Combined stiffness-variable thin film pMUTs and preparation method thereof
A combined and variable stiffness technology, applied in the direction of fluid using vibration, to achieve wide ultrasonic receiving bandwidth, enhance mutual coupling, and improve the effect of ultrasonic transmitting power
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[0056] The present invention is described in detail below in conjunction with accompanying drawing:
[0057] The invention proposes a combined thin-film pMUTs and a preparation method thereof, in order to improve the feasibility, reliability and consistency of unit structure and performance of the pMUTs chip preparation process while increasing the pMUTs transmission power and ultrasonic receiving bandwidth.
[0058] Such as figure 1 , figure 2 and image 3 As shown, a combined variable stiffness thin film pMUTs of the present invention is composed of a multilayer composite thin film 1 and a base structure 2 from top to bottom.
[0059] The multi-layer composite film 1 is composed of a piezoelectric driving layer structure 1-1 and a non-driving layer structure 1-2. The piezoelectric driving layer structure 1-1 is composed of a top electrode 1-1-1, a dielectric layer 1-1-2, and a bottom electrode 1-1-3 from top to bottom in the thickness direction.
[0060] The dielectric ...
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