4750results about How to "Reduce yield" patented technology

A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting lines. A lower chip is then attached and connected to a substrate, which may be a test wafer, and an upper chip is attached and connected to the lower chip, the electrical connections being achieved through their respective connection vias. In addition to the connection vias, the chip stack package may include connection bumps formed between vertically adjacent chips and / or the lower chip and the substrate. The preferred substrate is a test wafer that allows the attached chips to be tested, and replaced if faulty, thereby ensuring that each layer of stacked chips includes only “known-good die” before the next layer of chips is attached thereby increasing the production rate and improving the yield.

A graphics system including a custom graphics and audio processor produces exciting 2D and 3D graphics and surround sound. The system includes a graphics and audio processor including a 3D graphics pipeline and an audio digital signal processor. The graphics pipeline renders and prepares images for display at least in part in response to polygon vertex attribute data and texel color data stored as a texture images in an associated memory. An efficient texturing pipeline arrangement achieves a relatively low chip-footprint by utilizing a single texture coordinate / data processing unit that interleaves the processing of logical direct and indirect texture coordinate data and a texture lookup data feedback path for “recirculating” indirect texture lookup data retrieved from a single texture retrieval unit back to the texture coordinate / data processing unit. Versatile indirect texture referencing is achieved by using the same texture coordinate / data processing unit to transform the recirculated texture lookup data into offsets that may be added to the texture coordinates of a direct texture lookup. A generalized indirect texture API function is provided that supports defining at least four indirect texture referencing operations and allows for selectively associating one of at least eight different texture images with each indirect texture defined. Retrieved indirect texture lookup data is processed as multi-bit binary data triplets of three, four, five, or eight bits. The data triplets are multiplied by a 3×2 texture coordinate offset matrix before being optionally combined with regular non-indirect coordinate data or coordinate data from a previous cycle / stage of processing. Values of the offset matrix elements are variable and may be dynamically defined for each cycle / stage using selected constants. Two additional variable matrix configurations are also defined containing element values obtained from current direct texture coordinates. Circuitry for optionally biasing and scaling retrieved texture data is also provided.

A circularly polarizing plate comprises a linearly polarizing membrane and a quarter wave plate. The quarter wave plate comprises an optically anisotropic layer A and an optically anisotropic layer B. The quarter wave plate has such an optical characteristic that a retardation value essentially is a quarter of a wavelength when the retardation value is measured at the wavelength of 450 nm, 550 nm and 650 nm. One of the optically anisotropic layers A and B is a layer made from liquid crystal molecules, and the other is a polymer film or a layer made from liquid crystal molecules.