26results about How to "Increased process reliability" patented technology

This invention discloses an apparatus and method for preparing composite thin films for solar cells. The apparatus includes a lower conveying mechanism, a middle coating mechanism, and an upper adsorption mechanism. A friction mechanism generates static electricity on the surface of a lifting slide to adsorb the thin film. A cutting blade cuts the film to be processed, which is then transferred to the lifting slide surface by a film suction cup. An internal electric cylinder pushes the film off and onto a conveyor belt for automatic unloading. The method includes: electrostatic preparation, lifting slide resetting, film cutting, film adsorption and transfer, film unloading and conveying, and end clamping preparation. This invention achieves automatic cutting, electrostatic adsorption, transfer and bonding, and continuous conveying of the thin film through an integrated design, improving the efficiency and positioning accuracy of thin film composite preparation, and is suitable for the automated production of solar cell materials.

The invention belongs to the technical field of piston shoe preparation, and particularly relates to a low-cost preparation method of a copper-steel composite bimetal piston shoe blank for a high-pressure plunger pump. According to the method, the characteristic that the melting point of copper alloy is lower than that of a steel base material is utilized, a steel material is machined into a sliding shoe base blank with a cavity, then a prefabricated copper alloy blank is loaded into an inner cavity of the steel base blank, and a layer of protective borax covers the inner cavity of the steel base blank; heating in an inert atmosphere protection resistance heating furnace or a reducing atmosphere protection resistance heating furnace to melt the copper alloy into a liquid state, preserving heat for a certain time in a high-temperature environment to infiltrate and diffuse the liquid-state copper alloy to the surface of the solid-state steel base, and then discharging and cooling to solidify the copper alloy in the cavity; and finally, a metallurgically bonded copper-steel bimetal composite sliding shoe blank is prepared.

This invention discloses an automatic planning method and system for spraying paths of 3D workpieces based on visual point clouds, specifically relating to the field of automatic spraying path planning technology. By constructing a spraying space coupling description set and a spraying deployment constraint index, the method achieves a quantitative characterization of the degree of restriction of spraying space in different surface areas. Combined with the safety margin of spraying distance and the adjustable range of spray gun posture, a physical accessibility assessment quantity for spraying is formed, which automatically divides the spraying area into a stable spraying area, a restricted spraying area, and a physically unsprayable area. Thus, in the path generation stage, differentiated strategies such as continuous spraying, segmented compensation, and path reconstruction are adopted for different areas, which significantly improves the coating coverage integrity, thickness consistency, and process reliability of complex 3D workpieces in the actual spraying process. It also enhances the system's adaptability to structural complexity and working condition changes in real coal mining machinery spraying sites and reduces the risk of manual repair and rework.

The invention provides a chip-to-wafer bonding structure with a chip supporting function and a preparation method of the chip-to-wafer bonding structure. According to the method, a polysilazane solution is adopted as a precursor, chip gaps are selectively filled through a spin-coating process, and then the polysilazane solution is converted into a silicon dioxide supporting structure. And the warping problem caused by high temperature and thick film deposition is avoided by utilizing the characteristics of high efficiency and normal-temperature treatment of the spin-coating process. The height of the supporting layer can be accurately controlled by controlling spin-coating parameters, formation of redundant film layers on the top of the chip is avoided, and the subsequent process is simplified. The formed silicon dioxide supporting structure is completely compatible with a standard semiconductor process, chip splitting in the thinning process can be effectively prevented, and the process reliability and economical efficiency are improved. The problems of wafer warping, low process efficiency, high cost and the like caused by filling silicon dioxide through chemical vapor deposition in the prior art are solved.

The present application relates to a kind of topological perception spray trajectory planning methods for large size multi-curvature spacecraft spraying, comprising obtaining spacecraft surface point cloud data and constructing undirected topological graph and constructing the high-dimensional fusion feature vector of each vertex;Spacecraft surface point cloud data is segmented into several spray topological regions based on graph convolutional neural network;Global gravity direction vector is introduced to construct joint optimization objective function on each spray topological region and solve, construct global geodesic distance scalar field to generate smooth spray curve, construct the local spray trajectory of each spray topological region;Global path planning is carried out to spray topological region, and the global optimal region traversal sequence is obtained, and then global spray trajectory is obtained.The present application is suitable for spacecraft complex curved surface heat protection coating spraying scene, effectively eliminates the process defects of large curvature transition zone, significantly improves the thickness uniformity, quality consistency and process reliability of special coating manufacturing of spaceflight.

The application provides a straight slot processing method based on double-C-axis cooperative motion of a lathe, and solves the problems of multiple clamping, low precision and dependence on special milling equipment in straight slot processing of large rotary components. A side milling head device is installed on a numerical control vertical lathe, a workpiece chuck rotation shaft is used as a first rotation shaft C1, and a milling head swing shaft is used as a second rotation shaft C2; a coordinate transformation relationship between a machine tool coordinate system and a workpiece coordinate system is established, a cooperative motion law of the C1 shaft and the C2 shaft is determined, a tool tip forms a linear motion track in a workpiece reference coordinate system; combined with rough processing layering and track planning of multiple finishing modifications, a numerical control program containing C1, C2 and feeding shaft linkage control is generated after post-processing. The application can complete high-precision processing of the straight slot in the large rotary component on the same equipment, reduces workpiece transfer and repeated clamping, reduces equipment cost, and is suitable for processing of the key groove or positioning groove of a magnetic yoke section of a pumped storage unit.

The application discloses a laser shock peening method based on partition iteration double constraint, and relates to the technical field of laser processing. The method comprises the following steps: dividing a to-be-processed surface area of a to-be-processed component into a plurality of subareas, and setting laser shock points in each subarea; performing partition iteration double constraint traversal shock; in each iteration, firstly randomly disturbing the macro processing sequence of all subareas, then selecting one point from the unshocked points of each subarea, arranging the selected points according to the disturbed subarea sequence to form a shock subsequence of the current iteration; repeating the iteration until all the points are traversed to form a first layer of shock strengthening layer; and continuously repeating the superposition until a preset shock layer number is reached. The application can significantly inhibit the anisotropy of residual stress and the edge effect, and realize uniform strengthening.

The invention relates to the technical field of medical equipment, in particular to a full-automatic waste medical needle treatment device which comprises a treatment body, a fixing assembly used for clamping an injector is arranged at the top of the treatment body, a lifting sliding table ascending and descending in the vertical direction is arranged in the treatment body, and a hot pressing assembly and a needle winding assembly are integrated on the lifting sliding table; the hot pressing assembly is used for heating, softening and flattening a needle head, the needle winding assembly is used for winding the flattened needle head into a cluster, and a disinfection part and a stripping part are arranged on the needle winding assembly; the device further comprises a control device which is used for driving the lifting sliding table to ascend and descend and coordinating the heating flattening action of the hot-pressing assembly, the winding action of the winding needle assembly, the disinfection action of the synchronous disinfection part and the separation action of the stripping part. A clamping fixing and lifting integrated hot pressing and winding structure is adopted, and the processes of heating softening, flattening shaping, winding clustering, disinfection and stripping are combined, so that non-contact treatment of waste needles, effective killing of pathogenic microorganisms and collection of medical waste are achieved.

The application discloses a kind of copper electrode laser curing system and method of TOPCon solar cell, the system includes mid-infrared laser generation module, beam shaping and energy management module, precision motion and positioning platform and synchronous control and monitoring module.The method used is: after coating copper paste on the back silver seed layer of TOPCon battery, laser beam is irradiated, by accurately controlling laser energy density and pulse width, energy is selectively resonant absorbed by copper paste organic matter, millisecond level rapid curing is realized, while ensuring that energy density is lower than the damage threshold of lower layer aluminum oxide / silicon nitride passivation film, so that the base temperature rise is lower than 200 DEG C.The application overcomes the defects of traditional thermal curing, such as low efficiency, high energy consumption and easy damage to passivation layer, and provides an efficient, reliable and non-damage battery performance industrialization solution for TOPCon battery low-cost "de-silverization".

The invention relates to the technical field of heat dissipation, in particular to a phase-change composite heat-conducting gasket with vertical corrugated channels and a preparation method of the phase-change composite heat-conducting gasket. The invention aims to solve the problems of high hardness, poor compression compliance and large interface contact thermal resistance of the existing vertical orientation carbon-based heat conduction material and improve the actual heat dissipation efficiency of the thermal interface material in a high-power electronic device. According to the main scheme, high-heat-conductivity graphene paper or graphite paper serves as a framework base material, a composite heat conduction core with vertically-arranged bent heat conduction channels inside is constructed, and a phase-change material skin layer is combined on the surface of the composite heat conduction core. Rigid compression of the material can be converted into geometric bending deformation by utilizing an internal vertically-oriented micro-ripple structure (the section can be sine waves, sawtooth waves, trapezoidal waves or asymmetric ripples and the like), so that the compression resilience and the stress buffering capacity of the material are effectively improved; and meanwhile, the interface contact thermal resistance is effectively reduced by virtue of the self-adaptive wetting characteristic of the phase change material layer on the surface at the working temperature.

The application relates to the sealing technical field of wind power generation equipment, and particularly discloses a sealing structure for a box transformer upper moving machine cabin, which comprises a sealing strip and a joint assembly, the sealing strip is internally provided with a hollow cavity, the inner side is fixedly sleeved with a first base strip and a second base strip, and both ends are provided with buckling seats; the joint assembly comprises a fixed shaft seat, a movable shaft cover, a fixed pin buckle and a rotating pin buckle, a sealing slip ring, a spring and a sliding pin are arranged between the movable shaft cover and the fixed shaft seat, and are used for realizing lifting locking and flexible buffering; the rotating pin buckle can be rotated by 90 degrees and connected with the box transformer; the structure is closed and compact, and the sealing is reliable; the sealing function and the connecting structure are highly integrated in the application structure; the application has good elastic adaptability, dynamic compensation capacity and rapid assembly performance, and is particularly suitable for high-altitude butt joint sealing scenes between a wind power machine cabin and a box transformer.

The application belongs to the technical field of semiconductor processing and manufacturing, and provides a preparation method of SOI material and SOI wafer, which comprises sequentially preparing an aluminum nitride layer, an aluminum oxide layer and a top layer of silicon on a first substrate to obtain a first bonding body; providing a support substrate provided with a buried oxygen layer as a second bonding body, and bonding the first bonding body and the second bonding body to obtain a bonding structure; and then sequentially removing the first substrate, the aluminum nitride layer and the aluminum oxide layer in the bonding structure to expose the top layer of silicon and obtain the SOI material. The ion implantation process is replaced and omitted by the combination of epitaxial growth, bonding and removal processes, so that the performance problems caused by the introduction of various defects can be avoided, the accurate control of the thickness of the top layer of silicon and the quality of the buried oxygen layer can be facilitated, the complexity of the process and the process cost can be reduced, and the application is particularly suitable for the batch production of 300mm and above large-size SOI wafers.

The present application belongs to the technical field of low-temperature non-ferrous metal extrusion forming, and particularly relates to a low-temperature non-ferrous metal extrusion direct forming machine, a forming method and a production line, which are convenient for extruding raw materials such as cutting materials, broken materials, corner materials, waste materials and broken materials into low-temperature non-ferrous metal finished products. First, the raw material variety is diversified. Second, most of the impurities on the surface of the raw material can be removed. Third, inert gas is introduced into the inner cavity of the extrusion cylinder, and the air in the inner cavity of the extrusion cylinder and the inner cavity of the forming die is discharged to prevent the metal from being oxidized. Fourth, the raw material is softened first and then extruded, and the pressure of each extrusion is reduced through multiple extrusions, thereby improving the processing reliability. Fifth, multi-stage feeding is realized, the technical problems of uneven feeding and insufficient feeding are solved, and the yield is increased. Sixth, the piston body extrudes the material to be formed in the extrusion direction L2, and the cutting edge of the scraper cuts off the softened raw material entering the material bin section from the discharge port of the feeding structure, thereby reducing the resistance received by the extrusion device. Seventh, the forming die is replaceable.

This invention discloses a modular, customizable motor system and its combination method, belonging to the field of motor system technology. It includes a power module, a functional module, and a control module. The power module includes a stator, a rotor, a pair of end caps, and a housing. The stator windings are fixedly connected inside the housing. The rotor passes through the central area of ​​the stator, and its two ends are rotatably connected to both ends inside the housing via bearings. The functional module includes a rear cover, several crown spring connectors, and an equal number of pin-type copper terminals. The control module is fixedly installed inside the rear cover and fixedly connected to several crown spring connectors. The pair of end caps are fixedly connected to both ends of the housing, with one end cap fixedly connected to the rear cover. The terminals of several pin-type copper terminals are fixedly connected to the end of the stator near the rear cover. The pin-type copper terminals are sequentially inserted into the crown spring connectors, achieving fast, reliable, and reversible electrical connections, solving the problems of poor soldering and difficult maintenance in traditional methods.

This invention relates to the field of metallographic specimen technology, and more particularly to a portable metallographic specimen mounting machine, comprising a housing, a mounting cylinder fixedly connected to the housing, a lower mold slidably connected inside the mounting cylinder, a detachably threaded cap connected to the mounting cylinder, a temperature control module and an exhaust module disposed on the mounting cylinder, an upper mold slidably connected to the mounting cylinder and sealed to the cap, a first driving member fixedly connected inside the cap, and an elastic pressing member fixedly connected to the telescopic end of the first driving member and slidably connected to the upper mold and sealed to the upper mold. This invention uses the elastic pressing member to press and fix the metallographic specimen throughout the mounting process, thereby ensuring the stability of the metallographic specimen during mounting, improving the positional accuracy and process reliability of the mounting, and simultaneously absorbing the force between the metallographic specimen and the pressing post, reducing the probability of specimen breakage and deformation, and ensuring the morphology of the metallographic specimen.

The application discloses a precision grinding method for a cutter assembly, the cutter assembly and application, and the cutter assembly has a precision ground cutter head, cutter square and cutter rod, and the precision grinding method comprises the following steps: welding the cutter head to the end of the cutter square which is processed by grinding to form an integrated cutter; coarsely grinding the cutter by fixing the cutter on a coarse grinding seat, determining the zero point of the cutter head, adjusting the first grinding wheel based on the cutter band parameters and the first grinding parameters and the zero point to coarsely grind the two sides and the end of the cutter head, and obtaining left and right cutter surfaces and a coarsely ground auxiliary surface; finely grinding the cutter by fixing the cutter on a fine grinding seat, determining the cutter reference surface, adjusting the second grinding wheel based on the second grinding parameters and the zero point to finely grind the two sides of the cutter head, and obtaining left and right cutter bands; and adjusting and positioning the finely ground cutter by performing a planar finishing treatment on the finely ground cutter and adjusting the cutter to be fixed on the cutter rod according to a preset rotation radius. The application can stably and efficiently prepare the cutter with high precision, excellent blade geometry and surface quality.

This application provides a wafer reflow soldering apparatus, relating to the field of chip packaging technology. The wafer reflow soldering apparatus includes: a frame; a top cover lifting device disposed inside the frame; a chamber device disposed inside the frame, the chamber device including a top cover assembly and a bottom cover assembly, the bottom cover assembly being connected to the frame, and the top cover assembly being connected to the top cover lifting device, allowing it to move vertically via the top cover lifting device and to detach from or engage with the bottom cover assembly to form a sealed chamber. The sealed chamber has multiple wafer processing positions and a conveyor capable of sequentially transporting wafers to the multiple wafer processing positions for progressive heating; and multiple soldering devices, each corresponding to one of the multiple wafer processing positions along the wafer transport path. This wafer reflow soldering apparatus improves the uniformity of soldering temperature while preventing wafer oxidation during soldering.

The utility model discloses a battery top cover, a battery and electric equipment. The battery top cover comprises a top cover assembly, a pole and a sealing ring, a pole through hole is formed in the top cover assembly, the top cover assembly is provided with a first surface and a second surface, the first surface and the second surface are oppositely arranged in the thickness direction of the top cover assembly, and at least part of the pole penetrates through the pole through hole. The sealing ring is arranged on the pole in a sleeving mode and located on the side, away from the first surface, of the second surface of the top cover assembly, the sealing ring comprises a sealing ring body and a plurality of first teeth, and the first teeth are sequentially arranged on the annular outer side surface of the sealing ring body in a protruding mode in the circumferential direction of the sealing ring body; the end, away from the sealing ring body, of each first tooth abuts against the top cover assembly, and the sealing ring body is arranged on the pole in a sleeving mode, so that the sealing ring is limited between the top cover assembly and the pole. According to the battery top cover, the sealing ring is not easy to deviate during assembly to cause edge landing, so that the process reliability is improved, and the risk of battery cell liquid leakage caused by damage in the subsequent process is reduced.

The utility model relates to a kind of temperature measurement transmission devices, comprising: flange, one side of flange is sealed side, the other side is non-sealed side, the sealed side of flange is equipped with containing groove, the side wall of containing groove has wavy recess structure;The non-sealed side of flange is equipped with multiple wire holes that communicate containing groove;Epoxy resin casting, epoxy resin casting is set in containing groove and wire hole;And multiple thermocouple wires, thermocouple wire is respectively set in wire hole, and it is threaded through epoxy resin casting, by the containing groove of flange is set into wavy recess structure, on the one hand, it can increase the interface bonding length of flange and epoxy resin, improve the quality of interface bonding;On the other hand, it can form smooth transition, so that epoxy resin is not prone to stress concentration, to avoid epoxy resin and flange peeling, ensure that temperature measurement transmission device has better sealing, significantly reduce the interface air leakage problem.

A semiconductor device and its edge ring assembly are disclosed. The edge ring assembly includes: a focusing ring disposed on a focusing ring heater, the focusing ring surrounding the outer edge of an electrostatic chuck and spaced apart from the electrostatic chuck, and having a second gap region between the electrostatic chuck, the focusing ring heater, and the focusing ring; a thermally conductive layer disposed between the focusing ring and the focusing ring heater, including a plurality of thermally conductive portions distributed circumferentially along the focusing ring, with a first gap region between at least some adjacent thermally conductive portions, the first gap region exposing a portion of the focusing ring surface facing the focusing ring heater; and at least one first fluid channel, each first fluid channel being disposed within the exposed surface region of the focusing ring corresponding to a first gap region, one end of the first fluid channel near the inner edge of the focusing ring communicating with the second gap region, and the first fluid channel radially penetrating the focusing ring. This application can reduce the amount of polymer residue in the second gap region, improve process reliability, and increase product yield.

The utility model discloses a high-reliability square powerful permanent magnetic chuck, which comprises a placing platform placed on a processing machine tool, a square chuck is fixedly arranged on the upper surface of the placing platform, the square chuck is provided with a permanent magnet material, and the upper surface of the square chuck is provided with horizontally and longitudinally staggered separation grooves; two adjusting frames are installed on the upper portion of the containing platform and are of an n-shaped structure, connecting sliding blocks are fixedly installed at the bottom ends of the left side and the right side of each adjusting frame, and limiting mechanisms are arranged on the inner sides of the adjusting frames. According to the high-reliability square powerful permanent magnetic chuck, a novel structural design is adopted, when the adjusting frame is used for clamping a workpiece, the positioning rod at the upper end of the adjusting frame firstly makes contact with the workpiece, the positioning rod slides relative to the adjusting frame under the extrusion effect of the workpiece, and finally the top end of the positioning rod forms a shape attached to the surface of the workpiece; and meanwhile, under the limiting action of the elastic band, the better fixing effect on the workpiece is improved again, and the machining reliability is improved.

This invention provides a thin-film piezoelectric acoustic wave resonator, its manufacturing method, and a filter. The thin-film piezoelectric acoustic wave resonator includes: a first substrate; an upper electrode, a piezoelectric sheet, and a lower electrode stacked sequentially from top to bottom on the upper surface of the first substrate; the upper electrode, the piezoelectric sheet, and the lower electrode have overlapping regions in a direction perpendicular to the surface of the piezoelectric sheet; in the overlapping regions, a first gap is provided between the piezoelectric sheet and the upper electrode, and a second gap is provided between the piezoelectric sheet and the lower electrode; an isolation cavity surrounds the outer periphery of the piezoelectric sheet, and at least one connecting bridge is provided between the piezoelectric sheet and the substrate; the first gap and the second gap are connected through the isolation cavity.

The invention relates to a tunneling PN ohmic contact monocrystal diamond body doped device and a preparation method thereof. The tunneling PN ohmic contact monocrystal diamond body doped device comprises an intrinsic diamond substrate; the first diamond layer is located on the intrinsic diamond substrate; the second diamond layer is located on the first diamond layer; the third diamond layer is located on the second diamond layer; the source electrode and the drain electrode are respectively positioned on the third diamond layer in the source and drain electrode regions; the gate dielectric layer is located on the first diamond layer and located between the source electrode region and the drain electrode region; the gate electrode is located on the surface of the gate dielectric layer; the first diamond layer has a first doping type and a first doping concentration; the second diamond layer has a first doping type and a second doping concentration, and the second doping concentration is greater than the first doping concentration; the third diamond layer has a second doping type and a third doping concentration, and the third doping concentration is greater than the first doping concentration. According to the device, the carrier concentration and tunneling of the metal-semiconductor contact region can be remarkably improved, and the ohmic contact resistance is reduced.

This invention relates to a titanium alloy leading edge forming mold for composite fan blades of aero-engines. The mold is used for diffusion bonding forming of a first preform (4) and a second preform (5). It includes a lower mold (2) for assembling the second preform (5), a core mold (3) for placing between the first preform (4) and the second preform (5), and an upper mold (1) for pressing on top of the first preform (4). Each of the first preform (4), the second preform (5), and the core mold (3) has an ear piece (7) at its end. This ear piece (7) extends out of the mold when the upper mold (1) and the lower mold (2) are closed. The ear pieces (7) of the first preform (4), the second preform (5), and the core mold (3) are fixed by pins (6). Compared with the prior art, this invention has advantages such as convenient processing and high precision.

The application provides a method for preparing an ultrasonic transducer for transparent rigid piezoelectric material. The method first cuts from the piezoelectric layer side of the piezoelectric wafer with a transparent matching layer, leaving a certain thin layer without cutting through completely, to provide overall mechanical support and ensure that the array elements are arranged at a predetermined interval. Then, a transparent organic elastic material is injected into the array element gap, and the support after solidification further fixes the array element position to realize precise bonding of high-density array elements and flexible circuit electrodes. In the subsequent cutting through of the remaining thin layer, the array elements are effectively supported by the transparent elastic material and are not easily damaged, thereby significantly improving the process reliability and array element yield. The method effectively protects the brittle piezoelectric material and supports the manufacture of high-density, large-array flexible arrays. The obtained device realizes high flexibility with the aid of the transparent elastic material in the array element gap and the flexible circuit; and high sensitivity ultrasonic performance is obtained through the design of the double-layer matching layer and the backing.

This invention discloses a continuous stirring friction deposition additive manufacturing apparatus, belonging to the field of metal additive manufacturing technology. It includes: a housing; a spindle assembly with an axial channel for conveying additive rods and driven to rotate by a drive mechanism; and a continuous feeding mechanism located on the feed side of the spindle assembly, used to continuously feed the additive rods into the axial channel of the spindle assembly and apply an axial thrust to the additive rods, causing them to move towards the working end of the spindle assembly. It has the advantages of achieving continuous and stable rod supply, improving the automation level of feeding, reducing jamming risks, and enhancing deposition forming quality and process stability.