5242results about "Water-setting substance layered product" patented technology

A multilayered material is provided which includes a substrate and a silicon-containing film formed on the substrate, wherein the silicon-containing film has a nitrogen-rich area including silicon atoms and nitrogen atoms, or silicon atoms, nitrogen atoms, and an oxygen atoms and the nitrogen-rich area is formed by irradiating a polysilazane film formed on the substrate with an energy beam in an atmosphere not substantially including oxygen or water vapor and denaturing at least a part of the polysilazane film. A method of producing the multilayered material is also provided.

A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a diamond containing surface and process for manufacture thereof.

Apparatus and method for atomic layer deposition on a surface of a substrate (6) in a treatment space. A gas supply device (15, 16) is present for providing various gas mixtures to the treatment space. The gas supply device (15, 16) is arranged to provide a gas mixture with a precursor material to the treatment space for allowing reactive surface sites to react with precursor material molecules to give a surface covered by a monolayer of precursor molecules attached via the reactive sites to the surface of the substrate. Subsequently, a gas mixture comprising a reactive agent capable to convert the attached precursor molecules to active precursor sites is provided. A plasma generator (10) is present for generating an atmospheric pressure plasma in the gas mixture comprising the reactive agent.

The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.

A perovskite-based thin film structure includes a semiconductor substrate layer, such as a crystalline silicon layer, having a top surface cut at an angle to the (001) crystal plane of the crystalline silicon. A perovskite seed layer is epitaxially grown on the top surface of the substrate layer. An overlayer of perovskite material is epitaxially grown above the seed layer. In some embodiments the perovskite overlayer is a piezoelectric layer grown to a thickness of at least 0.5 μm and having a substantially pure perovskite crystal structure, preferably substantially free of pyrochlore phase, resulting in large improvements in piezoelectric characteristics as compared to conventional thin film piezoelectric materials.

A member used within a plasma processing apparatus and exposed to a plasma of a halogen gas such as BCl₃ or Cl₂ is formed from a sintered body of metals of Group IIIa of Periodic Table such as Y, La, Ce, Nd and Dy, and Al and/or Si, for example, 3Y₂O₃.5Al₂O₃, 2Y₂O₃.Al₂O₃, Y₂O₃.Al₂O₃ or disilicate or monosilicate, and in particular, in this sintered body, the content of impurity metals of Group IIa of Periodic Table contained in the sintered body is controlled to be 0.15 wt % or more in total. Specifically, for this member, an yttrium-aluminum-garnet sintered body having a porosity of 3% or less and also having a surface roughness of 1 μm or less in center line average roughness Ra is utilized.

An Si/C composite includes carbon (C) dispersed in porous silicon (Si) particles. The Si/C composite may be used to form an anode active material to provide a lithium battery having a high capacity and excellent capacity retention.

New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

Compositions and methods for manufacturing sheets having a starch-bound matrix reinforced with fibers and optionally including an inorganic mineral filler. Suitable mixtures for forming the sheets are prepared by mixing together water, unmodified and ungelatinized starch granules, an auxiliary water-dispersible organic polymer, fibers, and optionally an inorganic mineral filler in the correct proportions to form a sheet having desired properties. The mixtures are formed into sheets by passing them between one or more sets of heated rollers to form green sheets. The heated rollers cause the auxiliary polymer to form a skin on the outer surfaces of the sheet that prevents the starch granules from causing the sheet to adhere to the rollers upon gelation of the starch. The green sheets are passed between heated rollers to gelatinize the starch granules, and then to dry the sheet by removing a substantial portion of the water by evaporation. The starch and auxiliary polymer form the binding matrix of the sheets with the fibers and optional inorganic filler dispersed throughout the binding matrix. The starch-bound sheets can be cut, rolled, pressed, scored, perforated, folded, and glued to fashion articles from the sheets much like paper or paperboard. The sheets are particularly useful in the mass production of containers, such as food and beverage containers.

The present invention provides a photocatalyst-carrying structure which has a structure, wherein an adhesive layer is provided in between a photocatalyst layer and a substrate, the adhesive layer is composed of silicon-modified resin, polysiloxane-containing resin or colloidal silica-containing resin, and for forming the photocatalyst layer a composition comprising a metal oxide gel or a metal hydroxide gel and a photocatalyst is used. Further, the present invention also provides a photocatalyst coating agent for producing a photocatalyst-carrying structure which contains silicon compound, at least one metal oxide sol or metal hydroxide sol, and at least one photocatalyst powder or sol.

A composite multi-layer barrier is produced by first vapor depositing a barrier under vacuum over a substrate of interest and then depositing an additional barrier at atmospheric pressure in a preferably thermoplastic layer. The resulting multi-layer barrier is then used to coat an article of interest in a lamination process wherein the thermoplastic layer is fused onto itself and the surface of the article. The vacuum-deposited barrier may consists of a first leveling polymer layer followed by an inorganic barrier material sputtered over the leveling layer and of an additional polymeric layer flash evaporated, deposited, and cured under vacuum. The thermoplastic polymeric layer is then deposited by extrusion, drawdown or roll coating at atmospheric pressure. The resulting multi-layer barrier may be stacked using the thermoplastic layer as bonding agent. Nano-particles may be included in the thermoplastic layer to improve the barrier properties of the structure. A desiccant material may also be included or added as a separate layer.

A rigid and brittle bright metal flake is formed of a central layer of a reflective material supported on both sides by dielectric layers. In a preferred embodiment, the metal layer is aluminum having a thickness of about 100 nm and the dielectrics are either silicon dioxide or magnesium fluoride, each having a thickness of about 100 nm. The result is a very thin three-layered metal flake about 300 nm thick that exhibits a uniaxial compressive strength of about 8 times a corresponding uniaxial tensile strength. As a result, the metal flake is then afforded the benefits of rigidity and brittle fracture during the manufacturing and applicational processes which ultimately provides favorable planar and specular reflectance characteristics in the visible wavelength range.

A glass laminate substrate for electronic substrates, such as flat panel displays, includes a transparent glass core bounded by transparent glass skin layers, wherein the coefficient of thermal expansion of the core is greater than the coefficient of thermal expansion of the skin layers thereby forming a residual compressive stress in the skin layers and a residual tensile stress in the core. The relative thickness of the skin layers can be selected to enhance the strength of the glass laminate substrate while maintaining a sufficiently low residual tensile stress in the core to allow scribing and separating of the substrate to size. Interlayers can be located between the core and the skin layers, wherein the interlayers include a residual compressive stress, and produce a reduced residual tensile stress in the core.

Method of modifying the surface properties of a substrate by depositing a coating of hydrogenated amorphous silicon on the surface of the substrate and functionalizing the coated substrate by exposing the substrate to a binding reagent having at least one unsaturated hydrocarbon group under pressure and elevated temperature for an effective length of time. The hydrogenated amorphous silicon coating is deposited by exposing the substrate to silicon hydride gas under pressure and elevated temperature for an effective length of time.

A method for directly growing carbon nanotubes, and in particular single-walled carbon nanotubes on a flat substrate, such as a silicon wafer, and subsequently transferring the nanotubes onto the surface of a polymer film, or separately harvesting the carbon nanotubes from the flat substrate.

This invention provides low dust low density gypsum wallboard products having high total core void volumes, corresponding to low densities in the range of about 10 to 30 pcf. The wallboards have a set gypsum core formed between two substantially parallel cover sheets, the set gypsum core preferably having a total void volume from about 80% to about 92%, and made from a slurry including stucco, pregelatinized starch, and a naphthalenesulfonate dispersant. The combination of the pregelatinized starch and the naphthalenesulfonate dispersant also provides a glue-like effect in binding the set gypsum crystals together. The wallboard formulation, along with small air bubble voids (and water voids) provides dust control during cutting, sawing, routing, snapping, nailing or screwing down, or drilling of the gypsum-containing products. This invention also provides a method of making the low dust low density gypsum products including the introduction of soap foam in an amount sufficient to form a total void volume, including air voids, preferably from about 80% to about 92% in the set gypsum core, corresponding to a set gypsum core density from about 10 pcf to about 30 pcf. The wallboards produced by the method generate significantly less dust during working.

A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO₂ units, R³_nR⁴_pSiO_0.5 units and R³_qR⁴_rSiO_0.5 units wherein R³ is vinyl or allyl, R⁴ is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.

Structural cement panel for resisting transverse and shear loads equal to transverse and shear loads provided by plywood and oriented strain board, when fastened to framing for use in shear walls, flooring and roofing systems. The panels provide reduced thermal transmission compared to other structural cement panels. The panels employ one or more layers of a continuous phase resulting from curing an aqueous mixture of calcium sulfate alpha hemihydrate, hydraulic cement, coated expanded perlite particles filler, optional additional fillers, active pozzolan and lime. The coated perlite has a particle size of 1-500 microns, a median diameter of 20-150 microns, and an effective particle density (specific gravity) of less than 0.50 g/cc. The panels are reinforced with fibers, for example alkali-resistant glass fibers. The preferred panel contains no intentionally added entrained air. A method of improving fire resistance in a building is also disclosed.

A multi-layer process for producing structural cementitious panels, includes, (a.) providing a moving web; (b.) one of depositing a first layer of loose fibers upon the web and (c.) depositing a layer of settable slurry upon the web; (d.) depositing a second layer of loose fibers upon the slurry; (e.) embedding said second layer of fibers into the slurry; and (f.) repeating steps (c.) through (e.) until the desired number of layers of settable fiber-enhanced slurry in the panel is obtained. Also provided are a structural panel produced by the present process, an apparatus suitable for producing structural cementitious panels according to the present process, and a structural cementitious panel having multiple layers, each layer created by depositing a layer of settable slurry upon a moving web, depositing fibers upon the slurry and embedding the fibers into the slurry such that each layer is integrally formed with the adjacent layers.

A method of passivating the interior surface of a gas storage vessel to protect the surface against corrosion. The interior surface of the vessel is first dehydrated and then evacuated. A silicon hydride gas is introduced into the vessel. The vessel and silicon hydride gas contained therein are heated and pressurized to decompose the gase. A layer of silicon is deposited on the interior surface of the vessel. The duration of the silicon depositing step is controlled to prevent the formation of silicon dust in the vessel. The vessel is then purged with an inert gas to remove the silicon hydride gas. The vessel is cycled through the silicon depositing step until the entire interior surface of the vessel is covered with a layer of silicon. The vessel is then evacuated and cooled to room temperature.

A low friction top coat over a multilayer metal/ceramic bondcoat provides a conductive substrate, such as a rotary tool, with wear resistance and corrosion resistance. The top coat further provides low friction and anti-stickiness as well as high compressive stress. The high compressive stress provided by the top coat protects against degradation of the tool due to abrasion and torsional and cyclic fatigue. Substrate temperature is strictly controlled during the coating process to preserve the bulk properties of the substrate and the coating. The described coating process is particularly useful when applied to shape memory alloys.

Provided is a laminated body (1) comprising a substrate (2) to be ground and a support (5), where the substrate (2) is ground to a very small thickness and can then be separated from the support (5) without damaging the substrate (2). One embodiment of the present invention is a laminated body (1) comprising a substrate (2) to be ground, a joining layer (3) in contact with the substrate (2) to be ground, a photothermal conversion layer (4) comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (5). After grinding the substrate surface which is opposite that in contact with the joining layer (3), the laminated body (1) is irradiated through the light transmitting support (5) and the photothermal conversion layer (4) decomposes to separate the substrate (2) and the light transmitting support (5).