Thick-film dielectric and conductive compositions

Inactive Publication Date: 2005-09-22
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0011] The conductive compositions according to the above embodiments can be used to form circuit components such as capacitors. The capacitors can be embedded in printe

Problems solved by technology

Pure barium titanate has its maximum capacitance at its Curie point, which is at 125° C., making pure barium titanate unsuitable for many applications.
Conventional dopants such as barium zirconate, niobium oxide, and strontium titanate may not be suitable for all applications, such as firing at the lower temperatures used in thick-film processing.
For example, conventional multilayer ceramic capacitors with such dopants are typically sintered for two (2) hours or more in air or in reducing atmospheres, at peak temperatures i

Method used

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  • Thick-film dielectric and conductive compositions
  • Thick-film dielectric and conductive compositions
  • Thick-film dielectric and conductive compositions

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Embodiment Construction

[0017] The invention concerns: (1) high dielectric constant thick-film barium titanate-based dielectric powder and paste compositions; (2) conductive powder and paste compositions; and (3) capacitors and other components formed using dielectric paste and conductive paste embodiments. Thus, in this detailed description, high dielectric constant thick-film barium titanate-based dielectric powder and paste compositions are disclosed; copper thick-film electrode powder and paste compositions are also disclosed; and fired-on-foil circuit components are disclosed. The high dielectric constant thick-film barium titanate-based dielectric paste compositions and the copper thick-film electrode paste compositions discussed in this specification may be used, for example, to form fired-on-foil passive circuit components. The thick-film barium titanate-based dielectric powder and paste compositions are used to form dielectrics having high dielectric constants (K) after firing.

[0018] The dielectr...

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Abstract

Conductive powder and paste compositions are formed having desirable electrical and physical properties. The conductive powder and paste compositions may be used in combination with dielectric powder and thick-film paste compositions, which are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties, to form capacitors and other fired-on-foil passive circuit components.

Description

RELATED APPLICATIONS [0001] This application is related to Application Ser. No. 60 / 418,045, filed in the United States Patent and Trademark Office on Oct. 11, 2002, now U.S. National application Ser. No. 10 / 651,367, and entitled “CO-FIRED CERAMIC CAPACITORS AND METHOD FOR FORMING CERAMIC CAPACITORS FOR USE IN PRINTED WIRING BOARDS,” and Application Ser. No. 60 / 433,105 filed in the United States Patent and trademark Office on Dec. 13, 2002, now U.S. application Ser. No. 10 / 633,551 filed in the United States Patent and Trademark Office on Sep. 16, 2003 and entitled “PRINTED WIRING BOARDS HAVING LOW INDUCTANCE EMBEDDED CAPACITORS AND METHODS OF MAKING SAME”.BACKGROUND [0002] 1. Technical Field [0003] The technical field is circuit components. More particularly, the technical field includes powders and pastes used to form dielectric and conductive elements. [0004] 2. Related Art [0005] Passive components may be embedded in printed wiring board innerlayer panels that are stacked and conn...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C32/00H01G4/008H01G4/12H05K1/09H05K1/16
CPCC22C32/0089H01G4/0085H01G4/1227H05K2201/0355H05K1/162H05K2201/017H05K1/092
Inventor BORLAND, WILLIAM J.RENOVALES, OLGA L.SMITH, JEROME DAVID
Owner EI DU PONT DE NEMOURS & CO
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