384 results about "Packaging Tube" patented technology

A new transmutation assembly permits an efficient transmutation of a long-lived radioactive material (long-lived FP nuclides such as technetium-99 or iodine-129) which was produced in the nuclear reactor. Wire-type members of a long-lived radioactive material comprised of metals, alloys or compounds including long-lived FP nuclides are surrounded by a moderator material and installed in cladding tubes to form FP pins. The FP pins, and nothing else, are housed in a wrapper tube to form a transmutation assembly. The wire-type members can be replaced by thin ring-type members. The transmutation assemblies can be selectively and at least partly loaded into a core region, a blanket region or a shield region of a reactor core in a fast reactor. From a viewpoint of reducing the influence on the reactor core characteristics, it is optimal to load the transmutation assemblies into the blanket region.

The invention provides a structure and a method for packaging white-light LED devices. The structure mainly comprises an LED chip, a packaging tube shell, packaging silica gel and phosphor gel. The structure is characterized in that the LED chip is pasted in the packaging tube shell; the LED chip is covered and packaged in the packaging tube shell by the packaging silica gel and the phosphor gel; the packaging silica gel is in a lens shape; the packaging tube shell consists of a plurality of packaging single-bodies; the periphery of each packaging single-body is provided with a convex strip or a groove; and the packaging silica gel and a phosphor layer are made into a monolayer or multilayer packaging body through the structural shape of the packaging single-bodies. The invention has the advantages of utilizing the own surface tension of the silica gel and the phosphor layer, limiting the own flowing of the silica gel and the phosphor layer through the structure on the packaging tube shell, forming the packaging body of a lens and the phosphor layer of which the surface shape meets design requirements, reducing cost and improving product quality.

A row crop unit for use in an agricultural seeder includes a furrow opener for opening a furrow in the soil, a seed metering system for metering seed to be placed in the furrow, and a seed placement system for placing seeds in the furrow. The seed placement system and the seed metering system are in communication with each other and at least in part define a seed travel path associated with the furrow. A furrow closer covers the seed in the furrow with soil. A seed temperature conditioner is associated with the seed travel path for varying a temperature of seed traveling through the seed travel path. A temperature sensitive sensor is positioned to sense seed which has been deposited in the furrow between the furrow opener and the furrow closer. An optional packaging tube holds a temperature sensor or sensor array. A lens is mounted with the same tube. A larger diameter tube may be positioned around the sensor packaging tube. A positive air pressure/air flow may be introduced between the two tubes. This positive air-flow forms a positive pressure and/or air flow barrier to push dust away from the sensor lens or sensor surface.

The present invention refers to a polymeric composition prepared from a biodegradable polymer defined by poly-hydroxybutyrate (PHB) or copolymers thereof, and at least one other biodegradable polymer, such as polycaprolactone (PCL) and poly (lactic acid) (PLA), so as to alter its structure, and further at least one additive of the type of natural filler and natural fibers, and, optionally, nucleant, thermal stabilizer, processing aid, with the object of preparing an environmentally degradable material. According to the production process described herein, the composition resulting from the mixture of the modified biodegradable polymer and additives can be utilized in the manufacture of injected packages for food products, injected packages for cosmetics, tubes, technical pieces and several injected products.

A packing box for packing tube lamps is provided. The packing box includes a middle case. The middle case is for packing two or more tube lamps. The middle case includes a support section and two bent sections at two opposite sides of the support section. The two bent sections are bent towards the support section. The support section and the two bent sections are substantially aligned in a width direction of the tube lamps before the bent sections are bent. The support section and each of the two bent sections respectively form one or more receiving cavities each of which is for receiving one of the tube lamps and are for wrapping the two or more tube lamps after the bent sections are bent. The tube lamps are easily packed by the packing box, and the tube lamps in the packing box are not easily damaged.

The invention discloses a lipstick packing tube assembling machine. A lipstick packing tube comprises an outer cover, a bush in the outer cover and a median-bundle core, and the lipstick packing tube assembling machine comprises a rack, a positioning turnplate, a plurality of fixtures, an automatic bush mounting device, a glue applying device, a compacting device and a discharging device, wherein the positioning turnplate is arranged on the rack; an outer cover mounting working area, a bush mounting working area, a glue applying working area, a median-bundle core mounting working area, a compacting working area and a discharging working area surround the positioning turnplate in sequence; a plurality of fixtures are arranged on the positioning turnplate in a ring form; the automatic bush mounting device is arranged in the bush mounting working area and used for arranging bushes in outer covers on the fixtures; the glue applying device is arranged in the glue applying working area and is used for applying glue to the outer covers with the bushes; the compacting device is arranged in the compacting working area and used for compacting median-bundle cores in the outer covers; and the discharging device is arranged in the discharging working area and used for separating the assembled lipstick packing tubes from the fixtures.

The invention relates to a structure and a method for packaging application-oriented LED devices. The structure comprises an LED chip, a packaging tube shell, phosphor gel, packaging colloid and a lens, wherein the LED chip is pasted in the packaging tube shell; a chip electrode is connected with a circuit layer in the packaging tube shell; the LED chip is packaged by the packaging colloid or the phosphor gel; the lens is manufactured by use of a mold or a precision machining method; at least one surface selected from the light outlet surface and the light inlet surface of the lens is a free curved surface; the lens is manufactured by pouring the packaging colloid or by a self-flow forming method; the light outlet surface of the lens is a free curved surface; and the lens is a single lens, a plurality of lens combinations or a lens array. As the invention adopts the application-oriented free-curved-surface lens to package an LED module, the LED module can be directly applied to different lighting occasions, and no other secondary optical system is needed when an LED lamp is designed. Therefore, the invention has the advantages of improving the light-emitting efficiency and spot quality of the LED module, improving the efficiency of the LED lamp, reducing the volume of the LED lamp and providing use convenience for users.

The invention relates to a semi-automatic punching machine for a packaging tube, comprising a base, wherein steps are formed on the upper surface of the base, a workbench is arranged at the middle of the first step surface, a main guide rail is arranged on the lower part of the workbench, and punching mechanisms are symmetrically installed on the main guide rail and at the both ends of the workbench respectively; a bottom plate is installed on the second step surface of the base, a groove opening is formed at the middle of the bottom plate, an arranging frame is arranged at the groove opening, packaging tube limit mechanisms are arranged at the outer ends of the bottom of the arranging frame respectively, and a feeding mechanism is arranged on the lower part of the bottom plate; and a pressing mechanism is further arranged above the workbench. The semi-automatic punching machine reduces labour intensity, is high in production efficiency and reliable in working, and guarantees the product quality.

Provided is a cable-shaped alkali metal battery comprising: (a) a first electrode comprising an electrically conductive porous rod having pores and a first mixture of a first electrode active material and a first electrolyte, wherein the first mixture resides in the pores of the porous rod; (b) a porous separator wrapping around the first electrode; (c) a second electrode comprising an electrically conductive porous layer wrapping around or encasing the porous separator, wherein the conductive porous layer contains pores and a second mixture of a second electrode active material and a second electrolyte, and the second mixture resides in the pores of the porous layer; and (d) a protective casing or packing tube wrapping around or encasing the second electrode.

The invention discloses a high-sensitivity gas sensor based on a microchannel plate three-dimensional structure and a production method of the high-sensitivity gas sensor. The high-sensitivity gas sensor consists of a detection module and a heating module; the detection module is bonded with the heating module through an electrically-conductive sizing agent; the detection module and the heating module are respectively provided with two lead leading-out electrodes, i.e. a detection electrode and a heating electrode, the detection module and the heating module are packaged inside a packaging tube shell, and the packaging tube shell is provided with at least four electrodes; the detection module is sequentially formed by an upper electrode, a microchannel plate and a lower electrode from top to bottom; the heating module is sequentially formed by a heat insulation substrate, a heating resistance coil and an insulation film from bottom to top. The high-sensitivity gas sensor has the beneficial effects that the effective specific surface area of a gas-sensitivity film can be improved, so that the sensitivity of the gas sensor can be improved; the porous structure of the microchannel plate favors the successful passing of detected gas, so that the test sensitivity and reaction speed of a device can be improved.

The invention relates to the medical field of immunoassay, and in particular provides an AFP magnetic particle chemoluminescence immunoassay kit and a method for preparing the same. The kit comprises: 1) an AFP calibrator; 2) a magnetic particle solution enveloped by a fluorescein isothiocyanate (FITC) resisting monoclone antibody; 3) a mixed solution of a biotin-marked AFP monoclone antibody and an FITC-marked AFP monoclone antibody; 4) a horseradish peroxidase marked streptavidin; 5) a chemoluminescence substrate liquid; and 6) a reaction tube. Furthermore, the method for preparing the kit comprises the following steps: 1) preparing the calibrator by using an AFP pure product; 2) preparing the magnetic particle solution enveloped by the FITC antibody; 3) preparing the mixed solution of the biotin-marked AFP monoclone antibody and the FITC-marked AFP monoclone antibody; 4) marking the streptavidin with the horseradish peroxidase; 5) preparing the chemoluminescence substrate liquid; 6) packaging the calibrator, the magnetic particle solution, the mixed solution, the enzyme marked object, the chemoluminescence substrate liquid and the sub packaging tube; and 7) assembling the components into a finished product. The kit has the advantages of simplicity, fastness, flexibility, stability, and the like.

The invention discloses a packaging method of improving the antistatic capability of an integrated circuit chip. The method comprises the steps: producing a power cord loop and a ground cord loop on a packaging tube shell; connecting one or a plurality of capacitors and a resistor between the power cord loop and the ground cord loop; leading one or a plurality of positions of the integrated circuit chip, which are connected with a power cord inside the chip to the power cord loop; and leading one or a plurality of positions of the integrated circuit chip, which are connected with a ground cord inside the chip to the ground cord loop. The invention enables chips with poor electrostatic discharge (ESD) protection capability inside the integrated circuit chip to reach good ESD protection capability after packaging.

The invention relates to an icing sensor based on a surface acoustic wave oscillator. The icing sensor comprises a surface acoustic wave device and an oscillation circuit (11), and further comprises apackaging tube shell (6) and a water permeable film (7), wherein the exterior of the surface acoustic wave device is packaged by the packaging tube shell (6), the water permeable film (7) is arrangedat an opening of the packaging tube shell (6), a surface of the surface acoustic wave oscillator is covered with a SiO2 protective thin layer (2), the surface acoustic wave device outputs an electricsignal with the changed oscillation frequency to the oscillation circuit (11), and the oscillation circuit (11) detects abrupt change of the oscillation frequency of the electric signal and outputs the oscillation frequency to realize icing early warning and monitoring. The icing sensor is advantaged in that the icing sensor has high detection sensitivity and good temperature stability, and can timely warn freezing, so the surface acoustic wave technology is easy to implement.

The invention provides an electrode type electric field sensor packaging component comprising a packaging tube shell; an electric field sensor chip which is fixed in the packaging tube shell; a packaging cover which covers the opening of the tube shell so as to form a cavity to accommodate the electric field sensor chip; and a packaging electrode which is arranged at one side away from the cavity of the packaging cover, wherein the packaging electrode is divided into a head end, an intermediate segment and a tail end according to the near-to-distant relationship between the packaging electrode and the packaging cover. The invention also provides an application of the electrode type electric field sensor packaging component. With application of multiple designs of the packaging electrode, the spatial resolution of the electric field sensor can be enhanced, the sensitivity of the sensor can be enhanced and the environmental adaptability of the sensor can be enhanced.

The invention provides a wireless passive surface acoustic wave vibration sensor. The wireless passive surface acoustic wave vibration sensor includes an antenna, a matching circuit, a piezoelectric cantilever beam, an SAW device with a reflective delay line structure, a mass oscillator and a cantilever beam fixing pedestal, wherein the SAW device is deposited on the piezoelectric cantilever beam through a semiconductor technology; the mass oscillator and the cantilever beam fixing pedestal are arranged at the tail end of a free end of the cantilever beam; an interdigital energy transducer and two reflectors form the SAW device; buffer materials are respectively arranged at the locations, being opposite to a packaging tube base and a packaging tube cap, on the tail end of the free end of the piezoelectric cantilever beam; when the sensor senses vibration, the mass oscillator at the free end of the piezoelectric cantilever beam enables the piezoelectric cantilever beam to generate one displacement in the force applying direction and generate curved deformation under the effect of acceleration of vibration; and the change of strain on the surface of the piezoelectric cantilever beam causes change of the SAW velocity of propagation in the reflective delay line SAW device, so that time delay and phase of the reflective delay line SAW device are changed correspondingly; and then sensing of the vibration quantity can be realized through decoupling of the sensing information.

An improved method and apparatus for providing end seals on vertical stand up packages that prevents pleat formation and gusset variation. A clamping device is mounted below sealing jaws. A bottom end seal is made by the sealing jaws to form an open-ended tube. The open-ended tube is moved downward. The clamping device engages the tube to prevent twisting when product is placed into the tube. Product then enters an open-ended tube of flexible film packaging and the top seal is made.

The invention relates to a differential resonator type wireless and passive surface acoustic wave strain sensor, which comprises an antenna, a matching circuit, a packaging tube socket, a flexible packaging bottom sheet and a SAW sensing device, wherein the antenna is arranged on the matching circuit, the matching circuit is connected with the SAW sensing device via a signal lead wire, the SAW sensing device is packaged by means of the packaging tube socket and the flexible packaging bottom sheet, the SAW sensing device comprises a reference device and a perceiving device, the reference device is used for temperature compensation, and the perceiving device is used for strain detection. The principle of the sensor is that strain action is directly sensed by using the strain sensing device, resulting in variation of the corresponding resonance frequency, and the sensing of strain of an object to be measured can be realized through decoupling sensing information. By adopting the reference device and the perceiving device of two one-terminal-pair resonance type SAW devices, the differential resonator type wireless and passive surface acoustic wave strain sensor solves the problem of interference of environment temperature on strain measurement in a differential manner.

A tube sealing machine for a flexible package includes in turn a bagging mechanism arranged on the rack, an intubation mechanism, a transmission mechanism, a molding mechanism and a bag connecting mechanism. The invention has the characteristics that the transmission mechanism comprises a movable stand, a reciprocating motion mechanism and at least one lifting mechanism; the lifting mechanism is fixed on the movable stand, the end of which is arranged movably on the rack; the movable stand connects the rack through the reciprocating motion mechanism; the side of at least one movable stand parallel to the movement direction of the reciprocating motion mechanism is provided with at least one flexible package holder. The invention has the beneficial effects to the prior art of simple structure, easy use, high-yield result, effective space-saving and great production-cost reduction.

The invention discloses a quantum dot packaging tube clamping device, a backlight module and a liquid crystal display device. The quantum dot packaging tube clamping device comprises a first outer edge, a second outer edge and a plurality of separation connecting parts; the first outer edge and the second outer edge are formed in a parallel mode; a first clamping edge is perpendicularly formed at the first outer edge; a second clamping edge is perpendicularly formed at the second outer edge; the plurality of separation connecting parts are arranged in a parallel mode and connected with the first outer edge and the second outer edge; a preset distance is maintained between every two adjacent separation connecting parts to form a first window; every separation connecting part comprises a connection portion and a groove, wherein every connection portion is connected with the first outer edge and the second outer edge and every groove is concaved towards the direction of the clamping edges; the first clamping edge, the first outer edge, the separation connecting parts and the second outer edge and the second clamping edge form an accommodating space together, wherein the accommodating space is used for accommodating a quantum dot packaging tube. According to the quantum dot packaging tube clamping device, the backlight module and the liquid crystal display device, the assembly efficiency of the quantum dot packaging tube can be effectively improved and the yellowing of the quantum dot packaging tube clamping device after long-term use is avoided.