Power module and power conversion device

A power module and conversion technology, applied in the field of power conversion devices, can solve the problems of deterioration of insulation performance, low cooling performance, no sealing of internal electronic components, etc., and achieve the effect of improving insulation reliability.
CN102414816AInactive Publication Date: 2012-04-11HITACHI AUTOMOTIVE SYST LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HITACHI AUTOMOTIVE SYST LTD
Publication Date
2012-04-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.
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Description

technical field

[0001] The present invention relates to a power module with a built-in inverter circuit, and a power conversion device including the power module. Background technique

[0002] Patent Documents 1 to 3 disclose structures of conventional double-sided cooling power modules, in which electrical wiring, an insulating layer, and a cooler are disposed on one main surface of a built-in power semiconductor element on which electrodes are formed, and on the other main surface. Electrical wiring, insulating layers and coolers are similarly arranged on the surface. In addition, in the above-mentioned cooler, the heat dissipation base and the heat dissipation fins are formed on the surface opposite to the arrangement surface of the power semiconductor elements, and the cooler is inserted and immersed in the cooling surface formed with the internal space sealed by the resin material. In the waterway frame of the waterway, the cooling medium is in direct contact with the ...

Claims

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