475 results about "Stress effects" patented technology

The invention discloses an indoor grouting testing device under simulation of a complex stress effect and a testing method thereof. According to the invention, a rock-soil sample is wrapped with a rubber membrane, and is provided with an upper permeable stone and a lower permeable stone on the upper surface and the lower surface thereof respectively; the upper permeable stone and the lower permeable stone are arranged in a closed surrounding pressure room; the upper permeable stone is provided with a pressurization plug; the pressurization plug is connected to an axial pressurization device through a force transfer rod; a surrounding pressure pipe is communicated with the surrounding pressure room, and the outer end of the surrounding pressure pipe is connected with a surrounding pressure system; a counter pressure pipe is connected with the upper permeable stone, and the outer end of the counter pressure pipe is connected with a counter pressure system; and a grouting filter pipe, placed in the axes of the rock-soil sample, is connected with equipment, such as a grouting pump, a slurry barrel and the like through grouting pipes. Through truly simulating the coupling effect between deep complex stress and underground water pressure, the slurry dispersion radius in rock-soil body grouting and the function relationship between the osmotic coefficient value of a grouted stone body and the related parameter are obtained. The device and the method shorten the time needed by tests, and achieve effects of convenience, reliability and accuracy.

A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.