229results about How to "Improve long-term reliability" patented technology

The invention relates to a self-adaptive firewall rule generation method and device based on real-time threat intelligence, and the method comprises the steps: carrying out the semantic analysis of a threat intelligence text, extracting attack indexes and attack technique and tactics labels, and generating an intelligence triple set and an attack technique and tactics label set; calling a language model to generate candidate rules based on an intelligence analysis result, carrying out credibility scoring, intercepting a low-scoring rule as a high-risk illusion rule, and entering other rules into a to-be-verified set; constructing a digital twinborn shadow sub-domain to perform real-time traffic verification on the rule set to be verified, and dividing the rule set to be verified into an effective rule set and an invalid rule set according to a verification result; constructing a rule dependence graph based on the invalid rule set to perform pollution traceability, and adding nodes with excessive pollution into an isolation list; and cleaning the historical training samples based on the isolation list and the interception rule log, and performing incremental training on the language model to generate an updated model.

The invention belongs to the technical field of photovoltaic backboards, and particularly relates to a high-reflection integrally-formed backboard for a single-glass assembly and a preparation method thereof.The preparation method comprises the following steps that S1, a PET film base material is provided, plasma surface treatment is conducted, then polyurethane coating is coated on the two sides to form an outer-layer weather-proof fluorine coating and an inner-layer functional coating respectively, and the outer-layer weather-proof fluorine coating and the inner-layer functional coating are formed; a CPC backboard base material is obtained; s2, white high-reflection EVA granules are fused and plasticized, a white EVA adhesive film is obtained through extrusion of a hanger type T-shaped flat die head, then the white EVA adhesive film is compounded with the inner functional coating of the CPC backboard base material, and a firm complex without a definite physical interface is obtained through rolling; s3, cooling the composite body through at least two stages of cooling rollers to obtain a coiled material; and S4, the coiled material is irradiated, and the high-reflection integrally-formed backboard is obtained.

The invention provides an electronic device, a ceramic substrate and a preparation method thereof, and relates to the technical field of semiconductors. The ceramic substrate comprises a ceramic base body and a liquid channel layer, the liquid channel layer is arranged in the ceramic base body, the liquid channel layer and the ceramic base body are integrally sintered and formed, the liquid channel layer comprises a liquid channel, the liquid channel is used for containing a cooling medium, and the liquid channel extends in the ceramic base body along a three-dimensional space path. The preparation method of the ceramic substrate comprises the following steps: preparing slurry containing ceramic powder, preparing a sacrificial template matched with a target liquid channel in shape, pouring the slurry to coat the sacrificial template, filling a mold with the slurry to obtain a ceramic blank, removing the sacrificial template to form a hollow channel in the ceramic blank, and sintering to form the ceramic substrate with the liquid channel. The electronic device comprises the ceramic substrate, a component and a liquid cooling circulation system.

The invention discloses a low-delay adaptive code rate control system for a meteorological monitoring video stream, and relates to the technical field of adaptive code rate control in video stream media transmission, and the system comprises a content importance analysis module which is used for carrying out the real-time analysis of a video block to be transmitted, generating a content importance score representing the meteorological information value; and the decision arbitration module is connected with the content importance analysis module and is used for receiving the content importance score, the network state information and the buffer area state information. According to the low-delay adaptive code rate control system for the meteorological monitoring video stream, bandwidth resources can be allocated according to the difference of meteorological information values of video contents, the quality of key monitoring pictures is guaranteed preferentially when network conditions fluctuate, unnecessary code rate switching is inhibited actively through internal look-ahead simulation and risk assessment, and the quality of the meteorological monitoring video stream is improved. Therefore, balance between continuous and clear transmission of high-value information and overall watching fluency is realized in a complex network environment.

The application relates to a gallium nitride epitaxial structure forming method and a semiconductor device. The method comprises the following steps: sequentially forming a buffer layer, an intrinsic GaN layer and an AlGaN layer on a substrate; growing a P-type doped GaN epitaxial layer on the AlGaN layer, controlling the doping concentration and thickness of the P-type GaN layer, performing N-type ion implantation on the P-type GaN layer, controlling the implantation depth in the range of 20nm-30nm, and then performing annealing. In another mode, the AlGaN layer is subjected to P-type ion implantation before the P-type GaN layer is grown to form an asymmetric P-type doped area, and then annealing is performed, and the implantation area is still P-type after annealing by controlling the implantation dose. In the semiconductor device, the contact layer is obtained by patterning the P-type GaN layer, and the P-type doped area with the highest doping concentration or the largest doping area is arranged at the position of the contact layer. The gate breakdown voltage can be improved, the threshold voltage can be stabilized, the low on-resistance can be maintained, and the CMOS process compatibility can be realized.

The application provides a split-gate flash memory and a manufacturing method thereof. The memory comprises a semiconductor substrate, has an active region and an isolation structure, and part of the surface of the isolation structure is lower than the surface of the active region to form a groove; a coupling medium layer covers the top and sidewall of the active region; a floating gate is located on the surface of the coupling medium layer and surrounds the top and sidewall of the active region and does not completely fill the groove; an inter-electrode medium layer is located on the surface of the floating gate; a control gate is located on the surface of the inter-electrode medium layer and fills the remaining part of the groove; a word line is located on the sidewall of the floating gate and the control gate; and a tunneling medium layer is located between the word line and the floating gate, the control gate and the substrate. The application enhances the control force by three-dimensionally surrounding the channel with the floating gate, reduces the risk of punch-through, increases the coupling rate by filling the groove with the control gate, reduces the operating voltage, and improves the reliability of the device.

This invention discloses a method for overlapping construction of waterproofing systems in existing subway lines. It relates to the field of underground engineering waterproofing construction technology and includes: Step 1, current status investigation and deformation assessment; Step 2, overlapping structure system design; Step 3, key material selection and process matching; Step 4, refined overlapping construction process; and Step 5, full inspection after each process. This invention's method for overlapping construction of waterproofing systems in existing subway lines, through Step 1, involves structural deformation monitoring and analysis and diagnosis of the existing waterproofing layer; Step 2, involves deformation adaptation structure design and differential deformation compensation design; Step 3, involves material selection and process innovation; Step 4, involves base treatment, interface treatment, expansion joint and node construction, and reinforcement layer construction; and Step 5, involves process inspection. This method, tailored to the characteristics of existing subway lines, enables the effective combination of different waterproofing materials, adapts to continuous deformation, and ensures long-term reliability.

The invention relates to an environment-friendly process method for improving the surface metal cleaning efficiency of a silicon wafer, and belongs to the technical field of semiconductor silicon wafer processing, and the process method comprises the following operation steps: S1, pre-cleaning and activation: placing the silicon wafer in a first cleaning tank, introducing ozone into ultrapure water, and processing in cooperation with low-frequency ultrasound; and S2, main cleaning and complexing: placing the silicon wafer subjected to pre-cleaning and activating treatment in a second cleaning tank, and treating the silicon wafer in a dilute citric acid solution in cooperation with high-frequency ultrasound. And S3, overflow rinsing: placing the silicon wafer subjected to main cleaning and complexing treatment in a third cleaning tank. And S4, drying: carrying out drying treatment on the silicon wafer subjected to the overflow rinsing treatment. Through the synergistic effect of physical stripping, chemical oxidation and complexing dissolution, under the condition that highly toxic chemicals such as hydrofluoric acid are not used, the cleanliness of metal on the surface of the silicon wafer reaches the ppt level, and the problems that traditional RCA cleaning is serious in environmental pollution and high in operation risk are effectively solved.

This utility model discloses a light-powered hair styling device. The device includes a main unit, a curling tube, a light-emitting lamp, and a PCBA control board. The curling tube is connected to the main unit, and the light-emitting lamp is located inside the curling tube. The light-emitting lamp is connected to the PCBA control board via a conductive wire, and an isolation bracket is provided between the light-emitting lamp and the conductive wire. By adding an isolation bracket between the light-emitting lamp and the conductive wire, this utility model utilizes the physical barrier effect of the isolation bracket to block the direct transmission of infrared rays emitted by the light-emitting lamp to the high-temperature radiation conductive wire. The isolation bracket forms a "radiation barrier," preventing high temperature and infrared rays from directly acting on the outer sheath of the conductive wire, delaying the aging, softening, and burning of the outer sheath, effectively avoiding safety accidents such as short circuits and electric shocks, and improving the long-term reliability of the light-powered hair styling device.

The invention discloses a sulfur-free FR-4 copper-clad plate and a preparation method thereof, and belongs to the technical field of copper-clad plates. The copper-clad plate is prepared from sulfur-free epoxy resin, a sulfur-free curing agent, a sulfur-free flame retardant, organic silicon hybrid macromolecules, tetrafunctional epoxy resin, linear phenolic resin, microencapsulated ammonium polyphosphate, melamine cyanurate, surface grafting modified boehmite nanorods and filler. Through the design of a sulfur-free system, the sulfur content of the product is lower than 50 ppm, and the problems of contact resistance increase, unstable signal transmission and the like caused by sulfide migration of a traditional FR-4 copper-clad plate in a high-temperature and high-humidity environment are thoroughly solved. Meanwhile, the organic silicon hybrid macromolecules and the high-functionality epoxy resin have a synergistic effect, so that the balance of high glass transition temperature and high toughness is realized. The copper-clad plate has excellent dielectric property, flame retardant property and long-term reliability, and meets the development requirements of high reliability and high performance of electronic products.

The application relates to a seam welding packaging device and relates to the technical field of electronic component packaging. The seam welding packaging device comprises a machine shell, a positioning mechanism, a feeding mechanism, a material moving mechanism and a packaging mechanism. The machine shell is provided with a sealed cavity, and the sealed cavity is provided with a mounting seat. The positioning mechanism comprises a positioning table arranged on the mounting seat. The feeding mechanism comprises two feeding assemblies arranged in the sealed cavity. The two feeding assemblies are arranged in the left-right direction at intervals. One of the two feeding assemblies is used for supplying a base body, and the other feeding assembly is used for supplying a cover body. The material moving mechanism comprises two material moving assemblies arranged on the mounting seat. One of the two material moving assemblies is used for moving the base body to the positioning table, and the other material moving assembly is used for moving the cover body to the base body on the positioning table. The packaging mechanism comprises a seam welding machine arranged in the sealed cavity. The seam welding machine is movably arranged, so that the roller electrode of the seam welding machine can roll and press weld the base body and the cover body.

The invention provides a composite material, a preparation method thereof and conductive slurry, and belongs to the technical field of conductive materials. The preparation method comprises the steps that a base material is pretreated, an activated base material is obtained, and the base material comprises copper powder or nickel powder; and an atomic layer deposition technology is adopted, a coating layer is deposited on the surface of the activated base material, the composite material is obtained, and the coating layer comprises a silver layer. The composite material prepared by the invention has the characteristics of uniform and compact coating, controllable thickness, strong interface bonding force, strong oxidation resistance, stable performance and the like, and the performance of the conductive slurry can be remarkably improved.

The application belongs to the field of solar cells. A gap film and a photovoltaic module are provided. The gap film comprises a bonding layer, an insulating layer, a first metal reflection layer, a first reflection structure, a support body and a second metal reflection layer which are sequentially stacked. The gap film of the application effectively improves the front power gain of the photovoltaic module, and has good long-term reliability.

This invention relates to the field of radio frequency device design optimization technology, and provides an AI-based duplexer design optimization method and system. The method includes: predicting the event frequency characteristics of the future application environment; determining a correction factor based on the magnitude of the exceedance when the event frequency exceeds a threshold; correcting the key structural parameters of the duplexer to be designed based on the correction factor; and completing the duplexer design based on the corrected key structural parameters. Compared to existing methods that rely solely on experience or a single indicator for design, this invention achieves closed-loop optimization from identifying additional environmental factors to adaptive parameter adjustment, exhibiting higher accuracy and foresight, while avoiding the cost increase caused by over-design, and significantly improving the duplexer's adaptability and long-term reliability in complex environments.

The utility model relates to the technical field of kitchen appliances, and discloses an exhaust fume collecting hood of a range hood, which is provided with an exhaust fume suction port and an exhaust fume collecting cavity, and comprises an exhaust fume collecting hood shell, an exhaust fume collecting hood cover and an exhaust fume collecting hood cover, the opening and closing plate is used for opening or closing the smoke suction port; the opening and closing mechanism comprises a mounting frame and a first connecting rod, the first connecting rod is connected to the mounting frame and the opening and closing plate, the mounting frame is mounted on the lower surface of the top plate and adjacent to the side plate, and a reinforcing structure is arranged between the mounting frame and the side plate. According to the utility model, the opening and closing mechanism is fixed on the top plate, so that the appearance of the product is ensured, the opening and closing mechanism is convenient to install and fix, and the reinforcing structure is arranged near the top plate, so that the reinforcing structure can support and reinforce the top plate, and the bearing capacity of the top plate is improved; the deformation of the top plate caused by the long-term weight effect of the opening and closing mechanism is avoided, and the overall structural strength of the exhaust fume collecting hood and the movement stability of the opening and closing mechanism are guaranteed.

The application relates to the technical field of semiconductor simulation, in particular to a semiconductor device power consumption simulation data analysis method and system, which comprises the following steps: setting a plurality of working scenes and design parameters of a semiconductor device, simulating the semiconductor device under each working scene and each design parameter, obtaining a temperature sensitivity coefficient based on the difference between the junction temperature data and the environmental temperature data of the semiconductor device under any working scene and in combination with the dynamic proportion under the working scene, adjusting the static power consumption data change condition of the semiconductor device under different design parameters, and respectively performing weighted processing on the dynamic proportion adjustment result under the working scene and the change condition of the dynamic power consumption data, so that the difference between the weighted static power consumption change amount and the weighted dynamic power consumption change amount is used to iteratively optimize the design parameters of the semiconductor device. The application effectively reduces the overall power consumption of the semiconductor device and enhances the thermal stability.

This invention discloses a layered design method for snow surface overlay on ice-structured load-bearing structures, relating to the field of ice and snow engineering technology. The method includes the following steps: S1, determining the design constraints and performance indicators of the snow surface overlay based on target working conditions and environmental data; S2, obtaining the microstructural parameters of the snow material to be laid, including initial porosity, ice crystal size distribution, coordination number, and contact geometry. This invention establishes a cross-scale mechanical performance evolution model to accurately capture the microscopic mechanisms of ice crystal sintering, particle creep, and fatigue damage of snow material under long-term load and temperature, solving the problem of performance prediction deviations caused by the inability of existing macroscopic models to reflect microscopic evolution. By constructing a quantitative mapping relationship between microstructural parameters and macroscopic mechanical properties, combined with thermo-coupling load history simulation, accurate performance evolution data of the overlay can be obtained.

The application provides a copper-aluminum dissimilar metal resistance brazing method for a wind power generator, comprising the following steps: S1, temperature field regulation of partition resistance heating: a partition resistance heating mode of double-electrode independent power supply is adopted, current is respectively input to the copper side and the aluminum side for independent control, and the brazing interface temperature is controlled in the range of 580-620 DEG C; S2, interface diffusion control of nano nickel barrier layer: a nano-crystalline nickel barrier layer is prepared in advance on the surface of the copper matrix to be connected; S3, wetting and filling of zinc-based composite filler material: zinc-based composite filler material is used for brazing; S4, pressure-assisted brazing seam densification: axial pressure in the range of 0.5-2 MPa is applied during brazing; S5, atmosphere protection and surface activation: the brazing process is carried out under the condition of inert protective atmosphere. Through the cooperation of partition heating and nano nickel barrier layer, the strength of the copper-aluminum brazed joint is improved to more than 80% of the base material, and the contact resistance is reduced to 3 mu omega cm 2 The energy consumption of the single piece is reduced by 80%, and the qualified rate reaches more than 95%.

The application discloses a kind of enhanced Sn-Ag-Cu low silver lead-free solder and its preparation method and application, and the specific components of enhanced technical scheme are as follows: Cu: 0.5%~1.0%, Ag: 0.1%~1.0%, La: 0.002%~1.2%, Ge: 0.002%~1.3%, Co: 0.001%~1.2%, and the rest is Sn, calculated by mass percentage. Under the joint action of the added elements, the microstructure of the solder can be improved, thereby effectively enhancing the creep resistance of the solder, greatly improving the fatigue life of the solder at high temperature, and significantly improving the reliability of the solder.

The invention relates to the technical field of power motors, in particular to a base and end cover sealing structure and a motor, and the base and end cover sealing structure comprises a base, a shell, an outer end cover, an inner end cover and a sealing element; the inner end cover is detachably arranged at the first end of the base, the second end, opposite to the inner end cover, of the base is rotationally connected with a rotary connecting assembly, and the rotary connecting assembly is connected with the shell. One end of the outer end cover is connected with the shell, the other end of the outer end cover is opposite to the inner end cover, and the sealing piece is arranged between the inner end cover and the outer end cover and seals the opposite space between the inner end cover and the outer end cover; a connecting buckle is arranged at the end, facing the rotary connecting assembly, of the inner end cover, and an assembling clamping groove matched with the connecting buckle is formed in the base. The problems that traditional threaded connection is low in efficiency and prone to failure are solved, and efficient assembly and reliable sealing are achieved while the stability of the overall structure after connection with external accessories is guaranteed.

The invention discloses a three-dimensional packaging chip system with a built-in interconnection test function and a detection method thereof, and the system comprises a packaging semiconductor main body which is internally provided with a plurality of wiring layers, a testability design (DFT) circuit which is integrated in a chip, and an internal multi-channel selection switch network which is controlled by the DFT circuit and is arranged on each wiring layer. And at least two detection pins / pads which are arranged outside the package and have a small number and increased pin spacing. According to the method, the DFT circuit is used for controlling switching of the switching network, different internal interconnection paths are multiplexed to the detection point in a time division mode for electrical measurement, and accurate positioning of fault nodes is achieved by analyzing multiple sets of measurement results. According to the method, the problem that the needle card is difficult to test due to warping of high-density packaging is effectively solved, hierarchical and nodal accurate diagnosis of internal interconnection faults of three-dimensional packaging is realized for the first time, the test cost and complexity are remarkably reduced, and a hardware basis is provided for online function repair.

This utility model provides a cable fixing structure for the handover test of a photovoltaic power station transformer substation, belonging to the technical field of cable fixing structures. The cable fixing structure includes: a wedge-shaped metal ring assembly divided into at least three circumferential segments, each segment having a spiral groove on its outer surface; a high-friction flexible pad tightly fitted to the inner circumferential surface of each segment; and an integral elastic steel ring surrounding the outer side of the metal ring assembly, the inner circumferential surface of which has a protruding ridge that engages with the spiral groove. When the elastic steel ring rotates relative to the metal ring assembly, the protruding ridge slides along the spiral groove, driving each wedge-shaped metal ring segment to synchronously contract radially and synchronously generate axial displacement, thus forming a self-tensioning clamp. This solves the problem of loose cable joints and uneven stress during the handover test caused by the inability of traditional fixing structures to adaptively clamp according to changes in cable tension.

This utility model relates to the field of weight production technology, and in particular to a fixing device for weight production and grinding. It includes a base plate, a support column fixedly connected to the rear upper side of the base plate, a telescopic rod slidably connected inside the support column, a motor fixedly connected to the upper end of the telescopic rod, a first linkage rod fixedly connected to the output end of the motor, second linkage rods rotatably connected to the left and right ends of the first linkage rod, a clamping plate rotatably connected to the end of the second linkage rod away from the first linkage rod, a sliding plate slidably connected to the rear end of the clamping plate, a controller fixedly connected to the upper end of the sliding plate, a sensor fixedly connected to the inner side of the clamping plate, and a clamp fixedly connected to the inner side of the sensor. Through the design and cooperation of the motor and the first linkage rod, the motor drives the clamping plate to clamp the weights inside, while the clamps inside the clamping plate clamp and fix weights of different sizes, eliminating the need for manual adjustment of the clamps and significantly reducing manual operation time.

This invention discloses a bio-based biodegradable synthetic leather material and its preparation method, belonging to the field of polymer synthetic leather material manufacturing and modification technology. The method includes: mixing and dehydrating castor oil polyol, lignin-based polyol, and bio-based polycarbonate diol; adding isocyanate and a bio-based chain extender containing dynamic disulfide bonds to react and obtain a bio-based polyurethane resin; dissolving the resin in a solvent; adding amphiphilic modified nanocellulose whiskers, polydopamine-modified silica, bio-based epoxidized soybean oil, a pore-forming agent, and a stabilizer to obtain a synthetic leather coating solution; coating the coating solution onto a base fabric to form a wet film; gradient solidification; washing with water; and drying to obtain the bio-based biodegradable synthetic leather material. This invention improves the crosslinking stability and interlayer bonding force of the material under hygrothermal aging by using dynamic disulfide bond self-repair, nanoparticle interface enhancement, and gradient solidification to regulate the pore structure, reducing the release of volatile organic compounds, and balancing water resistance, moisture permeability, and biodegradability.

The invention relates to a quasi-isotropic composite material, a photovoltaic composite material and a photovoltaic frame, and belongs to the technical field of composite materials. The quasi-isotropic composite material comprises a long glass fiber skeleton and a resin matrix A; the long glass fiber framework comprises at least two layers of long glass fibers A, and each layer of long glass fibers A is arranged according to an equal regular angle. According to the invention, the long glass fibers are arranged according to the equal regular angles, and the mechanical properties of the composite material in the direction perpendicular to the long glass fibers and in different angle directions are enhanced on the basis of retaining the mechanical property advantages of the composite material in the reinforcing direction of the long glass fibers, so that the prepared composite material has the characteristic of quasi-isotropy.

The invention relates to the technical field of electric digital data processing, in particular to an event prediction and alarm generation method based on multi-modal physiological time sequence data, which comprises the following steps: judging whether a suspected falling trend occurs or not; determining a plurality of preliminary abnormal segments; determining a physiological feature vector corresponding to each preliminary abnormal segment; calculating a physiological comprehensive index, and determining a plurality of final abnormal segments; calculating a physiological tumble index and an environmental slip index; determining an event type corresponding to the suspected tumble trend based on the difference between the physiological tumble index and the environmental slip index; generating a corresponding alarm prompt based on the real prediction type; and adjusting a preset impact amplitude threshold value. According to the method, the problems of low prediction accuracy, high false alarm rate and poor system adaptive capacity caused by single data mode and excessive dependence on static parameters in the prior art are effectively solved through multi-mode time sequence data fusion and a dynamic threshold adjustment mechanism.

The invention discloses an active valve based on a middle clamped piezoelectric film and application thereof, and belongs to the technical field of fluid control. The active valve comprises a non-piezoelectric actuating structural member and at least one piezoelectric actuating structural member; the non-piezoelectric actuating structural member comprises an outer frame and a supporting component, the outer frame forms a frame of the whole valve, and the supporting component is used for supporting and fixing the piezoelectric actuating structural member; the piezoelectric actuating structural member is used for controlling and forming an air flow / liquid flow channel so as to control the opening and closing of the valve; gaps are formed between the piezoelectric actuating structural members and the outer frames of the non-piezoelectric actuating structural members, or between the piezoelectric actuating structural members when a plurality of piezoelectric actuating structural members exist, or between the piezoelectric actuating structural members and the outer frames and between the piezoelectric actuating structural members at the same time, and the gaps are opened to form air flow / liquid flow channels; the piezoelectric actuating structural member is fixed on the supporting component in a middle fixed support manner; the piezoelectric actuating structural member at least comprises a piezoelectric material, and a piezoelectric film material enables the valve to quickly respond to voltage change.

The utility model discloses a kind of anti-misconnection terminal block structures of frequency conversion cabinet, it is related to electrical equipment technical field, including terminal block base, anti-misconnection terminal block, coding identification component, locking mechanism and wiring verification module;Terminal block base is provided with several terminal installation grooves along length direction, and the inner wall of each installation groove is equipped with positioning boss;Anti-misconnection terminal block is detachably installed in terminal installation groove, including wiring terminal main body and the anti-miscode structure of being set to the outer side of wiring terminal main body, anti-miscode structure is positioned with positioning boss cooperation;Coding identification component includes the color mark area and coding recess groove being set to terminal block base, and the coding plug-in unit being cooperatively installed in coding recess groove;Locking mechanism is set between anti-misconnection terminal block and terminal block base;Wiring verification module is integrated in terminal block base interior.The utility model is positioned by multiple anti-misdesign, and terminal misinstallation, misconnection is completely eliminated from physical structure, and human wiring error rate is greatly reduced.

The present application relates to the field of high polymer bonding method, and discloses a kind of in-situ bonding method of decorative film layer and soft glue base material, comprising: the decorative layer with latent reaction layer in back is placed in situ interface reaction field;Initial high polymer bonding matrix is introduced and maintained non-isothermal enthalpy relaxation state to retain free chain segment kinetic activity;Chemical potential gradient is used to induce component migration to interface and form enrichment layer;Secondary heat pulse is applied to induce reaction group and latent reaction layer to covalently bond to construct interpenetrating network;Secondary high polymer bonding matrix is introduced to drive chain segment penetration using hydrostatic pressure, the present application realizes interface chemical reconfiguration by component directional migration, eliminates thermodynamic repulsion effect, changes interface failure mode into bulk cohesive failure, and enhances stability under severe working conditions.

This invention belongs to the field of semiconductor manufacturing technology, and relates to a diamond-silicon carbide composite substrate, its preparation method, and its application. The preparation method includes the following steps: coating a silicon substrate with SiC quantum dot sol and annealing it with pulsed laser to obtain a nucleation dot array; sequentially depositing a gradient buffer layer, a 3C-SiC thin film, and a diamond layer; and polishing the surface of the 3C-SiC thin film. The gradient buffer layer is a SiGeC gradient buffer layer with a thickness of 5-10 nm; the 3C-SiC thin film has a thickness of 0.5-5 μm. This invention can achieve stable composite formation of an ultrathin SiC layer with uniform thickness and a smooth surface with diamond while ensuring interfacial bonding strength and structural integrity, which is beneficial for the development and application of high-performance diamond-silicon carbide composite substrates.