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409 results about "Heat cycling" patented technology
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Method and devices for extremely fast DNA replication by polymerase chain reactions (PCR)
InactiveUS6180372B1Shorten cycle timeHigh sensitivityBioreactor/fermenter combinationsNanotechPolymerase LBiological materials
The invention concerns methods and instruments for fast, selective replication of deoxyribonucleic acid (DNA) from biomaterial through the known polymerase chain reaction (PCR), working in individual duplication thermocycles. The invention consists of extremely brief cycle times of only a few seconds for the PCR reactions, generated, on the one hand, by reaction chambers for the reception of the reaction solution constructed of a pattern of fine capillaries in close proximity to heating and cooling elements in order to optimally accelerate the temperature setting in the reaction solution for the three temperature phases of the PCR duplication cycles and, on the other hand, by keeping the flow rates in the capillaries to a minimum during the amplification phase so that the polymerase reaction is not disturbed. The capillary pattern can be simply produced by means of microsystern technology.
Owner:BRUKER FRANZEN ANALYTIK
Systems and methods for multiplex analysis of PCR in real time
ActiveUS20080305481A1Improve reusabilityMicrobiological testing/measurementFermentationMultiplexingMeasurement device
The present invention provides methods and systems for real-time measurements of PCR with multiplexing capability. Certain embodiments relate to methods and systems that use fluorescently encoded superparamagnetic microspheres for the immobilization of amplification products during the PCR process, and an imaging chamber of a measurement device that is also capable of controllable thermal cycling for assisting the PCR process.
Owner:LUMINEX
Electronic assembly having a wetting layer on a thermally conductive heat spreader
InactiveUS6504242B1Maintain temperatureSemiconductor/solid-state device detailsSolid-state devicesIndiumHeat cycling
An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.
Owner:INTEL CORP
Method and system for microfluidic manipulation, amplification and analysis of fluids, for example, bacteria assays and antiglobulin testing
A microfluidic system for isolation and amplification of DNA or RNA from aqueous solutions and detection of the DNA or RNA on a lateral flow detection strip, including a disposable microfluidic card for use in analysis of bacteria in platelets and an analysis of sexually transmitted diseases (STD) in urine. The card will include an embedded membrane that filters out cells and cellular debris. Any biological debris on the membrane will be lysed and the DNA or RNA amplified via PCR amplification protocol, including appropriate reagents and thermal cycling conditions. The amplified DNA or RNA are transferred to a lateral flow detection strip for a visual diagnostic read out. An alternate embodiment includes a microfluidic card for use in typing antiglobulin assays.
Owner:PERKINELMER HEALTH SCIENCES INC
System and method for heating, cooling and heat cycling on microfluidic device
ActiveUS7544506B2Bioreactor/fermenter combinationsHeating or cooling apparatusThermoelectric coolingOn board
Owner:PERKINELMER HEALTH SCIENCES INC
Backside dummy plugs for 3D integration
ActiveUS20110233785A1Enhances vertical thermal conductivityReduce mechanical stressSemiconductor/solid-state device detailsSolid-state devicesSemiconductor structureSemiconductor chip
A semiconductor structure includes backside dummy plugs embedded in a substrate. The backside dummy plugs can be a conductive structure that enhances vertical thermal conductivity of the semiconductor structure and provides electrical decoupling of signals in through-substrate vias (TSVs) in the substrate. The backside dummy plug can include a cavity to accommodate volume changes in other components in the substrate, thereby alleviating mechanical stress in the substrate during thermal cycling and operation of the semiconductor chip. The backside dummy plug including the cavity can be composed of an insulator material or a conductive material. The inventive structures can be employed to form three-dimensional structures having vertical chip integration, in which inter-wafer thermal conductivity is enhanced, cross-talk between signals through TSVs is reduced, and / or mechanical stress to the TSVs is reduced.
Owner:GLOBALFOUNDRIES US INC
Electronic package with high density interconnect layer
InactiveUS6373717B1High densityFacilitates subsequent depositionSemiconductor/solid-state device detailsPrinted circuit aspectsHigh densitySurface layer
An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered interconnect structure having a high density interconnect layer such as an allylated surface layer. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip. The electronic package further includes a dielectric material having an effective modulus to assure sufficient compliancy of the multi-layered interconnect structure during operation. The allylated surface layer has the property of being able to withstand thermal stresses that arise during thermal cycling operation of the electronic package.
Owner:ULTRATECH INT INC
Working medium for heat cycles, composition for heat-cycle systems, and heat-cycle system
ActiveCN106133110AReduce temperature gradientLower discharge temperatureCompressorCompression machines with non-reversible cycleEngineeringRefrigeration
Owner:AGC INC
Electrodeposited metallic materials comprising cobalt
ActiveUS20100304179A1Reduce resistanceEliminate security concernsPig casting plantsElectrolytic coatingsMetal coatingMetallic materials
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and / or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and / or patches comprising Co provide, enhance or restore strength, wear and / or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness Cr coated substrate. The fine-grained and / or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and / or in applications requiring anti-microbial and hydrophobic properties.
Owner:INTEGRAN TECH
Electrodeposited metallic-materials comprising cobalt
ActiveUS20100304182A1Reduce resistanceEliminate security concernsEnvelopes/bags making machineryRecord information storageParticulatesPorosity
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and / or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and / or patches comprising Co provide, enhance or restore strength, wear and / or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and / or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and / or in applications requiring anti-microbial properties.
Owner:INTEGRAN TECH
System and method for heating, cooling and heat cycling on microfluidic device
ActiveUS7648835B2Bioreactor/fermenter combinationsHeating or cooling apparatusThermoelectric coolingOn board
An integrated heat exchange system on a microfluidic card. According to one aspect of the invention, the portable microfluidic card has a heating, cooling and heat cycling system on-board such that the card can be used portably. The microfluidic card includes one or more reservoirs containing exothermic or endothermic material. Once the chemical process of the reservoir material is activated, the reservoir provides heat or cooling to specific locations of the microfluidic card. Multiple reservoirs may be included on a single card to provide varying temperatures. The assay chemicals can be moved to the various reservoirs to create a thermal cycle useful in many biological reactions, for example, Polymerase Chain Reaction (PCR) or rtPCR. According to another aspect of the invention, the integrated heat exchanger is an adjacent microfluidic circuit containing fluid that is either independently heated or cooled, or is an exothermic or endothermic material, such that the fluid in the adjacent circuit imparts a change in temperature to the assay fluid in an independent circuit. According to yet another aspect of the invention, a thermal electric cooler (TEC) is used for thermocycling the amplification chamber of a disposable microfluidic card.
Owner:PERKINELMER HEALTH SCIENCES INC
System and method for heating, cooling and heat cycling on microfluidic device
ActiveUS20090081771A1Bioreactor/fermenter combinationsBiological substance pretreatmentsThermoelectric coolingOn board
An integrated heat exchange system on a microfluidic card. According to one aspect of the invention, the portable microfluidic card has a heating, cooling and heat cycling system on-board such that the card can be used portably. The microfluidic card includes one or more reservoirs containing exothermic or endothermic material. Once the chemical process of the reservoir material is activated, the reservoir provides heat or cooling to specific locations of the microfluidic card. Multiple reservoirs may be included on a single card to provide varying temperatures. The assay chemicals can be moved to the various reservoirs to create a thermal cycle useful in many biological reactions, for example, Polymerase Chain Reaction (PCR) or rtPCR. According to another aspect of the invention, the integrated heat exchanger is an adjacent microfluidic circuit containing fluid that is either independently heated or cooled, or is an exothermic or endothermic material, such that the fluid in the adjacent circuit imparts a change in temperature to the assay fluid in an independent circuit. According to yet another aspect of the invention, a thermal electric cooler (TEC) is used for thermocycling the amplification chamber of a disposable microfluidic card.
Owner:PERKINELMER HEALTH SCIENCES INC
System and method for rapid thermal cycling
ActiveUS20080176289A1More rapid thermal cyclingImage enhancementBioreactor/fermenter combinationsEngineeringElectromagnetic radiation
At least one exemplary embodiment is directed to an apparatus that includes a microfluidic channel and at least one energy absorbing element, where the energy absorbing element is configured to absorb at least a portion of an incident electromagnetic radiation. The absorption of the radiation by the energy absorbing element varies the temperature of a sample in the microfluidic channel.
Owner:CANON US LIFE SCIENCES INC
Working medium for heat cycle, composition for heat cycle system, and heat cycle system
InactiveCN106414654AImprove stabilityInhibition of the effects of global warmingCompressorCompression machines with non-reversible cycleEngineeringDouble bond
Provided are: a working medium for a heat cycle, said working medium containing 1,2-difluoroethylene and exhibiting high stability, reduced environmental impact, and cycle performance that can replace that of R410A (a pseudo-azeotropic mixed refrigerant including difluoromethane and pentafluoroethane at a mass ratio of 1:1) and 1,1,1,2-tetrafluoroethane; a composition for heat cycle system, said composition using the medium; and a heat cycle system using the composition. The working medium for a heat cycle is characterized by the inclusion of 1,2-difluoroethylene and at least two types of hydrofluorocarbon selected from the group of hydrofluorocarbons that include a carbon-carbon double bond other than a saturated hydrofluorocarbon and 1,2-difluoroethylene.
Owner:ASAHI GLASS CO LTD
Working fluid for heat cycle, composition for heat cycle system, and heat cycle system
ActiveUS20160333243A1Stably used continuouslyCycle performance sufficientHeat-exchange elementsWorking fluidMetal working fluid
To provide a working fluid which has cycle performance sufficient as an alternative to R410A while the influence over global warming is sufficiently suppressed, which does not significantly increase the load to an apparatus as compared with a case where R410A is used, and which can be stably used continuously without any special measures, a composition for a heat cycle system comprising the working fluid, and a heat cycle system employing the composition.A working fluid for heat cycle, wherein the global warming potential is less than 300; the product of the relative coefficient of performance and the relative refrigerating capacity is at least 0.820 relative to R410A in a standard refrigerating cycle under conditions of an evaporation temperature of 0° C., a condensing temperature of 40° C., a supercoiling degree of 5° C. and a degree of superheat of 5° C.; the relative compressor discharge gas pressure is at most 1.100; the lower limit of the combustion range by method A in High Pressure Gas Safety Act is at least 5 vol %; and the pressure will not exceed 2.00 MPaG in a combustion test by method A in High Pressure Gas Safety act under 0.98 MPaG at 250° C.
Owner:ASAHI GLASS CO LTD
Working fluid for heat cycle, composition for heat cycle system, and heat cycle system
InactiveUS20170058173A1Improve stabilityCycle performance sufficientCompressorCompression machines with non-reversible cycleWorking fluidMetal working fluid
To provide a working fluid for heat cycle containing 1,2-difluoroethylene, which has high stability, and which has cycle performance sufficient as an alternative to R410A (a pseudoazeotropic mixture refrigerant of difluoromethane and pentafluoroethane in a mass ratio of 1:1) or 1,1,1,2-tetrafluoroethane while the influence over global warming is suppressed, a composition for a heat cycle system comprising it, and a heat cycle system employing the composition.A working fluid for heat cycle, which contains at least two members selected from a saturated hydrofluorocarbon and a hydrofluorocarbon having a carbon-carbon double bond other than 1,2-difluoroethylene, and 1,2-difluoroethylene.
Owner:ASAHI GLASS CO LTD
Working fluid for heat cycle
ActiveUS20160340565A1Less influenceImprove cycle performanceHeat-exchange elementsOzone layerWorking fluid
To provide a working fluid for heat cycle, which has less influence over the ozone layer and has less influence over global warming, and which has favorable cycle performance. A working fluid for heat cycle, which contains trifluoroethylene and difluoroethylene, wherein the proportion of the content of difluoroethylene is less than 1.5 mass % based on the working fluid.
Owner:ASAHI GLASS CO LTD
Chip package having chip extension and method
InactiveUS20060261467A1Improve cooling effectImproving chip coolingSemiconductor/solid-state device detailsPrinted electric component incorporationEngineeringThermal contact
A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.
Owner:GOOGLE LLC
Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
ActiveUS20070281176A1Cost-effective and convenient processIncrease stiffnessMaterial nanotechnologyRodsThermal dilatationMetal coating
Fine-grained (average grain size 1 nm to 1,000 nm) metallic coatings optionally containing solid particulates dispersed therein are disclosed. The fine-grained metallic materials are significantly harder and stronger than conventional coatings of the same chemical composition due to Hall-Petch strengthening and have low linear coefficients of thermal expansion (CTEs). The invention provides means for matching the CTE of the fine-grained metallic coating to the one of the substrate by adjusting the composition of the alloy and / or by varying the chemistry and volume fraction of particulates embedded in the coating. The fine-grained metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling. The low CTEs and the ability to match the CTEs of the fine-grained metallic coatings with the CTEs of the substrate minimize dimensional changes during thermal cycling and prevent premature failure.
Owner:INTEGRAN TECH
Composition for heat cycle system and heat cycle system
InactiveUS20170058174A1Low global warming potentialImprove cycle performanceCompressorCompression machines with non-reversible cycleWorking fluidHeat resistance
To provide a composition for a heat cycle system, which comprises a working fluid for heat cycle which has a low global warming potential and high stability, and which can replace R410A, and a heat cycle system employing the composition.A composition for a heat cycle system, which comprises a working fluid for heat cycle containing 1,2-difluoroethylene, and a stabilizer for preventing deterioration of the working fluid for heat cycle, such as an oxidation resistance-improving agent, a heat resistance-improving agent or a metal deactivator, and a heat cycle system employing the composition for a heat cycle system.
Owner:ASAHI GLASS CO LTD
Working medium and heat cycle system
ActiveUS20140077122A1Improve cycle performanceHigh proportion of halogenCompressorOrganic chemistryTransport systemOzone layer
To provide a working medium for heat cycle, of which combustibility is suppressed, which has less influence over the ozone layer, which has less influence over global warming and which provides a heat cycle system excellent in the cycle performance (efficiency and capacity), and a heat cycle system, of which the safety is secured, and which is excellent in the cycle performance (efficiency and capacity).A working medium for heat cycle comprising 1-chloro-2,3,3,3-tetrafluoropropene is employed for a heat cycle system (such as a Rankine cycle system, a heat pump cycle system, a refrigerating cycle system 10 or a heat transport system).
Owner:ASAHI GLASS CO LTD
Method for underground in-situ extraction of hydrocarbon compound in oil shale
The invention relates to a method for the underground in-situ extraction of a hydrocarbon compound in an oil shale, which comprises the following steps: arranging at least one working well and one production well in an enclosed working region where the hydrocarbon compound in the oil shale is extracted, communicating the bottoms among the working wells by directional drilling after a drilling well enters an oil shale ore layer, injecting water and inert gas water vapor into the working well to form a near-critical water microenvironment, cracking the oil shale into organic compounds with different chain lengths to form an oil-water mixture, lifting the oil-water mixture to the ground through the production well, and obtaining the hydrocarbon compound through an oil-water separating system. The heat utilization ratio is improved through a multi-well integrated heat circulating system, the extraction ratio of hydrocarbon substances is greatly improved through repeated oil-water separating and circulating processes, and the technical process is shortened. A water micro-pool is formed after an oil shale layer is overflowed by water, the cracking of the oil shale can be realized within3 to 5 hours after a near-critical state is reached, and more energy sources and time are saved than an underground dry distillation method.
Owner:JILIN UNIV
Composition for heat cycle system and heat cycle system
InactiveCN106414653AStable working mediumPromote circulationCompressorCompression machines with non-reversible cycleHeat resistanceProcess engineering
Owner:AGC INC
Working medium and heat cycle system
ActiveUS20140077123A1Promote decompositionLess influenceOrganic chemistryCompression machinesTransport systemHeat cycling
To provide a working medium for heat cycle which has less influence over the ozone layer, which has less influence over global warming and which provides a heat cycle system excellent in the cycle performance (the efficiency and the capacity), and a heat cycle system excellent in the cycle performance (the efficiency and the capacity). A working medium for heat cycle comprising 1,2-difluoroethylene is employed for a heat cycle system (such as a Rankine cycle system, a heat pump cycle system, a refrigerating cycle system 10 or a heat transport system).
Owner:ASAHI GLASS CO LTD
Durable tool for molding of polymer composites
ActiveUS20080241296A1High dimensional accuracyMore durableConfectioneryLaminationCarbon compositesFiber
Mold tooling formed of suitable iron-nickel alloys and provided with a hard electroless nickel coating on the mold cavity surface are useful for high volume production of carbon fiber reinforced, polymer matrix, composites. The iron and nickel alloy provides thermal expansion properties for the molding of dimensionally accurate parts. The nickel alloy coating provides a durable surface, without adversely affecting the expansion properties of the mold, and remains adherent to the base metal during the repeated thermal cycling encountered in high volume production of substantially identical molded carbon composite parts.
Owner:GM GLOBAL TECH OPERATIONS LLC
Electrodeposited metallic-materials comprising cobalt
InactiveUS20100304172A1Reduce resistanceEliminate security concernsEnvelopes/bags making machineryElectrolytic coatingsMetal coatingCobalt metal
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and / or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and / or patches comprising Co provide, enhance or restore strength, wear and / or lubricity of substrates without reducing the fatigue performance. The fine-grained and / or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and / or in applications requiring anti-microbial properties.
Owner:INTEGRAN TECH
Composition for heat cycle system, and heat cycle system
ActiveUS20160347980A1Low global warming potentialImprove cycle performanceEvaporators/condensersHeat-exchange elementsWorking fluidClimate change
To provide a composition for a heat cycle system comprising trifluoroethylene (HFO-1123), which has a low global warming potential and excellent cycle performance of HFO-1123 and which has high durability, and a heat cycle system employing the composition, which has less influence over global warming and has both high cycle performance and durability.A composition for a heat cycle system, which comprises a working fluid for heat cycle containing trifluoroethylene, and a radical scavenger, and a heat cycle system employing the composition for a heat cycle system.
Owner:ASAHI GLASS CO LTD
Color belt fuser warm-up time minimization
ActiveUS20090238597A1QuicklyPrevent rotationElectrographic process apparatusPrint mediaTemperature control mode
A belt fuser assembly for a color EP printer that quickly warms up the fusing belt before allowing a first sheet of print media to run through the printing stations at the fuser assembly. The warm-up cycle includes: (1) a preheat mode, (2) a first portion of a belt temperature warm-up mode, (3) a second portion of the belt temperature warm-up mode, and (4) a tight belt temperature control mode. The preheat mode operates the fuser's heater at less than full power, and prevents the fuser belt from rotating. The first portion of the belt temperature warm-up mode operates the heater at full power, and the fuser belt begins rotating, but not at its full speed. The second portion of the belt temperature warm-up mode operates the heater at less than full power, and the fuser belt begins rotating at its full speed.
Owner:LEXMARK INT INC
Working fluid for heat cycle, composition for heat cycle system, and heat cycle system
ActiveUS20160333244A1Less influencePractically sufficient cycle performanceHeat-exchange elementsWorking fluidMetal working fluid
To provide a working fluid for heat cycle having a low global warming potential and having high durability, which can replace R410A, a composition for a heat cycle system comprising it, and a heat cycle system employing the composition.A working fluid for heat cycle, which contains trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane, wherein the proportion of the total amount of trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane based on the entire amount of the working fluid is higher than 90 mass % and at most 100 mass %, and based on the total amount of trifluoroethylene, 2,3,3,3-tetrafluoropropene and difluoromethane, the proportion of trifluoroethylene is at least 10 mass % and less than 70 mass %, the proportion of 2,3,3,3-tetrafluoropropene is at most 50 mass %, and the proportion of difluoromethane is higher than 30 mass % and at most 75 mass %.
Owner:ASAHI GLASS CO LTD
Microtiter plate, method of manufacturing thereof and kit
InactiveUS20070212775A1Improve throughputNovel thermally stableBioreactor/fermenter combinationsAnalysis using chemical indicatorsMicrotiter plateEngineering
The invention relates to a vessel and kit for thermal cycling applications, a method for manufacturing such a vessel. The vessel comprises, in the form of a planar grid having a predefined pitch, a plurality of sample wells each having a well wall, which defines an open well end and a closed well end. According to the invention there are provided a plurality of ribs between pairs of adjacent wells, the ribs being connected to the walls of the wells and extending essentially in a plane perpendicular to the plane of the well grid. The invention enables manufacturing of dense microtiter plates, which are stable enough to be used in high temperature applications and allow for more efficient manufacturing of the plate.
Owner:FINNZYMES INSTR
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