The invention discloses a high-reliability
system-in-
package structure and a manufacturing method thereof, and provides a core solution for solving the problems of serious warping and reliability caused by mismatching of
thermal expansion coefficients of materials and step-by-step
processing in traditional double-sided packaging. Carrying out one-
time integral plastic packaging by using an isotropic common
plastic packaging material, and finally, exposing a
chip electrode through
grinding and manufacturing upper layer
interconnection; according to the method, process warping and
internal stress are completely eradicated fundamentally through process reconstruction of pasting first and then co-sealing and application of a single common material. According to the structure, a packaging main body is mainly formed by a common
plastic packaging material, a plurality of chips are integrated in the packaging main body, and high-density electrical
interconnection is realized through a rewiring layer and a
copper column; the problem of warping is solved, and the production yield, the heat dissipation performance and the long-term reliability of products are remarkably improved.