Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

An interlayer insulating layer, printed circuit board technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of inability to be used repeatedly and high price, and achieve the effect of reducing the thermal expansion coefficient and improving the thermal cycle resistance.

Active Publication Date: 2006-08-23
IBIDEN CO LTD
View PDF1 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When performing shape correction in the manufacturing process of such molds, a very difficult process is indispensabl

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same
  • Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same
  • Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0213] (A) Production of kneaded product containing scaly particles

[0214] In a mixed solvent of 20 g of methyl ethyl ketone (hereinafter referred to as "MEK") and 80 g of xylene, 15 g of scaly particles (manufactured by Hy-Jun Co., Ltd., trade name "Espen C"," added, aspect ratio during dispersion: ~500, crystal Size: ~0.5μm), kneaded with three rolls to form a kneaded product containing scaly particles.

[0215] (B) Preparation of epoxy resin solution

[0216] To a mixed solvent of 6.8 g of MEK and 27.2 g of xylene, 85 g of solid epoxy resin (manufactured by Nippon Epoxy Resins Japan Epoxy Resin Co., Ltd., trade name "Epco Eto 1007") was added and mixed to obtain an epoxy resin-containing solution.

[0217] (C) Production of resin film for interlayer insulation layer

[0218] Using three rollers, the kneaded product containing scaly particles prepared in (A), the epoxy resin solution prepared in (B), and dicyandiamide (ビイ·テイ·アイ·ジヤパンProduced by the company, trade name "CG-1200"...

Embodiment 2

[0324] As the scaly particles, the trade name "NANOFIL" manufactured by Tomi-Industry Co., Ltd. (aspect ratio after dispersion: 100 to 500, particle diameter: 0.1 to 0.5 μm, minimum particle thickness: 0.001 μm) was used. In Example 1, a multilayer printed circuit board was produced in the same manner.

Embodiment 3

[0326] Except that the flaky particle-containing kneaded product and the epoxy resin-containing solution were prepared in accordance with the following (A) to (B), a multilayer printed wiring board was manufactured in the same manner as in Example 1 except that the kneaded product was prepared.

[0327] (A) Production of kneaded product containing scaly particles

[0328] In a mixed solvent of 33g of MEK and 67g of xylene, 15g of scaly particles (manufactured by Hyjyun Co., Ltd., trade name "Espen C", aspect ratio during dispersion: ~500, crystal size: ~0.5μm) was added, and Three rolls are kneaded to form a kneaded product containing scaly particles.

[0329] (B) Preparation of epoxy resin solution

[0330] To a mixed solvent of MEK11g and 23g xylene, 85g of solid epoxy resin (manufactured by Nippon Epoxy Resins Japan Epoxy Resin Co., Ltd., trade name "Epco Eto 1007") was added and mixed to obtain a solution containing epoxy resin .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Average lengthaaaaaaaaaa
Average widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

Disclosed is an interlayer insulating layer for printed wiring boards which is formed on a base and composed of a curing resin wherein scale-like particles are dispersed. Also disclosed is a printed wiring board which is excellently improved in heat cycle resistance and mounting reliability without lowering heat resistance, electrical insulation, heat dissipation, connection reliability or chemical stability. Further disclosed is a method for manufacturing a printed wiring board which enables to transfer a wiring pattern or a via hole to the interlayer insulating layer easily and accurately by an imprinting method wherein a mold having a projected portion corresponding to the wiring pattern is used. The method does not require an optical transfer method or a complicated etching for forming the wiring pattern or via hole. With this method, a printed wiring board having a very fine wiring pattern which is excellent in insulation reliability and interlayer connection can be easily mass-produced at low cost.

Description

Technical field [0001] The present invention relates to an interlayer insulating layer formed by curing an interlayer insulating material for a printed circuit board, a printed circuit board having the interlayer insulating layer, and a manufacturing method of the printed circuit board. Background technique [0002] In recent years, in response to the miniaturization of electronic equipment and the increase in signal transmission speed brought about by the advancement of the electronics industry, there is a demand for printed circuit boards or LSI-mounted circuit boards that achieve high density and high reliability by fine patterns. . [0003] For this reason, recently, as a method of forming a conductor circuit on a circuit board, an interlayer insulating material is coated on the surface of a substrate to form an interlayer insulating layer, and after roughening the surface of the interlayer insulating layer, an additive method or a semi-additive method is used. Form the circu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46
Inventor 浅井元雄野田宏太稻垣靖
Owner IBIDEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap