657results about How to "Reduce voltage drop" patented technology

An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate. An IC die having a first surface is mounted to the first surface of the substrate. The IC die has a plurality of I / O pads electrically connected to the plurality of contact pads on the first surface of the substrate. A heat sink assembly is coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The heat sink assembly can also provide an electrical path from the IC die to the first surface of the substrate. The heat sink assembly may have one or two heat sink elements to provide thermal and / or electrical connectivity between the IC die and the substrate.

An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate. An IC die having a first surface is mounted to the first surface of the substrate. The IC die has a plurality of I / O pads electrically connected to the plurality of contact pads on the first surface of the substrate. A heat sink assembly is coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The heat sink assembly can also provide an electrical path from the IC die to the first surface of the substrate. The heat sink assembly may have one or two heat sink elements to provide thermal and / or electrical connectivity between the IC die and the substrate.

A battery charger for an electronic device receives current limited power from an external power source, such as a Universal Serial Bus power interface. The battery charger can linearly regulate a charging current to an internal battery and limit the charging current so as not to demand current in excess of what the external power source can provide. A bi-directional pass element coupled between a system power terminal and the internal battery controls the charging current and effectively isolates the internal battery from a system load during charging of the battery while providing a low impedance path from the internal battery to the system load during discharging of the battery.

Methods and devices producing time varying magnetic field have therapeutic uses. The device contains a coil made of insulated wires, an energy storage device, an energy source and a switch. The coil is flexibly attached in a case. The device has at least one blower for cooling the coil. The methods and devices can be used in for example in physiotherapy, neuropsychiatric therapy, aesthetic therapy, urology or urogynecology.

The present invention provides a transmitter conforming to the EER method in a wide frequency band at high efficiency. For this purpose, the amplitude component of a modulated signal is input to the power supply terminal of a high-frequency power amplifier 130, the I and Q quadrature signals thereof are input to the high-frequency input terminal of the high-frequency power amplifier 130, and the original modulated signal is obtained from the output of the high-frequency power amplifier 130. A collector voltage is supplied from DC—DC converter group 615 having output voltages being different sequentially to an emitter follower 729 via a switch group 621. One of the outputs of the DC—DC converters 616 to 620 is selected depending on the level of the amplitude component as the collector voltage and supplied to the emitter follower, whereby the difference between the emitter voltage of he emitter follower 729 and the collector voltage of the emitter follower 729 is made smaller and the efficiency of the emitter follower 729 is raised; furthermore, the power supply voltage of the high-frequency power amplifier 130 is voltage-converted by the emitter follower 729, whereby operation in a wide frequency band is made possible.