162results about How to "Mechanical strength" patented technology

A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

A semiconductor device includes a semiconductor element formed on a semiconductor substrate, a first interconnect formed over the semiconductor substrate so as to be electrically connected with the semiconductor element, and a second interconnect formed over the first interconnect with an interlevel insulation film made of an insulator having a lower dielectric constant than a dielectric constant of silicon oxide interposed between the first interconnect and the second interconnect. Furthermore, the semiconductor device includes a first dummy interconnect formed in part of the semiconductor substrate located in the vicinity of the first interconnect or the second interconnect.

A film comprising a blend of:i) a homopolymer of ethylene having a Mw/Mn of 3 or a copolymer of ethylene and up to 50% weight % of a C3 to C20 olefm, the copolymer having a CBDI of 50% or more;ii) a homopolymer of propylene or a copolymer of propylene and up to 50 weight % of a comonomer selected from the group consisting of ethylene and C4 to C20 alpha-olefms; andiii) a polymer produced in a high pressure process using a free radical initiator.

A backrest structure for a vehicle seat comprises two hydroformed, tubular, horizontal crosspieces and vertical uprights engaged without any clearance in orifices punched into these crosspieces during hydroforming.

A battery pack includes: a battery having a main surface; and a resin layer capable of being integrated with an armor member armoring the battery so that at least a part of the main surface of the battery is exposed and covering the main surface of the battery, wherein the resin layer is formed by curing a reaction curable resin having a viscosity of not less than 80 mPa·second to less than 1000 mPa·second and a thickness of the resin layer on the main surface of the battery ranges from 0.05 mm to smaller than 0.4 mm.

In a nonwoven fiber assembly which comprises a fiber comprising a thermal adhesive fiber under moisture and in which the fiber are entangled with each other, the fibers are bonded at contacting points of the fibers by melting the thermal adhesive fiber under moisture to distribute the bonded points approximately uniformly, thereby obtaining a buffer substrate. The buffer substrate may further comprises a conjugated fiber comprising a plurality of resins which are different in thermal shrinkage and form a phase separation structure, and the conjugated fibers may have an approximately uniform crimps having an average curvature radius of 20 to 200 μm and are entangled with the fibers constituting the nonwoven fiber assembly. The buffer substrate can be obtained by a method comprising the steps of: forming a web from the fiber comprising the thermal adhesive fiber under moisture; and subjecting the obtained fiber web to a heat and moisture treatment with a high-temperature water vapor to melt the thermal adhesive fiber under moisture for bonding the fibers. The buffer substrate has a high air-permeability, an excellent cushion property and softness.

A gypsum board which has a gypsum core having a first side and a second side and a facing sheet disposed on the first side, wherein the facing sheet is made of a sheet material and said sheet material has at least one surfactant, filler particles and at least one polymeric binder. Also, a process of making a gypsum board.

A socket body and a header body are respectively reinforced by inserted reinforcing members, so that a protruding table in a plug groove of the socket body is eliminated and a width dimension thereof is reduced. The socket body is formed in a flat rectangular parallelepiped shape by resin molding, and a pair of socket reinforcing members is inserted into both end portions in longitudinal direction, each having a pair of fixed portions respectively protruding outward from lower ends of side walls of the socket body and a coupling portion for coupling between a pair of the fixed portions. A plug groove of substantially rectangular shape is formed at center portion of the socket body, and plural pairs of socket contacts are respectively arranged in two lines on both side walls in longitudinal direction along the plug groove. Header reinforcing metal fittings formed on the same base metal and having substantially the same cross section as that of the header posts are integrally inserted into both end portions of the header body in the longitudinal direction.

A network (100) for replacement of a living tissue, said network is a scaffold-free artificial hollow biological tissue network comprising a plurality of longitudinal multicellular aggregates (11) arranged in a plurality of bioprinted layers (22) which are located on top of one another, further comprising an inner surface (20) and an outer surface (21), wherein at least one of said bioprinted layers (22) is in shape of a planar closed loop such that a conduit for conveying fluids is defined, and said longitudinal multicellular aggregate (11) is a mixture of at least two cell types. Also a method for obtaining said longitudinal multicellular aggregate, and a further method for biomodeling and planning said network are proposed.

Bone fixation or augmentation in a mammalian body to enhance the mechanical strength of a fracture is provided by reinforcement fixing bone ends together using the implant device. A resorbable device can be rendered anti-osteolytic by incorporating materials such as bisphosphonates. It can also be rendered osteoconductive by the incorporation of an osteoconductive material such as bioactive glass or TCP. The implant device has a matrix as one phase, where the matrix is made of a bioresorbable polymer. One phase of the implant is made from self-reinforcing elements and the matrix contains an antiosteolytic agent component. The implant contains further osteoconductive and/or osteoconductive material.

The present invention provides a ceramic filter to be used at a high temperature, and it contains a substance having preferential reactivity with an ash component contained in materials captured by the ceramic filter and not removed by a high temperature treatment such as combustion over the principal component of the ceramic filter; the reaction between said ash component being not removed by a high temperature treatment such as combustion of the filter and remaining accumulated and the filter component to cause melting of the filter being suppressed to attain a long period of service.

A gasification distributed temperature sensing system is disclosed. The sensing system includes a gasification vessel and a harsh environment fiber sensing cable package disposed within the gasification vessel, the sensing cable package includes a thermally conductive enclosure and at least one sensor cable including a distributed array of high-temperature fiber Bragg grating sensors, wherein the sensors are disposed and hermetically sealed within the thermally conductive enclosure.

A reduced weight and size shielded receptacle connector includes an internal insulative connector housing having top and bottom walls, without any sidewalls interconnecting the top and bottom walls together. A plurality of conductive terminals are supported within the connector. A receptacle portion of the connector is formed in cooperation with the top and bottom walls of the connector housing and with a pair of metal sidewalls formed by bending a shield member around parts of the connector housing. A metal retaining shield is provided that also overlies a portion of the connector housing and which is partially retained on the connector housing by the metal shell. The shield not only provides shielding, but also serves to retain the opposing connector in mating engagement with receptacle connector by way of three retention members that extend in and engaged the opposing connector in three different directions.

Poly(propylene fumarate) is copolymerized with poly(caprolactone) diol to produce a block copolymer of poly(propylene fumarate) and poly(ε-caprolactone). The biocompatible and bioresorbable block copolymer of poly(propylene fumarate) and poly(ε-caprolactone) is useful in the fabrication of injectable and in-situ hardening scaffolds for tissue and/or skeletal reconstruction. The block copolymer can be crosslinked by redox or photo-initiation, with or without an additional crosslinker. Thus, the copolymer is both self-crosslinkable (without the use of any crosslinkers) and photocrosslinkable (in the presence of UV light).

The invention relates to a work-hardened product, particularly a rolled, extruded or forged product, made of an alloy with the following composition (% by weight):

• • Cu 3.8-4.3; Mg 1.25-1.45; Mn 0.2-0.5; Zn 0.4-1.3; Fe<0.15; Si<0.15; Zr≦0.05; Ag<0.01,
  • other elements <0.05 each and <0.15 total, remainder Al treated by dissolution, quenching and cold strain-hardening, with a permanent deformation of between 0.5% and 15%, and preferably between 1.5% and 3.5%. Cold strain-hardening can be achieved by controlled tension and/or cold transformation, for example rolling, die forging or drawing. This cladded metal plate type product is a suitable element to be used as aircraft fuselage skin.

A circuit board includes a substrate, a nonconductive resin layer selectively formed on the substrate and containing fine metal particles, and a conductive metal layer formed on the resin layer, in contact with the fine metal particles which are exposed from the resin layer. A surface of the resin layer has irregularities, in an interface between the resin layer and the conductive metal layer. In a roughness curve of a section of the resin layer, in a case of an wavelength (λc) at the boundary of a roughness component and a waviness component is 1 μm, a maximum height (Rz) per reference length (1r) of 1 μm is 20 nm to 500 nm.

A heat-shrinkable white polyester film is provided which has extremely satisfactory cuttability along a perforation and has light-shielding properties. Also provided are: a label; and a process for producing the film with high productivity. The heat-shrinkable white polyester film comprises a polyester resin constituted of ethylene terephthalate as a main constituent component and containing at least 13 mol % one or more monomer ingredients capable of serving as an amorphous component among all components of the polyester resin. This film has specific heat shrinkability, specific light-shielding properties, and specific mechanical properties. The process is excellent in the productivity of the film. The label is obtained from the heat-shrinkable white polyester film.

An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.