the method comprises the following steps: S1, obtaining a working environment index and a reliability design index of an electronic component; s2, constructing a component reliability digital evaluation model; s3, obtaining an electrical parameter and a temperature parameter of the electronic component; s4, constructing an overall reliability evaluation model for the electronic component; and S5, constructing an optimization model for the overall reliability evaluation model of the electronic component, and completing the reliability digital design of the electronic component. According to the method, the reliability of the electronic component can be accurately evaluated through multi-physical field coupling simulation and a digital evaluation technology under the condition of insufficient data, and reliability design optimization is realized under constraint conditions of other design factors; therefore, the stability and the long-term reliability of the electronic component in a complex environment are improved under a limited design condition.

The invention discloses a micro-nano satellite and rocket unlocking and separating mechanism which comprises a center rotating wheel structure, N extension sliding arms and N satellite locking and releasing structures, one end of each extension sliding arm is connected with the center rotating wheel structure, and the other end of each extension sliding arm is connected with one satellite locking and releasing structure; the central runner structure controls the plurality of connecting rods to realize synchronous opening and closing; the satellite locking and releasing structure adopts a steel ball for locking and releasing, so that the satellite is prevented from popping up in advance, and the satellite locking and releasing structure has higher loading capacity; the invention provides a satellite separation speed and separation force value solving method aiming at a satellite and rocket separation speed requirement; the unlocking separation mechanism is high in synchronism, large in load, light in weight, small in size, high in reliability and capable of ensuring that a satellite is safely separated from a rocket after entering an orbit.

The invention relates to the field of cable installation, in particular to a marine environment resistant electric connector which comprises a male connecting seat and a female connecting seat, the male connecting seat comprises a first gold-plated outer cylinder and a first inner core, and the inner wall of the first gold-plated outer cylinder is provided with at least one PTFE insulating layer; the first inner core comprises a male terminal, a first PTFE insulator, a first crimping sleeve and a first heat-shrinkable sleeve, the front end of the male terminal is a connecting plug, the rear end of the male terminal is a first wiring part used for being connected with a cable, the male terminal is arranged in the first crimping sleeve, and the first PTFE insulator is arranged in the first crimping sleeve; the first PTFE insulator is arranged in the first crimping sleeve and is positioned between the inner wall of the first crimping sleeve and the male terminal; the first heat-shrinkable sleeve is sleeved in the first crimping sleeve to form the first inner core; through reasonable material selection and structural design, the cable has remarkable advantages in the aspects of corrosion resistance, sealing performance, electrical insulating performance and signal transmission stability, and can reliably operate in a marine environment for a long time.

The invention provides an optical fiber coating adhesion promoter as well as a preparation method and application thereof. The optical fiber coating adhesion promoter is prepared from the following components in parts by mass: 20 to 25 parts of modified epoxy resin, 4 to 7 parts of epoxy acrylate, 12 to 16 parts of modified filler, 32 to 38 parts of propylene glycol methyl ether acetate, 13 to 18 parts of isobutanol, 6 to 10 parts of phosphoric acid and 5 to 7 parts of water. The preparation method of the modified epoxy resin comprises the following steps: (1) in a nitrogen environment, heating epoxy resin to 135-140 DEG C, then adding N, N-dimethyl benzylamine, and keeping the temperature for 8-10 hours to obtain a polyepoxy compound; and (2) sequentially adding N-methylethanolamine and amino-terminated liquid nitrile rubber into the polyepoxy compound, reacting at 125-130 DEG C for 6-8 hours, and cooling to room temperature to obtain the modified epoxy resin. The adhesion promoter for the optical fiber coating can improve the adhesion between the optical fiber and the coating and improve the reliability of the optical fiber.

The application relates to a gallium nitride epitaxial structure forming method and a semiconductor device. The method comprises the following steps: sequentially forming a buffer layer, an intrinsic GaN layer and an AlGaN layer on a substrate; growing a P-type doped GaN epitaxial layer on the AlGaN layer, controlling the doping concentration and thickness of the P-type GaN layer, performing N-type ion implantation on the P-type GaN layer, controlling the implantation depth in the range of 20nm-30nm, and then performing annealing. In another mode, the AlGaN layer is subjected to P-type ion implantation before the P-type GaN layer is grown to form an asymmetric P-type doped area, and then annealing is performed, and the implantation area is still P-type after annealing by controlling the implantation dose. In the semiconductor device, the contact layer is obtained by patterning the P-type GaN layer, and the P-type doped area with the highest doping concentration or the largest doping area is arranged at the position of the contact layer. The gate breakdown voltage can be improved, the threshold voltage can be stabilized, the low on-resistance can be maintained, and the CMOS process compatibility can be realized.

The application provides a split-gate flash memory and a manufacturing method thereof. The memory comprises a semiconductor substrate, has an active region and an isolation structure, and part of the surface of the isolation structure is lower than the surface of the active region to form a groove; a coupling medium layer covers the top and sidewall of the active region; a floating gate is located on the surface of the coupling medium layer and surrounds the top and sidewall of the active region and does not completely fill the groove; an inter-electrode medium layer is located on the surface of the floating gate; a control gate is located on the surface of the inter-electrode medium layer and fills the remaining part of the groove; a word line is located on the sidewall of the floating gate and the control gate; and a tunneling medium layer is located between the word line and the floating gate, the control gate and the substrate. The application enhances the control force by three-dimensionally surrounding the channel with the floating gate, reduces the risk of punch-through, increases the coupling rate by filling the groove with the control gate, reduces the operating voltage, and improves the reliability of the device.

This invention discloses a method for overlapping construction of waterproofing systems in existing subway lines. It relates to the field of underground engineering waterproofing construction technology and includes: Step 1, current status investigation and deformation assessment; Step 2, overlapping structure system design; Step 3, key material selection and process matching; Step 4, refined overlapping construction process; and Step 5, full inspection after each process. This invention's method for overlapping construction of waterproofing systems in existing subway lines, through Step 1, involves structural deformation monitoring and analysis and diagnosis of the existing waterproofing layer; Step 2, involves deformation adaptation structure design and differential deformation compensation design; Step 3, involves material selection and process innovation; Step 4, involves base treatment, interface treatment, expansion joint and node construction, and reinforcement layer construction; and Step 5, involves process inspection. This method, tailored to the characteristics of existing subway lines, enables the effective combination of different waterproofing materials, adapts to continuous deformation, and ensures long-term reliability.

The invention relates to an environment-friendly process method for improving the surface metal cleaning efficiency of a silicon wafer, and belongs to the technical field of semiconductor silicon wafer processing, and the process method comprises the following operation steps: S1, pre-cleaning and activation: placing the silicon wafer in a first cleaning tank, introducing ozone into ultrapure water, and processing in cooperation with low-frequency ultrasound; and S2, main cleaning and complexing: placing the silicon wafer subjected to pre-cleaning and activating treatment in a second cleaning tank, and treating the silicon wafer in a dilute citric acid solution in cooperation with high-frequency ultrasound. And S3, overflow rinsing: placing the silicon wafer subjected to main cleaning and complexing treatment in a third cleaning tank. And S4, drying: carrying out drying treatment on the silicon wafer subjected to the overflow rinsing treatment. Through the synergistic effect of physical stripping, chemical oxidation and complexing dissolution, under the condition that highly toxic chemicals such as hydrofluoric acid are not used, the cleanliness of metal on the surface of the silicon wafer reaches the ppt level, and the problems that traditional RCA cleaning is serious in environmental pollution and high in operation risk are effectively solved.

The utility model relates to connector technical field especially relates to a micro floating type board -to-board connector structure, including the socket, the socket with the plug adopts vertically and perpendicularly and inserts the mode connection, realizes electric connection and mechanical cooperation, the socket's slot inside evenly interval setting has the contact terminal of elastic sheet along the length direction. Through the quick release mechanism that adopts the mounting seat and, the clamping block and the spring are composed, the socket can realize automatic locking with the mounting seat through the vertical insertion mode, in the insertion process, the circular clamping block is contracted under pressure, when aligning with the clamping hole on the socket, automatically pops out and clamps into the hole under the spring elastic force, completes the fixation, when replacing, can pull out only by exerting axial tension, need not to dismantle the welding or uses screwdriver etc.

This utility model discloses a light-powered hair styling device. The device includes a main unit, a curling tube, a light-emitting lamp, and a PCBA control board. The curling tube is connected to the main unit, and the light-emitting lamp is located inside the curling tube. The light-emitting lamp is connected to the PCBA control board via a conductive wire, and an isolation bracket is provided between the light-emitting lamp and the conductive wire. By adding an isolation bracket between the light-emitting lamp and the conductive wire, this utility model utilizes the physical barrier effect of the isolation bracket to block the direct transmission of infrared rays emitted by the light-emitting lamp to the high-temperature radiation conductive wire. The isolation bracket forms a "radiation barrier," preventing high temperature and infrared rays from directly acting on the outer sheath of the conductive wire, delaying the aging, softening, and burning of the outer sheath, effectively avoiding safety accidents such as short circuits and electric shocks, and improving the long-term reliability of the light-powered hair styling device.

The invention discloses a sulfur-free FR-4 copper-clad plate and a preparation method thereof, and belongs to the technical field of copper-clad plates. The copper-clad plate is prepared from sulfur-free epoxy resin, a sulfur-free curing agent, a sulfur-free flame retardant, organic silicon hybrid macromolecules, tetrafunctional epoxy resin, linear phenolic resin, microencapsulated ammonium polyphosphate, melamine cyanurate, surface grafting modified boehmite nanorods and filler. Through the design of a sulfur-free system, the sulfur content of the product is lower than 50 ppm, and the problems of contact resistance increase, unstable signal transmission and the like caused by sulfide migration of a traditional FR-4 copper-clad plate in a high-temperature and high-humidity environment are thoroughly solved. Meanwhile, the organic silicon hybrid macromolecules and the high-functionality epoxy resin have a synergistic effect, so that the balance of high glass transition temperature and high toughness is realized. The copper-clad plate has excellent dielectric property, flame retardant property and long-term reliability, and meets the development requirements of high reliability and high performance of electronic products.

The utility model relates to the technical field of nuclear power engineering, and discloses a stainless steel special-shaped pipe for nuclear power engineering, which comprises two stainless steel pipes in butt joint with each other, sealing assemblies for butt joint are respectively arranged at adjacent ends of the two stainless steel pipes, and the sealing assemblies are respectively positioned on butt joint rings and butt joint pipes on the two stainless steel pipes. An elastic ring with elasticity is installed in the center of the interior of the butt joint pipe, a movable plate is arranged on the outermost side of the butt joint pipe, a connecting hole is formed in the outer side of the elastic ring in a penetrating mode, a sealing plug is plugged in the connecting hole, a cement layer is injected into the interior of the butt joint pipe from an opening of the movable plate, and the two sides of the elastic ring are filled with the cement layer. According to the technical scheme, the stainless steel special-shaped pipe provides efficient and stable sealing performance through the unique structural design such as close fit of the butt joint ring and the butt joint pipe, elastic sealing of the elastic ring and a cement injection system, meanwhile, the mechanical protection of the pipeline is improved through the design of the protective layer, and the service life of the pipeline is prolonged through the design of the protective layer.

The application relates to a seam welding packaging device and relates to the technical field of electronic component packaging. The seam welding packaging device comprises a machine shell, a positioning mechanism, a feeding mechanism, a material moving mechanism and a packaging mechanism. The machine shell is provided with a sealed cavity, and the sealed cavity is provided with a mounting seat. The positioning mechanism comprises a positioning table arranged on the mounting seat. The feeding mechanism comprises two feeding assemblies arranged in the sealed cavity. The two feeding assemblies are arranged in the left-right direction at intervals. One of the two feeding assemblies is used for supplying a base body, and the other feeding assembly is used for supplying a cover body. The material moving mechanism comprises two material moving assemblies arranged on the mounting seat. One of the two material moving assemblies is used for moving the base body to the positioning table, and the other material moving assembly is used for moving the cover body to the base body on the positioning table. The packaging mechanism comprises a seam welding machine arranged in the sealed cavity. The seam welding machine is movably arranged, so that the roller electrode of the seam welding machine can roll and press weld the base body and the cover body.