A processing for filling resin in a blind groove of a printed circuit board (PCB) is used for filling resin ink in the blind groove of the PCB. The process comprises the following steps of mesh installation, base plate installation, plate loading, pre-setting, ink addition, alignment film pasting on the PCB, silk-screening to remove air bubbles, blind groove filling, plate baking and resin grinding, wherein during the silk-screening process of the step (7), a double-cutter silk-screening mode is adopted, scrape screening is carried out for 5-8 times, and air in the ink is removed; in the step of (8), the blind groove is filled with the resin from one surface of the blind groove by a silk-screening mode, and during silk-screening process, the double-cutter silk-screening mode is adopted and scrape screening is carried out for one time. During the whole fabrication process, a silk-screening air bubble removal process is introduced, scrape screening is carried out for many times, and air bubbles in the ink are removed; the air bubbles are removed before blind hole filling, thus, the problem that filling is not enough caused by insufficient oil feeding quantity after the blind groove is filled with the resin is prevented; and moreover, the groove is fully filled with the resin ink after the blind groove is filled with the resin, no air bubble is generated in the resin ink at the bottom of the groove after the blind groove is filled with the resin, and the product quality is improved.