The present application belongs to the technical field of
polymer-based
phase change heat-conducting
composite material, and particularly relates to a
phase change microcapsule heat-conducting
composite material, a preparation method and application thereof. The present application aims at the defects of existing
phase change composite material, such as heat-conducting filler agglomeration, poor interface compatibility, discontinuous heat-conducting network, and easy leakage of
phase change material. The surface of the phase change microcapsule is aminated by microfluidic technology, the heat-conducting filler is modified by
epoxy group, and the composite material is prepared by synergistic dispersion and dynamic force field
hot pressing. The aminated phase change microcapsule filling amount is 10-50wt% of the
mass of PDMS, and the modified heat-conducting filler addition amount is 5-10wt%. The material has excellent heat storage, heat conduction and mechanical flexibility, the
phase change enthalpy value can be up to 156J / g, and the heat
conductivity coefficient can be up to 2.5W / (mK), which can be applied to the fields of
flexible electronics, intelligent wear,
spacecraft thermal management and the like.