43results about How to "Restraining the drop in productivity" patented technology

A data recording unit 60 for managing operating situations of a hydraulic excavator 1 comprises a RAM 67 for taking in and storing plural kinds of operational information regarding the hydraulic excavator 1 as operational data, and a CPU 65 for extracting top priority operational data from among the plural kinds of operational data stored in the RAM 67, and transmitting the extracted data to the supervising side via satellite communication. Top priority data among the plural kinds of operational data of the hydraulic excavator, which may bring the hydraulic excavator into rest, can be presented to a supervisor of the hydraulic excavator, etc.

Provided is a carburized-steel-component production method with which gas carburization properties of a steel component having a high Si content are improved, and with which a reduction in productivity can be inhibited. This production method is provided with a preliminary gas-carburization step, and a main gas-carburization step. In the preliminary gas-carburization step, a steel component having a chemical composition which includes, expressed in mass%, C, Si, Mn, and Cr, and which satisfies formula (1), namely (see description), is subjected to gas-carburization treatment for at least 10 minutes, but for less than 20 hours, at a carburization temperature (Tp) (in DEG C) satisfying formula (A), namely(see description), CP being substituted for the carbon potential during carburization in the preliminary gas-carburization step. In the main gas-carburization step, gas-carburization treatment is performed using a carburization time period (tr) (in minutes) and a carburization temperature (Tr) (in DEG C) which satisfy formula (B), namely (see description).

This application discloses an insulation-film etching system that etches an insulator film on a substrate by a species produced in plasma. While the substrate (9) is held by a substrate holder (2) provided in a process chamber (1), an etching gas is introduced into the chamber (1) by a gas inlet system (3). An insulating film on the surface of the substrate (9) is etched by the action of an active species and ions contained in a plasma formed by a plasma forming means (4). After completion of the etching, a control section (8) takes out the substrate (9) from the process chamber (1) by a transport robot (51) and evacuates the chamber (1) by an exhaust system. Then the section (8) removes films deposited on exposed surfaces in the chamber (1) by the action of a plasma formed by the plasma forming means (4) by introducing a cleaning gas by the gas inlet system (3). A cooling trap (12) provided at a level lower than the substrate holding surface of the substrate holder (2) is forcibly cooled and causes many films to deposit by collecting gas molecules which tend to deposit. The trap (12) is replaceable and the surface of the trap (12) has irregularity sections to prevent the peeling of deposited films. The surfaces of the irregularity sections are composed of an oxide or insulator.

An object of the present invention is to provide a laser welding method for lap welding of a plurality of metal plates including an aluminum alloy casting, in which generation of relatively large blowholes in a welding part is reduced while decrease in productivity is reduced. As a means for solving the problem, a laser welding method for lap welding, using a laser beam (LB), of a plurality of metal plates (10, 20) including an aluminum alloy cast plate (20) is provided, which includes: a melting path of scanning and irradiating circularly a superimposed part (5) of the aluminum alloy plate (20) and the aluminum alloy cast plate (20) with a first laser beam (LB1) to form a molten pool (7) of the molten aluminum alloy plate (10) and the molten aluminum alloy cast plate (20); and a stirringpath of scanning and irradiating circularly the molten pool (7) with a second laser beam (LB2) having a scanning speed (V2) faster than a scanning speed V1 of the first laser beam (LB1) to stir the molten pool (7).

Provided is a manufacturing apparatus for manufacturing a hat-shaped section component including a curved projection portion such that a to-become-top-plate portion is pressed by a punch in a state where a to-become-flange portion is sandwiched between a die and a holder. The manufacturing apparatus includes the punch having a first mold surface including a curved projection portion mold surface,the holder, and the die having a fourth mold surface facing the first mold surface. An opening is formed in a part, of the fourth mold surface, that corresponds to the curved projection portion mold surface. The manufacturing apparatus includes a pad provided in the die and having a fifth mold surface facing the curved projection portion mold surface, the pad being configured to be relatively movable upward against downward biasing force so that the fifth mold surface becomes flush with the fourth mold surface.

A coating processing device and a coating liquid collecting member. A technique is provided for suppressing a decrease in productivity while collecting and removing coating liquid scattered during the coating process when a substrate supplied with a high-viscosity coating liquid is rotated to perform coating processing. In a resist coating apparatus that rotates a wafer to apply a resist solution, the exhaust path provided along the circumferential direction of the cup is provided with a line-shaped coating that catches the coating caused by the rotation of the wafer. The coating liquid collecting member of the application liquid is provided with a solvent reservoir on the coating liquid collecting member. Therefore, when the back side solvent supply process is performed on the wafer, the solvent thrown off from the wafer falls to the coating liquid collecting member and accumulates in the solvent pool. In addition, by making the solvent pooled in the solvent pool, it is possible to dissolve and remove the solvent collected by the coating liquid trapping member during the resist coating process when the next wafer is subjected to the resist coating process. The linear coating liquid can suppress the reduction of productivity.

There is provided an electric energy storage device which has a connection structure with a high connection reliability and which can suppress any contact of an outer package body with a connection terminal with a simple structure. The electric energy storage device comprises a battery element 10 retained in an outer package body 20 having a metal layer 21b, a tabular internal lead 31 connected to the battery element 10, a tabular external lead 32, a connection terminal 33 electrically connecting the internal lead 31 with the external lead 32, an internal insulating member 41, and an external insulating member 43. Flanges 33T, 33B at both ends of the connection terminal 33 depress the external insulating member 43, the outer package body 20, and the internal insulating member 41 between the tabular external lead 32 and internal lead 31, and the external insulating member 43 and / or internal insulating member 41 is pressed in between a penetration shaft 33S of the connection terminal 33 and the metal layer 21b.

Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.

A substrate processing apparatus includes a vacuum chamber; a turntable rotatably provided in the vacuum chamber, on which a circular substrate is to be mounted, and provided with a circular concave portion at a front surface having a larger diameter than that of the substrate, and a circular substrate mounting portion provided in the concave portion having a diameter smaller than that of the concave portion and the substrate at a position higher than a bottom portion of the concave portion, the center of the substrate mounting portion being off center with respect to the center of the concave portion toward an outer peripheral portion side of the turntable; a process gas supplying unit which supplies a process gas to the substrate; and a vacuum evacuation mechanism which evacuates the vacuum chamber.

A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.

The present invention provides a treatment capable of suppressing a reduction in productivity and achieving cleaning of the resist liquid L using a single filter (52) when the resist liquid (L) is ejected from the ejection nozzle (7). Liquid supply device and treatment liquid supply method. A filter (52) and a pump (70) or pumps (111, 112) are provided on a supply line (51) through which the resist liquid (L) flows. Then, a part of the resist liquid (L) passing through the filter (52) is ejected from the nozzle (7), and the remaining resist liquid (L) is returned to the primary side of the filter (52), and the When the subsequent discharge operation is performed, the remaining resist liquid (L) is passed through the filter (52) again. In such an operation sequence, the return amount of the resist liquid (L) returned to the primary side of the filter (52) is set to be equal to the supply amount of the resist liquid (L) ejected from the ejection nozzle (7). the same or more than the supply.

The present invention provides an electronic component mounting apparatus capable of transporting as many electronic components as possible while avoiding interference between electronic components, and suppressing a decrease in productivity. An electronic component mounting apparatus includes: a mounting head unit having a plurality of mounting heads; a movement system that moves a suction nozzle of the mounting head; a component dimension data acquisition unit that acquires component dimension data; a mounting head dimension data acquisition unit that acquires Mounting head dimensional data; and a mounting head control unit that outputs a first control signal based on the component dimensional data and the mounting head dimensional data so that the first electronic component supported by the supporting surface of the electronic component supply device is carried out through the first mounting. After the operation of detaching the head from the support surface, an operation of detaching the second electronic component, which is supported by the support surface and has a larger external dimension than the first electronic component, from the support surface by the second mounting head is performed.