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5893results about How to "Reduce downtime" patented technology

Methods and apparatus for processing the surface of a microelectronic workpiece

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
Owner:APPLIED MATERIALS INC

Controlling device and method for abnormality prediction of semiconductor processing equipment

Disclosed in this invention is a controlling device for abnormality prediction of semiconductor processing equipment. The controlling device includes a multiplexer connecting a plurality of vibration sensors to a spectrum analyzer. Therein, the vibration sensors are non-destructively installed to a variable-frequency rotating mechanism inside the semiconductor processing equipment. The multiplexer includes an adapter and at least a modularized multi-channel connecting assembly plugged into the adapter where the number of the connected vibration sensors is less than the number of the signal connecting terminals of the multiplexer so that at least one terminal is unconnected with the vibration sensors. Additionally, a control signal wire connects the unconnected terminal to a corresponding controller of the variable-frequency rotating element. The vibration spectrum analyzer is configured to record and collect both vibration signals and control signals where these signals are transformed into time-domain waveforms to track the lifetime of the equipment, to predict the failure of the equipment, and to reduce equipment down time, parts waiting time, and equipment repair time of the semiconductor processing equipment.
Owner:POWERTECH TECHNOLOGY

Methods and apparatus for processing the surface of a microelectronic workpiece

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
Owner:SEMITOOL INC

Method and apparatus for extracting ions from an ion source for use in ion implantation

Thermal control is provided for an extraction electrode of an ion-beam producing system that prevents formation of deposits and unstable operation and enables use with ions produced from condensable vapors and with ion sources capable of cold and hot operation. Electrical heating of the extraction electrode is employed for extracting decaborane or octadecaborane ions. Active cooling during use with a hot ion source prevents electrode destruction, permitting the extraction electrode to be of heat-conductive and fluorine-resistant aluminum composition. The service lifetime of the system is enhanced by provisions for in-situ etch cleaning of the ion source and extraction electrode, using reactive halogen gases, and by having features that extend the service duration between cleanings, including accurate vapor flow control and accurate focusing of the ion beam optics. A remote plasma source delivers F or Cl ions to the de-energized ion source for the purpose of cleaning deposits in the ion source and the extraction electrode. These techniques enable long equipment uptime when running condensable feed gases such as sublimated vapors, and are particularly applicable for use with so-called cold ion sources and universal ion sources. Methods and apparatus are described which enable long equipment uptime when decaborane and octadecaborane are used as feed materials, as well as when vaporized elemental arsenic and phosphorus are used, and which serve to enhance beam stability during ion implantation.
Owner:SEMEQUIP

Aparatus for processing the surface of a microelectronic workpiece

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
Owner:APPLIED MATERIALS INC

Tunnel for conditioning of products, especially for sterilization of food in prepackaged containers

ActiveUS20090283517A1Reduce maintenanceIncreases useful treatment capacityDough treatmentDisinfectionControl systemClosed loop
Tunnel is provided for conditioning of food products, especially for sterilization of food in containers or vessels of the heat-sealed type, in which the conditioning unit has: 1) an active temperature and pressure control system provided in at least one magnetron supported heating stage, which provides for balancing of the pressure within the heat-sealed vessels or containers; 2) a conveyor which conveys the heat-sealed vessels or containers through the stages along the conditioning unit which contains mechanisms that move the conveyor outside of the conditioning tunnel, and 3) doors operating like check valves that separate the conditioning stages, but still provide for continuous linear feed of products through conditioning tunnel. In preferred embodiment, the conditioning tunnel in includes a plurality temperature sensors, such as linear pyrometers for measuring the temperature of for mapping the temperature of products within the tunnel Moreover, preferably the conveyor is adjustable to move forward and rearward, and the magnetrons, which preferably operate at approximately 915 Mhz and 2400 Mhz, are adjustable to provide a controllable movement and amplitude. A controller is connected to the temperature sensors, conveyor and magnetrons to cause the conveyor to move products forward or rearward, or cause the magnetrons to move the magnetic field relative to the food products to more thoroughly and evenly cook the food products. Movement of the magnetron electromagnetic field and/or conveyor is controlled by software which utilizes the temperature and/or density measurements in a closed loop process to ensure uniform heating of the products.
Owner:MACKAY JEFFREY H +3
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