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578 results about "Surface stress" patented technology

Surface stress was first defined by Josiah Willard Gibbs (1839-1903) as the amount of the reversible work per unit area needed to elastically stretch a pre-existing surface. A suggestion is surface stress define as association with the amount of the reversible work per unit area needed to elastically stretch a pre-existing surface instead of up definition. A similar term called “surface free energy”, which represents the excess free energy per unit area needed to create a new surface, is easily confused with “surface stress”. Although surface stress and surface free energy of liquid–gas or liquid–liquid interface are the same, they are very different in solid–gas or solid–solid interface, which will be discussed in details later. Since both terms represent a force per unit length, they have been referred to as “surface tension”, which contributes further to the confusion in the literature.

Method and apparatus for monitoring integrated circuit fabrication

In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
Owner:ASML NETHERLANDS BV

Method and apparatus for monitoring integrated circuit fabrication

In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
Owner:ASML NETHERLANDS BV

Laser sonic surface wave stress test system

The invention discloses a laser acoustic surface wave stress test system, which is mainly comprises an ultrasound surface wave excitation part composed of a short-pulse laser, a spectroscope, a triple prism and a cylindrical convex lens, and an ultrasound surface wave detection part composed of a PVDF piezoelectric film and a high-frequency pre-amplifier. The invention uses the short-pulse laser to generate a high-frequency ultrasound surface wave on the surface of the samples to be tested, a stress value is obtained according to the principle of acoustic elasticity, the PVDF piezoelectric film is served as the receiver of the ultrasound surface wave, fast two-dimensional scanning is realized on the surface of the samples in the way that the PVDF piezoelectric film is fixed, the excitation source and the samples to be tested are in two-dimensional translation motion, the obtained ultrasound surface wave signals are transmitted to an electronic computer, and the measurement of the stress distribution on the surface and the sun-surface of the samples is realized through fast computing and processing by programming according to the principle of acoustic elasticity. The system has the advantages of simple structure and low cost, which can be widely used in the stress distribution measurement on the surface and the sun-surface of metal materials.
Owner:NANJING UNIV OF SCI & TECH

GaAs-based LED chip cutting method

The invention discloses a GaAs-based LED chip cutting method. The method comprises the following steps: (1) semi-cutting is carried out on a P surface, criss-cross cutting grooves are formed, and chip P surface electrodes are separated at equal intervals; (2) the chip P electrodes face a white film downwardly, N electrodes face upwardly and are attached to the white film; (3) chip N surface scribing is carried out along the cutting grooves formed by P surface semi-cutting, and chip N surface stress is relieved; (4) film inverting is carried out on the scribed chip, and the chip is transferred to a blue film from the white film; and (5) on the chip N surface, a bonding tool of a chip breaking machine is used for chip breaking along scratches, and the chip is processed into independent crystal grains. The improved surface mount method is used, a cutting method which combines advantages of a chip sawing machine and a laser chip scribing machine is adopted, the chip P surface stress and the N surface stress are relieved maximally, deformation stress effects caused by film laminating can be reduced and edge collapse and pipe core breaking phenomena after the chip is cut are reduced, and the appearance quality after the chip is cut is improved.
Owner:SHANDONG INSPUR HUAGUANG OPTOELECTRONICS

Direct forming manufacturing method of metal-based multilayer/gradient composite board and process unit of direct forming manufacturing method

The invention discloses a direct forming manufacturing method of a metal-based multilayer/gradient composite board and a process unit of the direct forming manufacturing method. Scale, corrosion materials and other impurities on the joint surface of a base board are removed through chemical cleaning, the cleaned surface is subjected to gradient power electromagnetic induction heating or laser bombardment surface treatment, all phases near the joint surface are fully dissolved, a solid solution is enhanced, toughness and corrosion resistance are improved, the surface stress of the board is eliminated, and surface laser treatment is conducted to improve the binding property of a composite layer; raw materials of the composite layer are added and injected through powder laying, a high-energy heat source is adopted for irradiation or induction heating to melt powder, metallurgical bonding is formed between the composite layer and a base, and control over the final shape of a cold/hot-rolled board is conducted. The obtained multilayer/gradient composite board is compact in surface structure, bonding between the composite layer and the base and between layers is good, and the interlayer bonding performance of the composite board is remarkably improved. The process is high in flexibility, and the production period of the metal-based composite board can be greatly shortened after the process is combined with an existing continuous casting technology.
Owner:SHANGHAI UNIV

Martensitic stainless steel wire rod and production method thereof

The invention relates to a martensitic stainless steel wire rod and a production method thereof. The martensitic stainless steel wire rod is prepared from the following chemical components in weight percent: 0.30-0.65% of carbon, 0.20-0.50% of silicon, less than or equal to 0.60% of manganese, less than or equal to 0.30% of nickel, 11.50-17.00% of chromium, 0.20-0.50% of molybdenum, less than or equal to 0.25% of copper, less than or equal to 0.030% of sulfur, less than or equal to 0.040% of phosphorus, 0.02-0.20% of nitrogen, and the balance being ferrum and unavoidable impurities. The martensitic stainless steel wire rod which is excellent in surface, steady in performance and uniform in texture can be obtained by adopting the steps of smelting, casting, rolling, online hot charging annealing, salt bath, pickling, finishing to finished product inspecting and packaging, and the martensitic stainless steel wire rod has tensile strength of more than 600MPa, yield strength of more than 300MPa, elongation of more than 25%, percentage reduction of area of more than 50% and qualified product ratio of more than 85%. According to the invention, the comprehensive utilization performance of steel is improved, and the problem that surface stress cracking is easy to cause in annealing of high-carbon martensitic stainless steel in the prior art is solved on the basis of not increasing the smelting and rolling cost.
Owner:宝钢特钢有限公司

Multi-laser polishing and reinforcing method for surfaces of additive manufacturing metal parts

InactiveCN104109860AAchieving Surface Quality Polishing IssuesQuick polishSurface stressLaser scanning
The invention discloses a multi-laser polishing and reinforcing method for surfaces of additive manufacturing metal parts, and the polishing on the surfaces of the additive manufacturing metal parts can be realized by repeatedly scanning and processing the surfaces of the additive manufacturing metal parts through utilizing millisecond pulse laser and nanosecond pulse laser; during the multi-laser scanning polishing process, the additive manufacturing metal parts are subjected to thermal preservation treatment, so that the stress on the surfaces of the additive manufacturing metal parts can be evenly distributed; laser scanning reinforcement is carried out on the surfaces of the laser-polished additive manufacturing metal parts, so that the stress state on the surfaces of the additive manufacturing metal parts can be changed into pressure stress from tensile stress, the anti-fatigue property of the additive manufacturing metal parts can be enhanced, and the usage performance of the metal parts can be met; compared with a manual polishing method, the multi-laser polishing and reinforcement efficiency of the additive manufacturing metal parts is high and is as 20 times as that of the manual polishing, the non-contact rapid polishing of the additive manufacturing metal parts can be realized, the tensile stress, caused by the laser polishing, of the additive manufacturing metal parts can be eliminated, and the anti-fatigue property of the additive manufacturing metal parts can be enhanced.
Owner:XI AN JIAOTONG UNIV

Inner surface stress and temperature monitoring method of internal combustion engine main bearing based on fiber bragg grating

ActiveCN103411550ASimultaneously monitor temperatureSimultaneous monitoring of strain changesThermometers using physical/chemical changesUsing optical meansFiberGrating
The invention provides an inner surface stress and temperature monitoring method of an internal combustion engine main bearing based on a fiber bragg grating. Fiber bragg grating strain sensors and fiber bragg grating temperature sensors for temperature compensation are respectively arranged on an internal surface of a to-be-tested main bearing so as to obtain strain changes of a bearing working surface; the fiber bragg grating strain sensors are arranged at all directions of the inner surface of a bearing so as to obtain the strain changes of the bearing at each direction; an engine oil temperature sensor is arranged in a waste engine oil pipe of the internal combustion engine so as to obtain engine oil temperature data; a fiber Bragg grating demodulation instrument is used to obtain center wavelength changes of the engine oil temperature sensor, and to convert the center wavelength changes into electrical signals; and engine oil temperature changes when the internal combustion engine works can be calculated. With the use of characteristics that the fiber bragg grating can simultaneously measure the strain and temperature and is small-sized and one-line-multi-point, the inner surface stress and temperature monitoring method of the internal combustion engine main bearing based on the fiber bragg grating can simultaneously monitor the temperature and strain distribution of the main bearing working when the internal combustion engine works, so as to provide accurate data to support optimization of the structural design of the internal combustion engine main bearing.
Owner:WUHAN UNIV OF TECH

Non-contact ground stress testing device and method based on drilling microscopy digital photography

ActiveCN104807563ANot subject to stickinessAdaptableForce measurementGyroscopeTest fixture
The invention relates to a non-contact ground stress testing device and method based on drilling microscopy digital photography and belongs to ground stress measuring device and method of geotechnical engineering. The device comprises an electronic microscopy camera, a signal processing and control module, a signal transmission module, a gyroscope, a signal collecting module, a portable power source and a device shell. The method includes: fixing the testing device in a device mounting hole, using the electronic microscopy camera to collect the hole wall digital images of the hole during a whole stress relieving process, selecting the representative images before and after the stress relieving, acquiring sub-pixel images through image interpolation, optimizing sub-pixel image analyzing areas and points, setting analyzing traces, calculating to obtain strain values, and calculating the ground stress values and the azimuth angles thereof by the hole partial wall surface stress relieving method theory. The non-contact ground stress testing device and method has the advantages that simple operation and high adaptability are achieved, testing precision can reach one micro strain, strain measuring mark points and analyzing traces are optimized, influence of temperature, rock viscosity and electromagnetic interference is avoided, a probe can be reused, and low cost is achieved.
Owner:CHINA UNIV OF MINING & TECH

Method for preparing Ni cementing WC base cemented carbide

InactiveCN101397614AContact rate controlImprove solubilitySolubilitySurface stress
The invention disclose a method for preparing a hard alloy by bonding WC group with Ni, which is characterized by comprising the steps that: firstly, the mixing powder of WC and Ni is subjected to wet grinding, drying and pressing in absolute ethyl alcohol, and then subjected to vacuum sintering at the temperature of 1440 DEG C to 1480 DEG C; when the sintering is finished, nitrogen is introduced to a furnace simultaneously for carrying out vacuum quenching, the pressure of the nitrogen is 0.1MPa to 0.4MPa, and the quenching time is 5min to 10min; after tapping, deep cooling treatment is carried out in liquid nitrogen, the treatment temperature is 150 DEG C to 196 DEG C, and the heat-preservation time is: the hard alloy weight multiplied by weight factor plus the Ni percent content of the hard alloy weight multiplied by component factor, wherein, the weight factor is 5min/g to 25min/g and the component factor is 10min to 20 min; and drawing temper is carried out in a vacuum furnace at the temperature of 120 DEG C to 200 DEG C, the temperature-preservation time is 1h to 3h. By adopting the method for preparing the hard alloy by bonding the WC group with Ni, the contact ratio of the WC can be controlled, the solubility of the WC in Ni is improved, furthermore, the surface stress condition of the alloy after treatment is compressive stress which improves the shock resistance capability of the alloy, thus being capable of realizing the substitution of Ni to Co and obtaining the performances corresponding to WC-Co series hard alloys.
Owner:SICHUAN UNIV
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