The invention provides a manufacturing apparatus and a manufacturing method. The method cuts off a QFN substrate in three segments along a plurality of cutting lines set in a latticed shape on a QFN substrate, and comprises the steps of: first, along cutting lines in the length direction of the QFN substrate, cutting the portion having similar thickness with the connecting rod of a lead frame to form a cutting groove; second, along cutting lines in the width direction of the QFN substrate, cutting off the lead frame and sealing resin together; and third, in the cutting groove along the length direction of the QFN substrate, cutting the portion having similar thickness with residual sealing resin. Through only cutting off partial sealing resin in the cutting groove, the method can finally reduce the processing load of processing a QFN substrate uniwafer into a QFN substrate product, and thereby prevent the QFN substrate product from deviating or dispersing from a preset position of a cutting clamp tool.