Double-chamber heat pipe capable of self-optimizing heat dissipation

Abstract

The invention provides a double-chamber heat pipe capable of self-optimizing heat dissipation. The heat pipe comprises a primary chamber, a secondary chamber and a two-way steam switch group, wherein the primary chamber is connected with the secondary chamber through the two-way steam switch group. The filling ratios and the steam pressure of the two chambers are adjusted through opening and closing of the two-way steam switch group between the two chambers. Steam switches have different switching thresholds through adjusting heat power of an electric heating device on the outer wall of the secondary chamber. Compared with a common heat pipe, the double-chamber heat pipe capable of self-optimizing heat dissipation has the advantages that the filling ratio of the heat pipe can be adjusted through the two-way steam switch group between the double chambers to be matched with the heat source power and the heat flux density, thereby achieving the optimal heat dissipation efficiency. The influence of a steam limit in the heat pipe on liquid backflow in a capillary filter element can be effectively inhibited. The heat pipe is simple to manufacture and good in process repeatability and reliability.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a dual-chamber heat pipe with self-optimized heat dissipation. Background technique [0002] Heat exchangers for high-efficiency heat dissipation of high-power semiconductor devices have always been one of the main applications of modern heat transfer technology. The improvement rate of reliability of semiconductor components, the increase rate of power capacity, and the miniaturization of structure all directly depend on the perfection of thermal control of the device itself. [0003] In recent years, with the rapid development of electronic technology and high-power semiconductor laser technology, various electronic devices and semiconductor laser chip packages have gradually developed in the direction of miniaturization and high power, which makes the heat flux generated inside the components increase rapidly, which greatly affects Device life and reliability. [0004]...

AI Technical Summary

Problems solved by technology

[0007] The range of optimal working efficiency of existing heat pipes is narrow, and it is easily affected by the liquid filling rate of heat pipes and the limit of saturated vapor pressure. When the heat source power or heat flux density is not within the range of optimal working efficiency of heat pipes, it will cause heat transfer of heat pipe heat exchange units The efficiency drops sharply, and in the fields with high heat sources such as semiconductor devices, it often cannot meet the heat dissipation requirements

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