According to the automatic packaging device for the
semiconductor carrier tape disc, the material tape conveying
assembly conveys packaging materials to the side face of the carrier tape disc, the
tape head clamping jaw clamps the packaging materials, the
rotating disc assembly drives the
tape head clamping jaw to rotate around the carrier tape disc in the circumferential direction, and the
tape head pressing wheel
assembly presses a tape head to make the tape head tightly attached to the carrier tape disc; the packaging material is pulled back by a certain distance through reverse transmission of the material belt conveying assembly, the belt
tail pressing wheel assembly stretches out, the packaging material is tightly attached to the circumference of the carrier tape disc, the material belt conveying assembly cuts off the packaging material, the pressing plate assembly is pressed downwards and tightly attached to the packaging material belt head portion of the carrier tape disc, and at the moment, the belt
head pressing wheel assembly is reset. The upper
rotating disc assembly and the lower
rotating disc assembly synchronously rotate to collect the
tail of the remaining packaging material into the tape carrying disc, the pressing plate assembly is reset, the lower rotating
disc assembly is kept immovable, the upper rotating
disc assembly rotates to the pressing plate assembly to be located above the
tail of the packaging material, the pressing plate assembly extends out to press the tail of the packaging material, and the tape tail pressing wheel assembly is reset; therefore,
automation of wrapping the carrier tape disc with the packaging material can be effectively achieved.