39 results about "Heat cycling" patented technology

The present invention provides solder alloys, solder pastes, solder balls, solder preforms, and solder joints that have excellent resistance to drop impact and heat cycling, suppress the occurrence of chipping, bridging, and icicle formation, and also suppress the occurrence of electromigration. [Solution] The solder alloy has an alloy composition consisting of, by mass%, Ag: 0.3~1.9%, Cu: 0.40~1.00%, Bi: 0.5~4.9%, P: 0.00100~0.02000%, and the remainder being Sn. The alloy composition may further contain Ge, Co, and Ga in amounts of 0.06% or less by mass, and at least one of each. The alloy composition may also further contain As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr, and Pt in amounts of 0.06% or less by mass, and at least one of each.

The application discloses a kind of data-driven power distribution methods and systems for H bridge module health degree balance. It belongs to the technical field of power system automation. The steps are as follows: first, based on current, voltage and switch state, a thermoelectric coupling model of IGBT and capacitor is constructed to estimate dynamic temperature; Then introduce sliding window and extreme pairing mechanism, extract the thermal cycle load sequence of key devices; Then, combined with Coffin-Manson and Arrhenius model, the life damage is calculated; Normalize and time decay processing to construct module health index. On this basis, a power optimization allocation model with health awareness is constructed, TD3 reinforcement learning algorithm is introduced to realize strategy training and online deployment, forming a closed-loop control mechanism from state perception, decision optimization to scheduling execution. This method provides an intelligent and adaptive scheduling solution for multi-module energy storage systems, improving the intelligent level of system health management.

The application discloses a control method of a multi-connected air conditioning system and the air conditioning system. The air conditioning system comprises an outdoor unit and at least two indoor units. The control method comprises the following steps: obtaining a working mode of each indoor unit required to be outputted in advance to obtain basic data sets; when the proportion of the refrigeration mode in the basic data is greater than zero, the outdoor unit is controlled to work in a refrigeration cycle state, the indoor units required to be outputted in the heating mode and the air supply mode are controlled to be in the air supply mode, and the auxiliary electric heater in the indoor unit required to be outputted in the heating mode is controlled to be in an on-demand opening state; when the proportion of the refrigeration mode in the basic data is equal to zero and the proportion of the heating mode is greater than zero, the outdoor unit is controlled to work in a heating cycle state, and the indoor unit required to be outputted in the air supply mode is controlled to be in the air supply mode. Based on the control method, the flexibility of the air conditioning regional control is effectively improved, the energy utilization efficiency of the air conditioning system is improved, and more personalized air conditioning services are provided.

This invention relates to high-energy-density phase change composite materials, their preparation methods, and applications, belonging to the field of phase change composite material technology. To address the problems of low energy density, insufficient mechanical properties, and poor processability of current phase change materials, this invention provides a high-energy-density phase change composite material, specifically a lightweight porous cellulose phase change composite aerogel. Internally, it consists of a three-dimensional network framework formed by the cross-linking of vinyl-functionalized cellulose nanocrystals and cellulose nanofibers. The phase change material is uniformly loaded within the pores of this three-dimensional network, with a loading amount of 65.53~91.02 wt%. The phase change temperature range of the composite material is 20~80℃. This invention's phase change composite material, relying on a hierarchical confinement structure, achieves efficient encapsulation and high loading of the phase change material, with a phase change enthalpy as high as 133.2 J / g. It also possesses excellent mechanical and thermal cycling stability and 3D printing performance, making it suitable for scenarios with wide temperature fluctuations and applicable to the field of intelligent thermal management.

Systems and apparatus for a reduced mass substrate support are disclosed, according to certain embodiments. A front side pocket is provided for support of a substrate, while a backside pocket is provided that reduces the mass of the substrate support. By providing the backside pocket, the mass of the overall substrate support is reduced, providing faster thermal cycling times for the substrate support and reducing the weight of the substrate support for transport. Lift pin systems, according to disclosed embodiments, are compatible with existing pedestal systems by providing a hollow extension from each lift pin hole that extends from a bottom of the backside pocket to provide support for lift pin insertion and operation.

The utility model relates to UPS case technical field, the utility model provides a kind of baking finish drying device for UPS case production, it includes: oven, the side of oven is rotatably connected with pivot, the circumference of pivot is fixedly connected with cover plate, the side of oven is provided with even drying device.The utility model further provides a kind of baking finish drying device for UPS case production, it includes: the side of oven is provided with heat cycle device, the heat cycle device includes rotating rod, the rotating rod is penetrated on the inside of oven, the circumference of rotating shaft is provided with belt, the rotating shaft is rotatably connected with belt pulley by belt, the circumference of rotating rod is fixedly connected with fan blade.Through the above technical scheme, the technical problem of uneven drying and heating of the drying oven for USB case production in the prior art is solved.

This invention relates to the field of superconducting tape processing technology, specifically disclosing a superconducting tape joint with stable resistance and its preparation method. The tape joint sequentially comprises: a substrate layer, a buffer layer, a superconducting layer, an interface layer, a welding layer, and a stabilizing layer. The interface layer and the stabilizing layer are disposed on the side of the substrate layer away from the buffer layer, and the interface layer and the stabilizing layer are in a fully encapsulated state. The main phase of the superconducting layer is [missing information - likely a specific phase or property], with a value of 0-0.1. The superconducting layer also includes a pinning defect phase, which includes BaZrO₃ nanoparticles. The interface layer is a LaNiO₃ film. This invention replaces the Ag layer of the interface layer with a LaNiO₃ layer and introduces BaZrO₃ nanoparticles into the superconducting phase, improving the overall performance. Compared with traditional methods, the change in initial resistance is minimal, but the thermal cycling performance, including resistance shift and lifetime, is greatly optimized.

This invention discloses a type 0-3 polymer ferroelectric composite material for use in integrated circuit interposers and its preparation method. The composite material consists of an epoxy resin matrix and KBiFe2O5 ferroelectric powder dispersed therein, with 100 parts by mass of epoxy resin and 5-50 parts by mass of KBiFe2O5. KBiFe2O5 has a layered perovskite structure and a low intrinsic dielectric constant (<3.5), and a coefficient of thermal expansion of only 1.6-10 ppm / K. Surface modification of the ferroelectric powder with a silane coupling agent can significantly improve its interfacial bonding strength with the epoxy resin. This invention utilizes a type 0-3 composite structure to achieve adjustable coefficient of thermal expansion of the composite material within the range of 3-20 ppm / K while maintaining a low dielectric constant (3.0-3.8@1 MHz) and low dielectric loss (<0.005@1 MHz), enabling good matching with silicon chips (CTE approximately 3-5 ppm / K) and effectively reducing thermal cycling stress. The composite material has a simple preparation process, is compatible with existing packaging production lines, and is suitable for use as an interposer material in three-dimensional integrated circuit packaging, showing promising application prospects.

The present invention provides a solder alloy, a solder paste, a solder ball, a preformed solder, and a soldered joint, which have excellent drop impact resistance and heat cycle resistance, can suppress the occurrence of chip standing and connected tin · tin tips, and can also suppress the occurrence of electromigration. The solder alloy has an alloy composition of Ag: 0.3 to 1.9%, Cu: 0.40 to 1.00%, Bi: 0.5 to 4.9%, P: 0.00100 to 0.02000% by mass, and the balance being Sn. The alloy composition can also contain at least one of Ge, Co, and Ga in an amount of 0.06% or less by mass, respectively. In addition, the alloy composition can also contain at least one of As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr, and Pt in an amount of 0.06% or less by mass, respectively.

The utility model discloses a kind of sterilization devices of strain culture material, including box, the inside intermediate of the box is provided with vertical baffle and is divided into two sterilization cavities, load assembly of culture material box is provided in sterilization cavity, airflow passage exists between the upper and lower ends of the vertical baffle and box, heat cycle device is provided between the upper end of the vertical baffle and box, high-temperature sterilization device is provided on the both sides of the box, by heat cycle device, stereoscopic penetration loading and omni-directional ventilation design, solve traditional sterilization device problem, make sterilization uniformity promote, heating fast, energy consumption is low, and miscellaneous bacteria kill rate is high, and modular structure is convenient for operation maintenance.

A die attach system includes a substrate that has scored grooves or into which stud bumps on a die are then inserted. The additional surface area and flow of the stud bumps into the trenches creates a strong mechanical bond that may withstand repeated thermal cycling. In a further exemplary aspect, the substrate may be covered in a first material, the stud bumps may be made from the same first material, a die attachment material may be made from the same first material, and a bottom layer of the die may be made from the same material. This material homogeneity allows for more uniform expansion and contraction during thermal cycling, preventing failure of the mechanical bond.

This invention discloses a composite steel pipe lining and its molding and curing method, belonging to the technical field of pipeline anti-corrosion materials. The lining comprises a corrosion-resistant functional layer, an interface bonding layer, and a buffer transition layer arranged sequentially from the inside out. A three-step modification process is employed: a dopamine-based biomimetic adhesion layer, a fluorotantalic acid-boric acid low-temperature liquid-phase deposition tantalum pentoxide layer, and grafting open-ring fluorinated polyhedral oligomeric silsesquioxanes to treat basalt fibers, imparting superhydrophobic properties and a dense chemical protective barrier to the fibers. This lining transforms traditional passive corrosion protection into an active repulsion mode, effectively cutting off the penetration path of corrosive media and improving the chemical corrosion resistance, interface bonding strength, and thermal cycling stability of the composite steel pipe.

The application relates to the technical field of automobile seat framework manufacturing, and discloses an electric backrest framework manufacturing process combining three-dimensional scanning and flexible shaping. The process detects the distance of a welding gun through a sensor and automatically switches welding parameters with different energy densities to complete side plate connection; a pressure head assembly provided with a nano ceramic reinforced modified polyether ether ketone contact pad is assembled to apply a correction force to a subassembly, correction force values and rebound displacement amounts after unloading are collected in real time; a central control unit calculates a compensation welding path with a space compensation vector based on the material Young's modulus and the collected data; finally, the path is called in cooperation with a profiled water-cooled copper gasket and forced heat dissipation circulation to symmetrically weld the framework. The application constructs a thermal deformation prediction model through cold-state mechanical feedback, solves the problems of uncontrollable high-strength steel welding deformation and surface bruising by using a special composite material contact pad, and improves the size precision of the framework.

The application discloses a high-density diamond-copper composite heat dissipation material and a vacuum infiltration preparation method thereof, and relates to the technical field of metal-based composite heat dissipation materials. The material comprises a diamond reinforcing phase and a copper matrix. Diamond particles are classified according to particle size, and a Ti-Cu alloy coating is coated on the surface of the diamond particles. During preparation, the high-density composite heat dissipation material is obtained through cleaning and drying, coating deposition, cold isostatic pressing, vacuum infiltration, gradient cooling and grinding and polishing. The application can improve the interface bonding strength and the material density, reduce the interface thermal resistance, and improve the heat conduction performance and the thermal cycle stability.

The application discloses an energy pile thermal-mechanical coupling response prediction method and device, comprising: constructing a pile-soil interaction model; analyzing a pile side cyclic load transfer model and a pile end load transfer model; constructing an energy pile thermal-mechanical response control equation; performing thermal load cycling, analyzing the initial stiffness coefficient in the heating stage, and constructing the initial stiffness matrix; heating the energy pile, and the temperature increment is Δ T x ; deducing the energy pile response and the interface stress state; updating the stiffness coefficient and the stiffness matrix; obtaining the complete load-settlement response and the interface stress state; analyzing the stiffness coefficient in the cooling stage, and constructing the initial stiffness matrix; cooling the energy pile, and the temperature increment is Δ T y ; deducing the energy pile response and the interface stress state; updating the stiffness coefficient and the stiffness matrix; obtaining the performance of the energy pile under the thermal load cycling; the method can be applied to the ground source heat pump system, and can quickly and effectively analyze and evaluate the mechanical response of the pile foundation caused by the cold and heat cycling.

This utility model relates to a tooling for controlling the welding deformation of a screen frame in a multi-stage sorting machine. 1. It is used to fix the screen frame, which includes a rectangular screen plate at the bottom, positioning side plates arranged opposite to each other on the left and right, and connecting side plates arranged opposite to each other in the front and back. The positioning side plates and connecting side plates are welded together above the screen plate to form a square screen frame. The clamping device includes an inner positioning plate and an outer positioning plate. The top-fixing device includes a top-pressing member that can be movably pressed against the outside of the connecting side plate so that the two sides of the connecting side plate abut against the edges of the positioning side plate. The rigid fixing of the clamping device and the pressing of the top-fixing device form a complementary constraint, so that the large-area clamping of the positioning side plate ensures the positional accuracy of the positioning side plate as a reference. The local pressing of the top-pressing member is specifically aligned with the connecting side plate. The top-pressing member allows the top pressure to be dynamically adjusted with the welding thermal cycle to compensate for the shrinkage deformation of the weld during cooling. The slight displacement of the connecting side plate is compensated by adjusting the pressing pressure.

[PROBLEM]The present invention provides a resin composition suitable for forming an optical member including an optical waveguide that has a low refractive index and exhibits no cracking in a heat cycle test. Further provided are an optical waveguide comprising a cured product of the resin composition, an opto-electric hybrid board comprising the optical waveguide, and a device comprising the opto-electric hybrid board. [SOLUTION]The resin composition for forming an optical member comprises (a) a siloxane polymer having an unsaturated bond-containing group, (b) surface-modified silica nanoparticles, (c) a photopolymerization initiator, and (d) a polyfunctional thiol compound.

This invention relates to a composite coating with low thermal expansion coefficient and low emissivity, its preparation method, and its application, belonging to the field of functional coating materials technology. The composite coating of this invention sequentially comprises a Si binder layer, a Ta₂O₅ stress buffer layer, and a Pt metal layer. The Si binder layer serves as the binder layer, the Ta₂O₅ stress buffer layer as the low thermal expansion stress buffer layer, and the Pt metal layer as the low emissivity functional layer. The thermal expansion coefficient of Si is 3~4×10⁻⁶. ‑6 / ℃, while the coefficient of thermal expansion of Ta2O5 material is 6~7×10. ‑6 At ℃, the coefficient of thermal expansion of Pt material is 8~9×10⁻⁶. ‑6 / ℃, through gradient coating design, the Pt metal layer can have excellent thermal cycling life and maintain low emissivity performance, which is suitable for substrates with low thermal expansion coefficient, and meets the future requirements of lightweight hot-end components and infrared signal shielding.

The application discloses a high-temperature-resistant insulating material for new energy batteries and a preparation method thereof, and relates to the technical field of high polymer materials.The method comprises the following steps: first, modifying o-cresol formaldehyde epoxy resin with DOPO, and then reacting the modified o-cresol formaldehyde epoxy resin with KH-560 to obtain an active compatibilizer and powderize the active compatibilizer; then, performing surface passivation, silica coating, calcination and titanate coupling treatment on aluminum nitride to obtain an AlN@SiO2 composite filler; then, performing surface modification on the filler by using an aminated hyperbranched polysiloxane and nano boron nitride to construct an interface buffer layer; finally, blending, extruding and heat-treating polyetherimide, the active compatibilizer, the modified filler and an antioxidant. The method is suitable for the insulating field of new energy batteries, and the high-temperature stability and long-term heat cycle performance of the material are significantly improved through multi-scale synergistic modification.

The present application belongs to the technical field of welding and dissimilar material connection, and particularly relates to a high-temperature thermal cycle service dissimilar joint and a connecting method. The joint comprises a first base material, a second base material, and a composite brazing interlayer arranged between the first base material and the second base material. The technical scheme of the present application has strong engineering adaptability, has good compatibility with the existing conventional brazing process, can realize stable preparation without greatly changing the existing production equipment and process flow, can be widely applied to the preparation of fusion reactor first wall, divertor, high heat flow heat sink connection and various high-temperature load connecting pieces, provides a stable and controllable, batch landing solution for the dissimilar connection of refractory metal and structural alloy under extreme high-temperature thermal cycle conditions, and has significant engineering application value and economic benefits.

This invention relates to the field of electrical performance testing technology for insulating materials, and particularly to a device and method for testing the high-temperature electrical performance of insulating materials. The device includes: a rigid frame, a movable plate, a manual pressurization mechanism, an upper electrode assembly, a lower electrode assembly, an electrical isolation structure, and a movable, split-type heating system. The movable, split-type heating system merges at the test position to form an annular heating cavity surrounding the insulating material under test, and separates at non-test positions to expose the insulating material. The method of this invention includes the following steps: a sample clamping step, a thermal expansion compensation pressurization step, a dynamic thermal cycling loading step, and a non-destructive withstand voltage test step. The device and testing method of this invention can accurately reproduce the key service stress state of materials, and are as intuitive to operate, easy to maintain, and flexible to configure as general-purpose tools, thereby achieving a fundamental optimization between R&D depth, quality inspection efficiency, and overall cost.

The utility model provides a kind of high-temperature curing coating device of polyimide film silica gel tape, it is related to polyimide film silica gel tape coating technical field, and it includes: coating machine body, the coating protection cover is fixed on the coating machine body upper end face cover, the coating protection cover inside is provided with coating roller and glue guide roller, the coating roller side end is connected with first electric push rod by frame one, the glue guide roller side end is connected with second electric push rod by frame two, the glue guide roller upper end face is equipped with spray head, the curing dustproof cover is welded in the right side end of coating protection cover, the curing dustproof cover inside is provided with air outlet and air inlet, the curing dustproof cover upper surface is fixed with heat cycle air bellow, the water-absorbing resin screen plate and activated carbon screen plate are sealingly inserted in the inside middle part of heat cycle air bellow, the water-absorbing resin screen plate and activated carbon screen plate outside are inserted with U-shaped partition. The utility model solves the problem that the temperature and humidity of external environment can easily affect PI silica gel tape high-temperature curing effect.

The present application relates to the technical field of screen bonding, and specifically discloses a screen bonding method. The steps are as follows: S1: preparing a glue solution: taking an optical transparent adhesive as a main glue, matching a flexible organic silicone material as a flexible modifier, and a micron-level precision reinforcing filler as a reinforcing agent, and uniformly mixing them in proportion; S2: gluing: coating the glue solution on the surface of glass or a screen, completing the bonding of the screen and the glass, and standing for bonding; S3: curing: placing the bonded part under a UV lamp for irradiation, so that the glue layer is fully cured; S4: heat cycle treatment: placing the cured screen into a high-low temperature box, slowly heating to 40-60 DEG C and keeping warm, then slowly reducing to room temperature and keeping, continuing to reduce to 20-40 DEG C and keeping warm, and finally slowly rising to room temperature, completing one cycle. The method can effectively improve the problem that bubbles are difficult to eliminate in the existing screen bonding process, and reduce the production and processing cost.

The application relates to a manufacturing method of a PET copper-plated film with a gradient interface structure. The composite film comprises a PET substrate, a microstructure layer arranged on the surface of the PET substrate, a metal adhesion transition layer arranged on the microstructure layer, and a copper functional layer arranged on the metal adhesion transition layer. The grain size of the copper functional layer near the interface region is smaller than that near the surface region. The mechanical embedding effect formed by the microstructure layer and the interface transition effect formed by the metal adhesion transition layer are matched, so that the interface bonding state and the structural stability under the conditions of thermal cycling and bending are improved.

A method of operating a heat cycle system, wherein the heat cycle system comprises a working fluid, which is cycled through a circuit comprising a compressor, a condenser, an expander unit, and an evaporator and wherein the expander unit is configured to generate a rotating mechanical motion, comprises operating the evaporator at an evaporator working fluid evaporation capacity that is at least about 110% of the nominal evaporator working fluid evaporation capacity. There is also disclosed a heat cycle system as well as a method of modifying a heat cycle system.

Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint which have excellent drop impact resistance and heat cycle resistance, can suppress the occurrence of chip standing, bridges and icicles, and can also suppress the occurrence of electromigration. The solder alloy has an alloy composition of, by mass %, Ag: 0.3 to 1.9%, Cu: 0.40 to 1.00%, Bi: 0.5 to 4.9%, P: 0.00100 to 0.02000%, with the balance being Sn. The alloy composition may further contain, by mass %, each of Ge, Co and Ga in an amount of 0.06% or less, and at least one. In addition, the alloy composition may further contain, by mass %, each of As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr and Pt in an amount of 0.06% or less, and containing at least one of them.

This invention belongs to the field of single-crystal diamond technology, specifically relating to a single-crystal diamond heat dissipation substrate material and its preparation method. The single-crystal diamond heat dissipation substrate material is prepared from a mixed powder. The mixed powder comprises the following raw materials in parts by weight: 15-25 parts single-crystal diamond, 70-85 parts Al-Mg alloy powder, 0.3-1.5 parts h-BN, and 0.5-1 parts silicon powder. This invention involves surface purification treatment of the single-crystal diamond, using hexagonal boron nitride to form a dotted non-uniform coating structure on the diamond surface, followed by uniform mixing of modified diamond particles with aluminum-magnesium alloy powder containing trace amounts of silicon powder. A segmented heating and gradient pressurization discharge plasma sintering process is employed to generate silicon carbide whiskers in situ in the exposed diamond area, combined with low-temperature annealing to eliminate residual stress within the material. The resulting composite material possesses excellent thermal conductivity, mechanical strength, wear resistance, and thermal cycling stability.

This invention discloses a high-reliability AlN copper-clad ceramic substrate and its preparation method, relating to the field of ceramic substrate technology. The process includes the following steps: Step 1: Solder paste is printed on an AlN ceramic sheet, allowed to stand and level, and then dried to obtain a solder paste print; Step 2: The solder paste print is sequentially subjected to vacuum brazing, pattern etching, step etching, electroplating, and microgroove fabrication to obtain the AlN copper-clad ceramic substrate; the AlN ceramic sheet is of the instant-fire type; the pattern etching parameters are: temperature 45~55℃, etching rate 8~15μm / min, etching factor 1.5~3.0; bottom insulation distance between copper islands 0.3~1.0mm. The AlN copper-clad ceramic substrate prepared by this application exhibits good thermal cycling stability and low porosity.

This invention discloses a composite forming process for metal frame components, relating to the field of metal component manufacturing technology. This process integrates electrically assisted heating, bending pre-forming, and local forging forming into a multi-directional die forging press, completed sequentially within a single thermal cycle. First, the billet is divided into sections and electrically heated. Then, a lateral hydraulic cylinder drives a bending die for pre-forming. Subsequently, under the drive of a main hydraulic cylinder, a forging die performs local precision forging of key areas. Finally, after pressure holding and controlled cooling, the workpiece is obtained. This invention, through a composite "bending before forging" method, rapidly establishes the overall contour while precisely controlling the local shape and quality. One-time forming avoids performance degradation caused by multiple heating processes, effectively solving the problems of large springback, contour distortion, low material utilization, and long manufacturing cycles associated with traditional processes. It achieves high-efficiency, high-precision, and high-performance near-net-shape forming of complex frame components.