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Curable orgnopolysiloxane composition and semiconductor device

A polysiloxane and organic-based technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as insufficient adhesion, easy adhesion of cured products to dirt, and decreased light transmittance. , to achieve the effect of excellent reliability and excellent curability

Active Publication Date: 2009-08-12
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, cured products obtained by curing these curable organopolysiloxane compositions have insufficient adhesion to substrates, and the surfaces of cured products are sticky to easily bind dirt and dirt, resulting in decreased light transmittance. In addition, their Low hardness, which makes them prone to scratches

Method used

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  • Curable orgnopolysiloxane composition and semiconductor device
  • Curable orgnopolysiloxane composition and semiconductor device
  • Curable orgnopolysiloxane composition and semiconductor device

Examples

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Embodiment

[0100] The curable organopolysiloxane composition and semiconductor device of the present invention will now be described in detail using practical examples and comparative examples. It should be noted that the term "viscosity" used in Practical Examples and Comparative Examples refers to a value measured at 25°C. The properties of the curable organopolysiloxane composition and its cured product were measured in the following manner.

[0101] [Mass average molecular weight of organopolysiloxane]

[0102] A toluene solution was prepared using the organopolysiloxane and the mass average molecular weight was determined based on standard polystyrene using gel permeation chromatography in a toluene medium.

[0103] [Refractive index of curable organopolysiloxane composition]

[0104] The refractive index of the curable organopolysiloxane composition was measured at 25°C using an Abbe refractometer. It should be noted that visible light at 589 nm was used as the light source.

...

reference example 1

[0130] Preparation of adhesion-imparting agent

[0131] 50 parts by mass of toluene were placed in the reaction container. Then, 19.3 parts by mass of n-butyl acrylate, 11.5 parts by mass of glycidyl methacrylate, 2.0 parts by mass of 3-methacryloxypropyltrimethoxysilane, 5.0 parts by mass of the formula CH 2 =C(CH 3 )C(O)OC 3 H 6 Si[OSiH(CH 3 ) 2 ] 3 The indicated 3-methacryloxypropyl-tris(dimethylhydrogensiloxy)silane and 2.0 parts by mass of 3-mercaptopropyltrimethoxysilane were added to drip tank 1 . In addition, 10 parts by mass of toluene and 0.275 parts by mass of 2,2'-azobis(isobutyronitrile) were charged into the dropping tank 2 .

[0132] Then, after the temperature of the reaction vessel was raised to 80° C., the above-mentioned monomer mixture was added to the reaction vessel dropwise from the drop tank 1 and the radical polymerization initiator solution from the drop tank 2 within 1 hour. middle. The contents of the reaction vessel were kept at 100°C for ...

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Abstract

A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.

Description

technical field [0001] The present invention relates to curable organopolysiloxane compositions and semiconductor devices, in particular to compounds having excellent curability and forming, when cured, high refractive index and light transmittance, high adhesion to various substrates , a curable organopolysiloxane composition of a flexible cured product having high hardness and slight surface tackiness, and particularly relates to a semiconductor device having excellent reliability, the semiconductor element of which is covered with a cured product of the above composition . Background technique [0002] Curable organopolysiloxane compositions curable by a hydrosilylation reaction are used as protective coating agents for semiconductor elements in photocouplers, light emitting diodes, solid-state image sensors, and other optical semiconductor devices. Such protective coating agents for semiconductor components are required to exhibit no light absorption or light scattering...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C09J183/04H01L23/29H01L33/56
CPCC08G77/70H01L23/296C08G77/20H01L2924/12044C08G77/12C08L83/04H01L2224/48091H01L2224/48247C08L83/00H01L2924/00014H10K59/00
Inventor 加藤智子森田好次山本真一猿山俊夫
Owner DOW CORNING TORAY CO LTD
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