Resin composite and prepreg and laminate materials used thereof

A technology of resin composition and laminated materials, which is applied in the direction of synthetic resin layered products, layered products, chemical instruments and methods, etc., can solve the problems of insufficient performance improvement, and achieve high industrial utility, good curability, and high resistance flammability effect

Active Publication Date: 2006-07-19
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned prepolymers have improved curability, the improvement in performance is still insufficient

Method used

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  • Resin composite and prepreg and laminate materials used thereof
  • Resin composite and prepreg and laminate materials used thereof
  • Resin composite and prepreg and laminate materials used thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0057] (Synthesis example 1) Synthesis of α-naphthol aralkyl cyanate ester resin

[0058]

[0059] n=1 to 5 mixture

[0060] 0.47 mol (calculated based on OH group) α-naphthol aralkyl resin (SN475L, OH group equivalent: 216g / eq.) represented by the above formula (3), manufactured by Nippon Steel Chemical Co., Ltd. Provided) Dissolve in 500 ml of chloroform, add 0.7 mole of triethylamine and mix with the resulting solution. To the mixture was added dropwise a solution of 0.93 moles of cyanogen chloride in 300 g of chloroform at -10°C over 1.5 hours. The resulting mixture was stirred for 30 minutes. Then, a mixed solution of 0.1 mole of triethylamine and 30 g of chloroform was added dropwise, and the resulting mixture was stirred for 30 minutes to complete the reaction. The generated triethylamine hydrochloride is separated by filtration. The filtrate thus obtained was washed with 500 ml of 0.1N hydrochloric acid, and then repeatedly washed with 500 ml of water 4 times. After dryi...

Embodiment 1

[0064] 70 parts by weight of α-naphthol aralkyl type cyanate resin obtained in Synthesis Example 1 and 30 parts by weight of bisphenol A type epoxy resin (Epikote 1001, provided by Japan Epoxy Resins Co., Ltd.) were dissolved in Methyl ethyl ketone, and 0.04 parts by weight of zinc octoate were mixed with the resulting solution to obtain a varnish. The varnish was diluted with methyl ethyl ketone solvent, the diluted varnish was immersed in E glass cloth with a thickness of 0.1 mm, and the immersed varnish was heated and dried at 160°C for 4 minutes to obtain a resin content of 41% by weight Of prepreg. Stack the four prepregs and place 18 micron thick electrolytic copper foils on the upper and lower surfaces of the stacked prepregs, with a copper foil on the upper surface and a copper foil on the lower surface, and the resulting Components at 30kgf / cm 2 It was pressed for 120 minutes at a temperature of 220° C. under a pressure of 4 to obtain a copper-clad laminate with a thickne...

Embodiment 2

[0066] 30 parts by weight of the α-naphthol aralkyl type cyanate resin obtained in Synthesis Example 1 and 45 parts by weight of brominated phenol novolac type epoxy resin (BREN-S, provided by Nippon Kayaku Co., Ltd) And 25 parts by weight of cresol novolac type epoxy resin (ESCN-220F, provided by Sumitomo Chemical Co. Ltd.) were dissolved in methyl ethyl ketone, and 0.04 parts by weight of zinc octoate was mixed with the resulting solution to obtain a varnish. Then, except for using the above varnish, a prepreg with a resin content of 43% by weight was obtained in the same manner as in Example 1. The subsequent procedures were performed in the same manner as in Example 1 to obtain a copper-clad laminate with a thickness of 0.4 mm. Table 1 shows the measurement results of the physical properties of the copper clad laminate material thus prepared.

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Abstract

A resin composition containing an epoxy resin (B) and a cyanate ester resin (A) shown in formula (1) as a basic component, wherein R represents a hydrogen atom or a methyl group, and n is an integer of 1 to 50, The premise is that the cyanate resin (A) may be a mixture of compounds of formula (1) having different values ​​of n, and prepregs and laminates using the resin composition.

Description

Technical field [0001] The present invention relates to a resin composition suitable for a printed wiring board material on which a circuit is to be formed, and also relates to a prepreg and a laminate material using the resin composition. Background technique [0002] Printed wiring boards are widely used in electronic equipment, communication devices, and personal computers, and high-density wiring and high integration are increasingly being used in printed wiring boards. According to the above circumstances, metal-foil-clad laminates with excellent properties such as heat resistance, low water absorption, heat resistance after moisture absorption, and insulation reliability are required as metal-foil-clad laminates used in printed wiring boards Laminate. Traditionally, FR-4 type laminates are widely used, in which dicyandiamide cured epoxy resin is used as laminates for printed circuit boards. However, this method has limitations in terms of high heat resistance requirements. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/00C08K3/00B32B27/04
Inventor 十龟政伸福冈弘直菅野裕一片桐诚之大野大典上野雅义
Owner MITSUBISHI GAS CHEM CO INC
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