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Electronic component installation device and electronic component installation method

An electronic component mounting and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of reduced productivity and reduced number of electronic component mounting devices, and achieve the effect of suppressing the decrease in productivity and shortening the operation time.

Active Publication Date: 2017-03-08
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the number of electronic components that can be transported in one transport operation of the mounting head unit from the electronic component supply device to the substrate decreases, resulting in a reduction in the productivity of the electronic component mounting device.

Method used

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  • Electronic component installation device and electronic component installation method
  • Electronic component installation device and electronic component installation method
  • Electronic component installation device and electronic component installation method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0085] The first embodiment will be described. figure 1 It is a schematic diagram which shows an example of the electronic component mounting apparatus 1 which concerns on this embodiment. figure 2 It is a perspective view schematically showing an example of the mounting head unit 100 included in the electronic component mounting apparatus 1 according to this embodiment. image 3 It is a side view which shows an example of the mounting head unit 100 which concerns on this embodiment.

[0086] The electronic component mounting apparatus 1 mounts the electronic component C on the board|substrate P. As shown in FIG. The electronic component mounting device 1 is also referred to as a surface mount device 1 or a mounter 1 . The electronic component C may be a lead type electronic component having leads (plug-in type electronic component), or may be a chip type electronic component not having leads (mounted type electronic component). The lead type electronic component is mounte...

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PUM

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Abstract

The invention provides an electronic component installation device which can avoid mutual interference between electronic components, can convey as many electronic components as possible and can restrain reduction of productivity. The electronic component installation device comprises an installation head unit, a motion system, a component dimension data acquisition part, an installation head dimension data acquisition part, and an installation head control part, wherein the installation head unit comprises multiple installation heads; the motion system makes suction nozzles of the installation heads move; the component dimension data acquisition part acquires component dimension data; the installation head dimension data acquisition part acquires installation head dimension data; and the installation head control part outputs a first control signal based on the component dimension data and the installation head dimension data, so a second electronic component which is supported by a supporting face and has appearance dimensions larger than appearance dimensions of a first electronic component can be separated from the supporting face by a second installation head after the first electronic component supported by the supporting face of an electronic component supply device is separated from the supporting face by a first installation head.

Description

technical field [0001] The present invention relates to an electronic component mounting device and an electronic component mounting method. Background technique [0002] The electronic component mounting apparatus mounts electronic components on a board using a head unit having a plurality of heads. A plurality of mounting heads are arranged in a predetermined direction (see Patent Documents 1 and 2). [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 10-322096 [0004] Patent Document 2: Japanese Patent Laid-Open No. 2000-165093 [0005] In order to improve the productivity of the electronic component mounting apparatus, it is effective to collectively hold a plurality of electronic components supplied from the electronic component supply apparatus by a plurality of mounting heads, transport them to a substrate, and mount them. However, depending on the external dimensions of the electronic components or the size of the mounting heads, if an attempt i...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0408H05K13/043H05K13/0478
Inventor 桥本骏己真田侑典樱井茉莉子野尻信明藤田高史
Owner JUKI CORP
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