393 results about "Heat cycling" patented technology

The present invention provides methods and systems for real-time measurements of PCR with multiplexing capability. Certain embodiments relate to methods and systems that use fluorescently encoded superparamagnetic microspheres for the immobilization of amplification products during the PCR process, and an imaging chamber of a measurement device that is also capable of controllable thermal cycling for assisting the PCR process.

A semiconductor structure includes backside dummy plugs embedded in a substrate. The backside dummy plugs can be a conductive structure that enhances vertical thermal conductivity of the semiconductor structure and provides electrical decoupling of signals in through-substrate vias (TSVs) in the substrate. The backside dummy plug can include a cavity to accommodate volume changes in other components in the substrate, thereby alleviating mechanical stress in the substrate during thermal cycling and operation of the semiconductor chip. The backside dummy plug including the cavity can be composed of an insulator material or a conductive material. The inventive structures can be employed to form three-dimensional structures having vertical chip integration, in which inter-wafer thermal conductivity is enhanced, cross-talk between signals through TSVs is reduced, and/or mechanical stress to the TSVs is reduced.

An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered interconnect structure having a high density interconnect layer such as an allylated surface layer. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip. The electronic package further includes a dielectric material having an effective modulus to assure sufficient compliancy of the multi-layered interconnect structure during operation. The allylated surface layer has the property of being able to withstand thermal stresses that arise during thermal cycling operation of the electronic package.

An integrated heat exchange system on a microfluidic card. According to one aspect of the invention, the portable microfluidic card has a heating, cooling and heat cycling system on-board such that the card can be used portably. The microfluidic card includes one or more reservoirs containing exothermic or endothermic material. Once the chemical process of the reservoir material is activated, the reservoir provides heat or cooling to specific locations of the microfluidic card. Multiple reservoirs may be included on a single card to provide varying temperatures. The assay chemicals can be moved to the various reservoirs to create a thermal cycle useful in many biological reactions, for example, Polymerase Chain Reaction (PCR) or rtPCR. According to another aspect of the invention, the integrated heat exchanger is an adjacent microfluidic circuit containing fluid that is either independently heated or cooled, or is an exothermic or endothermic material, such that the fluid in the adjacent circuit imparts a change in temperature to the assay fluid in an independent circuit. According to yet another aspect of the invention, a thermal electric cooler (TEC) is used for thermocycling the amplification chamber of a disposable microfluidic card.

To provide a working fluid which has cycle performance sufficient as an alternative to R410A while the influence over global warming is sufficiently suppressed, which does not significantly increase the load to an apparatus as compared with a case where R410A is used, and which can be stably used continuously without any special measures, a composition for a heat cycle system comprising the working fluid, and a heat cycle system employing the composition.

A working fluid for heat cycle, wherein the global warming potential is less than 300; the product of the relative coefficient of performance and the relative refrigerating capacity is at least 0.820 relative to R410A in a standard refrigerating cycle under conditions of an evaporation temperature of 0° C., a condensing temperature of 40° C., a supercoiling degree of 5° C. and a degree of superheat of 5° C.; the relative compressor discharge gas pressure is at most 1.100; the lower limit of the combustion range by method A in High Pressure Gas Safety Act is at least 5 vol %; and the pressure will not exceed 2.00 MPaG in a combustion test by method A in High Pressure Gas Safety act under 0.98 MPaG at 250° C.

To provide a working fluid for heat cycle, which has less influence over the ozone layer and has less influence over global warming, and which has favorable cycle performance. A working fluid for heat cycle, which contains trifluoroethylene and difluoroethylene, wherein the proportion of the content of difluoroethylene is less than 1.5 mass % based on the working fluid.

A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

Fine-grained (average grain size 1 nm to 1,000 nm) metallic coatings optionally containing solid particulates dispersed therein are disclosed. The fine-grained metallic materials are significantly harder and stronger than conventional coatings of the same chemical composition due to Hall-Petch strengthening and have low linear coefficients of thermal expansion (CTEs). The invention provides means for matching the CTE of the fine-grained metallic coating to the one of the substrate by adjusting the composition of the alloy and/or by varying the chemistry and volume fraction of particulates embedded in the coating. The fine-grained metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling. The low CTEs and the ability to match the CTEs of the fine-grained metallic coatings with the CTEs of the substrate minimize dimensional changes during thermal cycling and prevent premature failure.

To provide a composition for a heat cycle system, which comprises a working fluid for heat cycle which has a low global warming potential and high stability, and which can replace R410A, and a heat cycle system employing the composition.

A composition for a heat cycle system, which comprises a working fluid for heat cycle containing 1,2-difluoroethylene, and a stabilizer for preventing deterioration of the working fluid for heat cycle, such as an oxidation resistance-improving agent, a heat resistance-improving agent or a metal deactivator, and a heat cycle system employing the composition for a heat cycle system.

To provide a working medium for heat cycle which has less influence over the ozone layer, which has less influence over global warming and which provides a heat cycle system excellent in the cycle performance (the efficiency and the capacity), and a heat cycle system excellent in the cycle performance (the efficiency and the capacity). A working medium for heat cycle comprising 1,2-difluoroethylene is employed for a heat cycle system (such as a Rankine cycle system, a heat pump cycle system, a refrigerating cycle system 10 or a heat transport system).

Mold tooling formed of suitable iron-nickel alloys and provided with a hard electroless nickel coating on the mold cavity surface are useful for high volume production of carbon fiber reinforced, polymer matrix, composites. The iron and nickel alloy provides thermal expansion properties for the molding of dimensionally accurate parts. The nickel alloy coating provides a durable surface, without adversely affecting the expansion properties of the mold, and remains adherent to the base metal during the repeated thermal cycling encountered in high volume production of substantially identical molded carbon composite parts.

To provide a composition for a heat cycle system comprising trifluoroethylene (HFO-1123), which has a low global warming potential and excellent cycle performance of HFO-1123 and which has high durability, and a heat cycle system employing the composition, which has less influence over global warming and has both high cycle performance and durability.

A composition for a heat cycle system, which comprises a working fluid for heat cycle containing trifluoroethylene, and a radical scavenger, and a heat cycle system employing the composition for a heat cycle system.

To provide a working fluid for heat cycle having a low global warming potential and having high durability, which can replace R410A, a composition for a heat cycle system comprising it, and a heat cycle system employing the composition.

A working fluid for heat cycle, which contains trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane, wherein the proportion of the total amount of trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane based on the entire amount of the working fluid is higher than 90 mass % and at most 100 mass %, and based on the total amount of trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane, the proportion of trifluoroethylene is at least 10 mass % and less than 70 mass %, the proportion of 2,3,3,3-tetrafluoropropene is at most 50 mass %, and the proportion of difluoromethane is higher than 30 mass % and at most 75 mass %.

The invention relates to a vessel and kit for thermal cycling applications, a method for manufacturing such a vessel. The vessel comprises, in the form of a planar grid having a predefined pitch, a plurality of sample wells each having a well wall, which defines an open well end and a closed well end. According to the invention there are provided a plurality of ribs between pairs of adjacent wells, the ribs being connected to the walls of the wells and extending essentially in a plane perpendicular to the plane of the well grid. The invention enables manufacturing of dense microtiter plates, which are stable enough to be used in high temperature applications and allow for more efficient manufacturing of the plate.

To provide a composition for a heat cycle system having less influence over the ozone layer, having a low global warming potential and having excellent stability and durability, and a heat cycle system.

A composition for a heat cycle system, which comprises a working fluid containing trifluoroethylene and difluoromethane, and a phosphoric acid ester, wherein the interaction distance (Ra) between the working fluid and the phosphoric acid ester as determined from the Hansen solubility parameters is at most 15.