Treatment liquid supply device and treatment liquid supply method

A technology for supplying devices and processing liquids, applied to liquid injection devices, devices for coating liquids on surfaces, thin material processing, etc., can solve problems such as changes, large-scale liquid processing devices, etc., and achieve the effect of suppressing the reduction in productivity

Active Publication Date: 2018-11-13
TOKYO ELECTRON LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if a plurality of filters are provided, the liquid treatment device will be enlarged and a large change will be required

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Treatment liquid supply device and treatment liquid supply method
  • Treatment liquid supply device and treatment liquid supply method
  • Treatment liquid supply device and treatment liquid supply method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0078] like image 3 As shown, the liquid processing device 5 of the present invention includes: a processing liquid container 60, which constitutes a processing liquid supply source for storing a resist liquid L as a processing liquid; a discharge nozzle 7, which serves as a discharge part for A resist liquid (processing liquid) L is discharged (supplied) to a wafer as a substrate to be processed; a supply line 51 connects the processing liquid container 60 and the discharge nozzle 7; a filter (filter device) 52 , which is sandwiched on the supply line 51 for filtering the resist liquid L; a pump 70, which is sandwiched on the part of the supply line 51 located on the secondary side of the filter 52; liquid collection part) 53, which is sandwiched on the part of the supply line 51 that connects the secondary side of the filter 52 and the primary side of the pump 70; the return line 55, which constitutes the discharge line of the pump 70 side and the primary side of the filte...

no. 2 Embodiment approach

[0113] Next, according to Figure 14 ~ Figure 17 A second embodiment of the liquid processing apparatus of the present invention will be described. In addition, in 2nd Embodiment, about the same structure as 1st Embodiment, the same code|symbol is attached|subjected to the same part, and description is abbreviate|omitted.

[0114] In the liquid processing device 5 of the second embodiment, the second return line 55b and the on-off valve V14 in the first embodiment are omitted, and the return line 65 connects the discharge side of the pump 70 and the collection side. The first return line 65 a connecting the tank 53 and the portion connecting the collection tank 53 and the secondary side of the filter 52 in the second treatment liquid supply line 51 b are formed.

[0115] Regarding steps S1 and S2, the operation of the second embodiment is similar to the operation performed in the first embodiment. Figure 12 Step S1( Figure 15 Shown to the pump chamber 72 suction resist li...

no. 3 Embodiment approach

[0126] according to Figure 18 ~ Figure 21 A third embodiment of the liquid processing apparatus of the present invention will be described. In addition, in 3rd Embodiment, about the same structure as 1st Embodiment and 2nd Embodiment, the same code|symbol is attached|subjected to the same part, and description is abbreviate|omitted.

[0127] The return line 85 of the third embodiment includes a first main return line 85a and a second main return line 85b constituting the main return line, and a circuit that connects the secondary side of the filter 52 and the primary side of the filter 52. Secondary return line 85c. The first main return line 85a connects the discharge side of the pump 70 to the catch tank 53, and the second main return line 85b connects the catch tank 53 to the part of the filter 52 in the second treatment liquid supply line 51b. part of the primary side is connected. In this case, the second main return line 85 b is connected to a portion of the second p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a treatment capable of suppressing a reduction in productivity and achieving cleaning of the resist liquid L using a single filter (52) when the resist liquid (L) is ejected from the ejection nozzle (7). Liquid supply device and treatment liquid supply method. A filter (52) and a pump (70) or pumps (111, 112) are provided on a supply line (51) through which the resist liquid (L) flows. Then, a part of the resist liquid (L) passing through the filter (52) is ejected from the nozzle (7), and the remaining resist liquid (L) is returned to the primary side of the filter (52), and the When the subsequent discharge operation is performed, the remaining resist liquid (L) is passed through the filter (52) again. In such an operation sequence, the return amount of the resist liquid (L) returned to the primary side of the filter (52) is set to be equal to the supply amount of the resist liquid (L) ejected from the ejection nozzle (7). the same or more than the supply.

Description

technical field [0001] The present invention relates to a processing liquid supply device and a processing liquid supply method for supplying a processing liquid to the surface of a substrate to be processed such as a semiconductor wafer and a glass substrate for LCD, for example. Background technique [0002] Generally, in the photolithography technique for manufacturing semiconductor devices, a photoresist is applied on a semiconductor wafer, an FPD substrate, etc. Correspondingly, the exposed pattern is exposed and developed to form a circuit pattern on the resist film. [0003] In such a photolithography process, bubbles or particles (foreign matter) such as nitrogen gas may be mixed in processing liquids such as a resist solution and a developer solution supplied to a wafer for various reasons. When the processing liquid of fine particles is supplied to wafers, etc., coating unevenness and defects may occur. Therefore, a liquid processing apparatus for applying a proc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10B05C5/02H01L21/027
CPCB05B15/40B05B9/0403B05B13/00H01L21/67017F17C1/00Y10T137/0318Y10T137/794H01L21/0274
Inventor 高栁康治吉原孝介寺下裕一古庄智伸佐佐卓志
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap