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Coating processing device and coating liquid collecting member

A technology for processing devices and coating liquids, which is applied in the direction of surface coating liquid devices, spraying devices, coatings, etc., which can solve problems such as poor productivity, lower exhaust pressure, and easy scattering of coating liquids, and achieve suppression Productivity reduction, accumulation suppression effect

Active Publication Date: 2021-05-28
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is a problem that if such a linear coating liquid is clogged in the exhaust passage, the exhaust pressure will decrease, so it is necessary to periodically perform maintenance to remove the linear coating liquid.
Therefore, it is difficult to stably supply the liquid toward the coating liquid collecting member during wafer processing.
Therefore, there is a problem that, in addition to the process of processing the wafer, it is necessary to perform a process of supplying the back side rinse liquid toward the coating liquid collecting member to clean the coating liquid collecting member, and the productivity deteriorates.
However, the linear coating liquid tends to scatter, and there is a possibility that the coating liquid captured by the exhaust gas cannot be sufficiently suppressed.
In addition, it is necessary to continuously supply the solvent during the resist coating process, so the amount of chemical solution used may increase

Method used

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  • Coating processing device and coating liquid collecting member
  • Coating processing device and coating liquid collecting member
  • Coating processing device and coating liquid collecting member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0077] In order to verify the suppression of fluctuations in exhaust pressure due to the installation of coating liquid trapping members, use figure 1 In the resist coating apparatus shown, the set exhaust pressure of the cup body 2 set by the opening degree of the regulating valve provided to the exhaust duct 8 is set to 50 Pa, and the exhaust pressure shown in the embodiment is followed. In the method, 100 wafers W are coated with a resist solution, and the inside of the cup body 2 (closer to the coating liquid collection member 6) when 0, 25, 50, 75, and 100 wafers W are processed The exhaust pressure at the position on the downstream side) was measured. In addition, as a comparative example, processing was performed in the same manner as in the examples except that the coating liquid collecting member 6 was not provided.

[0078] Figure 13 This result is shown in a characteristic diagram in which the number of processed wafers W is shown on the horizontal axis and the ...

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Abstract

A coating processing device and a coating liquid collecting member. A technique is provided for suppressing a decrease in productivity while collecting and removing coating liquid scattered during the coating process when a substrate supplied with a high-viscosity coating liquid is rotated to perform coating processing. In a resist coating apparatus that rotates a wafer to apply a resist solution, the exhaust path provided along the circumferential direction of the cup is provided with a line-shaped coating that catches the coating caused by the rotation of the wafer. The coating liquid collecting member of the application liquid is provided with a solvent reservoir on the coating liquid collecting member. Therefore, when the back side solvent supply process is performed on the wafer, the solvent thrown off from the wafer falls to the coating liquid collecting member and accumulates in the solvent pool. In addition, by making the solvent pooled in the solvent pool, it is possible to dissolve and remove the solvent collected by the coating liquid trapping member during the resist coating process when the next wafer is subjected to the resist coating process. The linear coating liquid can suppress the reduction of productivity.

Description

technical field [0001] The present invention relates to a coating processing device and a coating liquid collecting member for collecting and removing coating liquid scattered from a substrate when the substrate is rotated to apply the coating liquid. Background technique [0002] There is known an apparatus for performing spin coating in which various coating liquids such as resist are supplied to the surface of a semiconductor wafer (hereinafter referred to as "wafer") in a photoresist process which is one of semiconductor manufacturing processes, The wafer is rotated to apply the coating liquid to the entire surface of the wafer. As such a coating processing device, a cup body is provided to surround the wafer held on the spin chuck to catch the coating liquid scattered from the wafer, and an annular cup body is provided along the circumferential direction of the cup body. The exhaust path exhausts the atmosphere around the wafer through the exhaust path. [0003] In re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/10B05C13/02H01L21/027
CPCB05C5/02B05C11/10B05C11/1039B05C13/02H01L21/027H01L21/67017H01L21/67051H01L21/6715H01L21/68764H01L21/67023B05B14/30H01L21/67393B05C11/02H10K71/12
Inventor 上村良一
Owner TOKYO ELECTRON LTD
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