397results about How to "Improve insulation reliability" patented technology

An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved.

A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently provided for each of the processor cores, respectively. Accordingly, even when the electric potentials of the processor cores instantaneously drop, an instantaneous drop of the electric potential can be suppressed by action of the layered capacitors corresponding to the processor cores, respectively. In addition, even when the voltage of one of the processor cores varies, the variation in the voltage does not affect the other processor core, and thus malfunctioning does not occur.

The present invention provides adhesiveless copper clad laminates, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability, and provides a method for manufacturing such adhesiveless copper clad laminates. In adhesiveless copper clad laminates according to the present invention provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.

This invention provides a plastic sealant for AC permanent magnetic submersible motor, its sealing process and application. The plastic sealant is composed of: epoxy resin, diluent, curing agent, and silicon micropowder. The process comprises: (1) preparing the plastic sealant; (2) placing the motor stator in the stator sealing mold, locating, and placing the rotor in the rotor sealing mold; (3) sealing; (4) curing. This invention can be used for sealing AC permanent magnetic submersible motor, permanent magnetic wind power generator, electrical appliance, capacitor, transformer and inducer. This invention can largely shorten the sealing time, and can improve the sealing efficiency of diving motor. The plastic sealant has such advantages as low viscosity, smooth pouring, simple process, high product smoothness, good heat conductivity, good insulation, good waterproof property, no pollution during production and usage, and no toxicity to human bodies, thus is suitable for mass production.

A semiconductor device comprises a semiconductor substrate having an through hole, a first insulation resin layer formed on an inner surface of the through hole, a second insulation resin layer formed on at least one of front and rear surfaces of the semiconductor substrate, and a first conductor layer formed in the through hole to connect at least both front and rear surfaces of the semiconductor substrate and insulated from the inner surface of the through hole with the first insulation resin layer. A second conductor layer (wiring pattern) which is electrically connected to the first conductor layer in the through hole is further provided on the second insulation resin layer. The conductor layer formed in the through hole and constituting a connecting plug has a high insulation reliability. Therefore, a semiconductor device suitable for a multi-chip package and the like can be obtained. Further, since the forming ability of the conductor layer connecting the front and rear surfaces and the insulation layer is high, the manufacturing cost can be reduced.

A resin composition containing an epoxy resin (B) and a cyanate ester resin (A) shown in formula (1) as a basic component, wherein R represents a hydrogen atom or a methyl group, and n is an integer of 1 to 50, The premise is that the cyanate resin (A) may be a mixture of compounds of formula (1) having different values ​​of n, and prepregs and laminates using the resin composition.

A laminated common-mode choke coil offering higher insulation reliability has a glass ceramic layer, two spiral internal conductors facing each other and sandwiching the glass ceramic layer in between, and insulation layers sandwiching the two internal conductors, wherein the glass ceramic layer contains segregated Al regions and the maximum dimension t₁ of each segregated Al region in the glass ceramic layer, in the layer-thickness direction, is no more than 80% of the distance t₀ between the two internal conductors.

Disclosed is an interlayer insulating layer for printed wiring boards which is formed on a base and composed of a curing resin wherein scale-like particles are dispersed. Also disclosed is a printed wiring board which is excellently improved in heat cycle resistance and mounting reliability without lowering heat resistance, electrical insulation, heat dissipation, connection reliability or chemical stability. Further disclosed is a method for manufacturing a printed wiring board which enables to transfer a wiring pattern or a via hole to the interlayer insulating layer easily and accurately by an imprinting method wherein a mold having a projected portion corresponding to the wiring pattern is used. The method does not require an optical transfer method or a complicated etching for forming the wiring pattern or via hole. With this method, a printed wiring board having a very fine wiring pattern which is excellent in insulation reliability and interlayer connection can be easily mass-produced at low cost.

The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device, inverter module, or the like and provides an insulation circuit board in which electric field concentration at the end sections of a wiring pattern is reduced, partial discharging is suppressed, and a reliability is high. According to the invention, there is provided an insulation circuit board having: a metal base substrate; and wiring patterns which are formed onto at least one of the surfaces of the metal base substrate through an insulation layer, characterized in that between two adjacent wiring patterns in which an electric potential difference exists among the wiring patterns, at least one or more wiring patterns or conductors which are in contact with the insulation layer and have an electric potential in a range of the electric potential difference between the adjacent wiring patterns are arranged. According to the invention, the electric field concentration at the end sections of the wiring pattern to which a high voltage is applied is reduced and partial-discharge-resistant characteristics are improved.

The present invention relates to a vacuum switch and a vacuum switchgear. The object of the invention is to provides a vacuum switch covered by solid insulation resin with high insulation performance. The vacuum switch comprises a fixed electrode, a movable electrode facing the fixed electrode, an insulating cylinder, end plates covering both axial ends of the insulating cylinder, a vacuum chamber internally accommodating the fixed electrode and the movable electrode, and a solid isolation resin molded on the outside of the vacuum chamber, characterized in that, a first coil springs, each of which is disposed around the outer circumference of one end plate while touching the end plate and an end face of the insulating cylinder, and a second coil springs, each of which is united to one of the first springs and disposed around the outer circumference of the insulating cylinder so as to cover the angular part of the end face of the insulating cylinder, and the end plates, the end faces of the insulating cylinder, and the first and second coil springs are electrically connected.

The invention provides a modified formula of an environment-friendly gas insulating medium. The modified formula is characterized by comprising an environment-friendly dielectric, a buffer gas and oxygen, wherein the environment-friendly dielectric accounts for 4% to 10% by volume, the buffer gas accounts for 80% to 94% by volume, and the oxygen accounts for 2%to 10% by volume. The environment-friendly dielectric is any one of C4F7N, C5F10O, and C6F12O. The buffer gas is either N2 or CO2. A mixed gas configured according to the modified formula of the environmentally-friendly gas insulating medium of the invention, when used in an electrical device, such as a gas-insulated combined device, using an insulating gas as an insulating medium, has a higher dielectric strength than a unmodified environmentally-friendly dielectric mixed gas. Moreover, the modified environment-friendly dielectric mixed gas can reduce the precipitation of carbon particles and enhance the insulation reliability of the environment-friendly dielectric mixed gas.

A method for manufacturing a build-up substrate, the build-up substrate comprising an insulating layer and a wiring pattern layer stacked over a circuit substrate, said method comprising the steps of: (i) applying a photoactive metal oxide precursor material to one or both sides of the circuit substrate with a wiring pattern, and drying the applied photoactive metal oxide precursor material to form an insulating film; (ii) forming an opening for a via hole in the insulating film by exposure and development of the insulating film; (iii) applying a heat treatment to the insulating film to convert the insulating film into a metal oxide film, thereby forming a build-up insulating layer of the metal oxide film; and (iv) plating the build-up insulating layer to form via holes in the openings, forming a metal layer on the build-up insulating layer, and etching the metal layer to form a build-up wiring pattern; and (v) repeating the steps from (i) to (iv) at least one time.

The invention discloses adhesive and a preparation method thereof as well as a preparation technology of a halogen-free aluminium base copper-clad plate based on the adhesive. The adhesive comprises an inorganic filler, KH560 and propylene glycol monomethyl ether, wherein the weight of the KH560 accounts for 0.5%-1% of the total weight of the inorganic filler, and the KH560 and the propylene glycol monomethyl ether are mixed according to a mass ratio being 1: 1; and the inorganic filler is one or combination of several of aluminium oxide, aluminium nitride and boron nitride which are different in grain diameters and are spherical or irregular. The preparation method and the preparation technology have the advantages that the interfacial problem between expoxy resin and the inorganic filler is solved by pretreating the filler, so that the addition rate of the filler in an adhesive system is increased, the heat conductivity of an insulating layer is also obviously improved, and a technology of using silk-screen printing for coating an aluminium plate solves the problem that a thick copper foil aluminium substrate obtained by using a conventional technology is difficult to glue.

A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.

The present invention provides a polyurethane resin composition having high adhesiveness to various plastic films and metals, high moist heat resistance that can even accommodate soldering after humidification, and excellent flame retardancy without using any halogen or antimony, and an adhesive composition, laminate, and printed wiring board that use the polyurethane composition. A polyurethane resin composition containing a polyurethane resin (A) that satisfies (1)-(3) and an epoxy resin (B). (1) Includes a polyester polyol containing a phosphorus compound residue represented by general formula (1) or general formula (2) as a structural component; (2) an acid value (unit: Eq/106 g) of from 50 to 1000; (3) a urethane group concentration (unit: Eq/106 g) of from 100 to 600 (R1 and R2 are each independently a hydrogen atom or hydrocarbon group, R3 and R4 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group, and l and m are integers of 0 to 4.) (R5 is a hydrogen atom or hydrocarbon group, and R6 and R7 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group.)

Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11 provided on the substrate 10, comprising a metal layer 110 and a resin layer 120 having a resin component and a filler, in which the metal layer is aggregated on each of terminals to form the conductive portions on the plurality of terminals by bringing the conductive connecting material into contact with the plurality of terminals and heating the conductive connecting material.

A process for producing a metal film-coated material, the process including: (a1) forming, on a substrate, a polymer layer formed from a polymer which has a functional group capable of interacting with a plating catalyst or a precursor thereof, and is directly chemically bonded to the substrate; (a2) providing a plating catalyst or a precursor thereof to the polymer layer; and (a3) performing plating with respect to the plating catalyst or a precursor thereof. The polymer layer satisfies all of the following requirements (1) to (4): (1) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 50% is 0.01 to 10% by mass; (2) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 95% is 0.05 to 20% by mass; (3) the water absorption coefficient of the polymer layer as measured after 1 hour of immersion in boiling water at 100° C. is 0.1 to 30% by mass; and (4) the surface contact angle of the polymer layer as measured after dropping 5 μL of distilled water thereonto and leaving to stand for 15 seconds in an environment of temperature of 25° C. and relative humidity of 50% is 50 to 150 degrees.

This invention refers to a fire resistance bond composite and a covering layer film using the same. The fire resistance bond composite without halogen atoms and phosphorus atoms is provided. The composite contains: (A) 100 parts by weight of an epoxide resin without halogen, wherein if the number of the carbon atoms in the aliphatic radical of epoxide resin is a, and the number of carbon atoms in the aromatic radical of the epoxide resin is b, then b/a is not smaller than 2.0, (B) 15 to 70 parts by weight of aromatics rubber with active functional group; (C) 1 to 20 parts by weight of firming agent and (D) 10 to 70 parts by weight of inorganic filling material. This composite has excellent fire resistance, thermal stability and anti-transference property, and a covering layer film using the composite is further provided.

An object of the present invention is to provide an ignition coil which has a structure to make it possible to connect the ignition coil to a spark plug directly and in which an installation space need not be changed largely when the ignition coil is mounted in a cylinder head, and an internal combustion engine ignition system having the ignition coil.

In the present invention, a protection metal pipe (31) of an ignition coil (9) is formed so that a rear end side portion of a spark plug (11) in the rear of a rear end surface (23b) of a collar portion (23) in a metal shell (19) can be received in the inside of the protection metal pipe (31) from a front end (31b). The ignition coil (9) has a structure in which the ignition coil (9) is directly connected to the spark plug (11). The protection metal pipe (31) of the ignition coil (9) is formed to serve also as a plughole pipe, so that the outer diameter of the protection metal pipe (31) can be enlarged up to the outer diameter of a conventional plughole pipe. As a result, a space for installing a coil body portion (37) can be secured largely in the inside of the protection metal pipe (31), so that the installation space need not be changed largely when the ignition coil is mounted in a cylinder head.