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Fire retardant adhesive composition and covering layer film using the same

A composition and adhesive technology, applied in the direction of adhesive types, carboxyl rubber adhesives, polymer adhesive additives, etc., can solve the problems of unsatisfactory anti-migration performance, poor resistance, etc. Excellent anti-migration properties, excellent flame retardancy, excellent adhesion and heat resistance

Inactive Publication Date: 2008-12-03
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phosphate esters exhibit poor resistance to moisture and heat, which means that phosphate esters generate ionic components by hydrolysis under conditions of high temperature and high humidity, resulting in unsatisfactory levels of anti-migration properties for substrates

Method used

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  • Fire retardant adhesive composition and covering layer film using the same
  • Fire retardant adhesive composition and covering layer film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] The binder composition components were combined in the ratios shown in Table 1, and then a mixed solvent of methyl ethyl ketone and toluene at a mass ratio of 1 / 1 was added to the resulting mixture to obtain a dispersion in which the organic solid component and the inorganic The combined concentration of solid components was 35% by mass.

[0092] - Preparation of cover layer film

[0093] The above-mentioned dispersion was applied in a sufficient amount on the surface of a polyimide film (product name: Apical NPI, manufactured by Kaneka Corporation, thickness: 12.5 μm) using a coater to produce a dry coating with a thickness of 25 μm, and then The applied coating was dried in a forced air oven at 120° C. for 10 minutes, thereby converting the adhesive composition to a semi-cured state and completing the preparation of the coverlay film. The properties of the coverlay film were measured according to Measurement Method 1 described below. In addition, the anti-migration ...

Embodiment 2-4

[0095] A coverlay film was prepared in the same manner as in Example 1, except that the adhesive composition components were combined in the ratios shown in the columns of Examples 2-4 in Table 1 . The properties of these coverlay films were measured according to Measurement Method 1 described below. In addition, the anti-migration property of each cover layer film was measured according to Measurement Method 2 described below. The measurement results are shown in Table 2.

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Abstract

This invention refers to a fire resistance bond composite and a covering layer film using the same. The fire resistance bond composite without halogen atoms and phosphorus atoms is provided. The composite contains: (A) 100 parts by weight of an epoxide resin without halogen, wherein if the number of the carbon atoms in the aliphatic radical of epoxide resin is a, and the number of carbon atoms in the aromatic radical of the epoxide resin is b, then b / a is not smaller than 2.0, (B) 15 to 70 parts by weight of aromatics rubber with active functional group; (C) 1 to 20 parts by weight of firming agent and (D) 10 to 70 parts by weight of inorganic filling material. This composite has excellent fire resistance, thermal stability and anti-transference property, and a covering layer film using the composite is further provided.

Description

[technical field] [0001] The present invention relates to an adhesive composition which does not contain halogen atoms and phosphorus atoms and which, when cured, produces a cured product exhibiting excellent flame retardancy and migration resistance. The invention also relates to coverlay films using such compositions. [Background technique] [0002] In recent years, developments in the field of electronics have been remarkable, and communications and consumer electronics in particular have seen significant advances in device miniaturization, weight reduction, and increased component density. The need for such improved performance continues to grow. In response to these needs, flexible printed wiring boards have been developed because they exhibit favorable flexibility and resist repeated bending, which means that they can be three-dimensionally packed in a limited space at high density. Therefore, these flexible printed wiring boards are being used more and more widely a...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J7/02C09J113/00
CPCC08L19/006C09J7/25C09J9/00C09J11/04C09J11/08C09J163/00C09J2203/00C09J2301/414C09J2479/086
Inventor 近藤和纪薄雅浩天野正
Owner SHIN ETSU CHEM IND CO LTD
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