182 results about "Electronic microscopy" patented technology

The invention relates to a transmission electron microscope low-temperature sample rod using a flexible structure to transfer heat. The transmission electron microscope low-temperature sample rod comprises a liquid nitrogen Dewar tank; the sample rod comprises a sample rod body with a front-back through hollow cavity, a heat conduction rod and a flexible heat transfer rope, one end of the heat conduction rod extends into the liquid nitrogen Dewar tank, the other end of the heat conduction rod extends into the sample rod body, one end of the flexible heat transfer rope is wound and fixed on the heat conduction rod, and the other end of the flexible heat transfer rope is wound and fixed on the sample rod body. The other end of the sample rod extends to the outer end of the sample rod body; the sample rod head comprises a sample rod fixing outer frame and a sample rod temperature control part, the sample rod fixing outer frame is connected with the outer end of the sample rod body, the sample rod temperature control part is arranged on the sample rod fixing outer frame, the sample rod temperature control part is connected with the flexible heat transfer rope, and a heating element capable of heating a sample to be tested is further arranged on the sample rod temperature control part. Compared with the prior art, efficient heat conduction can be achieved, meanwhile, the thermal stress influence is reduced, and the temperature stability and the sample position stability are improved.

The invention discloses an in-situ TEM (Transmission Electron Microscope) device sample preparation method based on a suspended thinning and parallel carrying technology, which can be used for preparing in-situ TEM samples of semiconductor two-end devices and three-end devices, and mainly solves the problems of unstable ohm contact, nonuniform thinning, low success rate and high time cost in the prior art. According to the invention, an FIB sample preparation technology is adopted, and stable and reliable ohmic contact between a sample electrode and an MEMS chip electrode is ensured through specific-angle sample extraction, suspended thinning, parallel carrying, circuit breaking treatment and an accurate electrode welding process. According to the sample prepared by the invention, the failure state of a device can be observed in real time under a transmission electron microscope, the sample has the advantages of high sample preparation success rate, good repeatability, stable electrical parameters and wide applicable chip variety, and the reliability and repeatability of in-situ TEM test data are remarkably improved.

The invention provides a contour measurement method, electronic equipment and a storage medium. The method comprises the following steps: acquiring a standard image, a contour of the standard image and an SEM image of a to-be-measured product acquired by a critical dimension scanning electron microscope CD-SEM; adopting a target physical threshold model to extract a target contour of the SEM image; and determining a target edge placement error between the contour of the standard image and the target contour of the SEM image, and generating and outputting a contour measurement result of the to-be-measured product according to the target edge placement error, so as to improve the precision of contour extraction and the accuracy and efficiency of contour measurement.

The invention discloses an image processing method and device, a medium and a computer program product, and relates to the technical field of semiconductor manufacturing. The image processing method comprises the following steps: acquiring target image samples of a plurality of wafer samples through a scanning electron microscope, and obtaining a first contour image label of each target image sample; based on the target image sample, a first contour image result is generated through a generator of a preset image edge model, iteration training is carried out on the preset image edge model through pixel difference loss, adversarial loss and edge supervision loss until a convergence condition is met, and a target image edge model is obtained; the generator of the target image edge model can output an edge contour image based on the target image of the target wafer. Through multi-dimensional constraints of pixel difference loss, edge supervision loss and adversarial loss, the preset image edge model is trained in the direction of generating an actual edge contour, and the accuracy of the edge contour image is improved.

The invention provides a fuzzy knowledge graph construction method related to a wafer manufacturing process, and relates to the technical field of fuzzy knowledge graphs, and the method comprises the steps: employing a three-dimensional convolutional network to extract a spatial defect feature X of a scanning electron microscope image, carrying out the coding of sensor time series data through a bidirectional LSTM, and obtaining a feature set Y, obtaining electrical performance parameters of the wafer based on impedance spectroscopy analysis from the text to obtain a feature set Z; building fuzzy knowledge based on the text to reinforce the feature sets X, Y and Z, building a fuzzy feature set and a time sequence feature set, building a weighted scoring model, and screening a candidate set from the text according to the weighted scoring model; information is extracted from the candidate set, and a tetrad structure G = (entities, relationships, time attributes and fuzzy rules) is constructed; and taking G as input, generating a time sequence fuzzy rule through a recursive reconstruction contribution method, and incrementally updating the knowledge graph. According to the method, the characterization bottleneck of space-time coupling and uncertainty correlation in a traditional method is broken through.

Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

A method includes extracting first feature data by applying a backbone network of a machine learning model to a layout image representing a design for a target pattern, applying a hotspot segmentation network of the machine learning model to the first feature data, the hotspot segmentation network configured to generate a hotspot map representing a hotspot area of the layout image corresponding to a fault, obtaining, from the hotspot segmentation network, second feature data, and generating a scanning electron microscope (SEM) image of a wafer by applying an SEM image generation network of the machine learning model to the first feature data and the second feature data.

Provided are a scintillator and the like capable of improving emission intensity. A scintillator (S) comprises a sapphire substrate (6), a GaN layer (4) that is provided on the incident side to the sapphire substrate (6) and includes GaN, a quantum well structure (3) provided on the incident side to the GaN layer (4), and a conductive layer (2) provided on the incident side to the quantum well structure (3), wherein a plurality of emitting layers (21) including InGaN and a plurality of barrier layers (22) including GaN are alternatively stacked in the quantum well structure (3), and an oxygen-containing layer (23) including oxygen is provided between the quantum well structure (3) and the conductive layer (2).

The invention discloses a method for measuring the thickness of a semiconductor epitaxial structure, and relates to the technical field of semiconductor laser detection. According to the method, a clean, flat and pollution-free epitaxial end face is obtained through scribing cleavage or cutting or fracture treatment, the end face is corroded by adopting components containing acid, oxide and the like, and due to the fact that the components or doping concentrations of epitaxial layers are different, the rates of chemical reactions between the epitaxial layers and a mixed solution are different; finally, the end face of the epitaxial layer corroded by the mixed solution is in a stepped shape under a scanning electron microscope, and the boundary of each epitaxial layer can be obviously distinguished through the shape, so that the thickness of each epitaxial layer is accurately measured, the problems of complicated operation, high cost, low efficiency and insufficient structural analysis capability in the prior art are solved, and the measurement accuracy is improved. And an efficient and accurate solution is provided for measuring the thickness of the epitaxial layer.

The embodiment of the present disclosure discloses a bearing assembly for testing sample and an electron microscope system, the bearing assembly comprises: a main body; a contact part for supporting the testing sample and connected to the main body; the contact part comprises a plurality of recesses recessed towards the main body, the recesses are used for accommodating the testing sample; the recesses comprise a plurality of abutting surfaces; wherein at least two of the abutting surfaces are used for supporting the testing sample; and adjacent two of the abutting surfaces are connected and form an included angle.

This invention relates to the field of battery technology and discloses a method for forming an SEI film in a battery, comprising the following steps: Step 1, surface pretreatment; Step 2, initial linear scanning; Step 3, SEI film reforming; Step 4, final linear scanning; Step 5, real-time monitoring; and Step 6, real-time adjustment. This invention ensures uniform SEI film formation on the electrode surface through a series of precise steps and technical measures during the SEI film formation process in the battery. A multi-segment scanning strategy is employed for the initial linear scanning, gradually increasing the voltage and performing multiple scans to effectively control the initial formation and uniformity of the SEI film. Quality inspection is performed using a scanning electron microscope (SEM), and feedback adjustments are made based on the inspection results to further ensure uniform SEI film formation and high performance. This achieves the beneficial effect of improving SEI film uniformity and ensuring uniform formation of the SEI film in different regions.

The polymer particle group containing polyorganosiloxane involved in this invention comprises a polymer (A) containing polyorganosiloxane (A1) and a first vinyl polymer (A2) and a second vinyl polymer (B). When the cross-section of a resin sheet obtained by dispersing the polymer particle group containing polyorganosiloxane in a resin is observed with a transmission electron microscope, the diameter of each particle of the polymer particle group containing polyorganosiloxane is set to L, and the maximum length of the polyorganosiloxane (A1) region is set to M. The ratio of the number of particles satisfying the following formula (1) is less than 60%. M / L>0.1···(1).

The present invention includes a positive electrode active material for a secondary battery, comprising a composite metal hydroxide precursor represented by Chemical Formula (1) below: wherein the precursor includes a secondary particle composed of a plurality of primary particles; wherein each primary particle is formed as a bundle of micro primary particles; wherein, when observed via a transmission electron microscope, the major axis direction of the micro primary particles coincides with the major axis direction of the primary particles; and wherein each micro primary particle has a thickness of about 1 nm to about 50 nm.

The invention discloses a method and device for checking chip sorting accuracy, electronic equipment and a storage medium, and belongs to the technical field of semiconductors, and the method comprises the steps: building a checking model which is equal to a wafer object in proportion according to the actual sizes of wafers and chips and the distance between the chips; reading CP data of the chip; displaying the position of each chip in the test model according to the chip coordinate information, and displaying a Bin Code character at the corresponding coordinate position according to the chip Bin Code; setting visual parameters of the inspection model, wherein the visual parameters comprise configuration of different display colors according to Bin Code types and setting of transparency of the inspection model; a wafer object image is obtained through an electron microscope, and the lens magnification of the electron microscope is adjusted, so that the wafer object image and the inspection model have the same size; and carrying out overlapping comparison on the adjusted wafer object image and the inspection model, and inspecting the accuracy of chip sorting through a comparison result. The technical effects that the efficiency can be improved, the cost is reduced, and errors are not prone to occurring are achieved.

A system to perform image processing and segmentation includes a memory configured to store an image of a nanoparticle. The system also includes a processor operatively coupled to the memory. The processor is configured to identify a background of the image, where the background includes one or more portions of the image that do not depict the nanoparticle. The processor removes the background from the image with a mask. The processor applies clustering to the image to identify regions of interest in the image. The processor also identifies acquisition boxes in each of the identified regions of interest.

This invention provides solid substrates for promoting cell or tissue growth or restored function, which solid substrate is characterized by a specific fluid uptake capacity value of at least 75%, which specific fluid uptake capacity value is determined by establishing a spontaneous fluid uptake value divided by a total fluid uptake value. This invention also provides solid substrates for promoting cell or tissue growth or restored function, which solid substrate is characterized by having a contact angle value of less than 60 degrees, when in contact with a fluid. This invention also provides solid substrates for promoting cell or tissue growth or restored function, which said substrate is characterized by a substantial surface roughness (Ra) as measured by scanning electron microscopy or atomic force microscopy. The invention also provides for processes for selection of an optimized coral-based solid substrate for promoting cell or tissue growth or restored function and applications of the same.

The invention relates to a preparation and performance optimization method of a heat-conducting silica gel film based on aluminum nitride filler in the technical field of new materials, which comprises the following steps: acquiring an aluminum nitride filler particle image through a scanning electron microscope, and extracting particle size and shape characteristics from the image to obtain initial particle size distribution data; according to the initial particle size distribution data, a particle simulation algorithm is adopted to calculate the distribution mode of the filler in a silica gel matrix, and the position of a potential agglomeration area is determined; acquiring an image of a contact interface between the modified particle sample and a silica gel substrate, and judging an interface bonding strength index; simulating a heat transfer path between the modified particles and a matrix through an interface optimization algorithm to obtain optimized interface bonding parameters; adjusting a filler mixing ratio and stirring conditions according to the optimized interface bonding parameters; integrating the final performance data and the initial particle size distribution data by adopting a data fusion method, and judging a long-term reliability index; and processing the long-term reliability index through iterative circulation to obtain stable heat conduction efficiency configuration.

The application discloses a digital rock reconstruction method and device, equipment and medium, and relates to the field of digital rock reconstruction, and comprises the following steps: extracting micro-texture features in two-dimensional scanning electron microscope image data to obtain corresponding texture feature vectors, and performing integration processing on the texture feature vectors to obtain target texture feature vectors; extracting structural feature information from three-dimensional computer tomography image data, splicing the target texture feature vectors and target noise, and mapping the spliced vectors into target style vectors; fusing the structural feature information and the target style vectors to obtain a three-dimensional feature map, capturing geometric feature responses corresponding to local geometric structures of rocks in the three-dimensional feature map, and generating spatial modulation weights matched with the local geometric structures of the rocks; performing voxel-by-voxel weighted modulation on the three-dimensional feature map according to the spatial modulation weights to obtain a target feature map, and generating target three-dimensional digital rock body data based on the target feature map.

The invention provides a method for efficiently extracting mitochondrial derived vesicles. The extracted mitochondria is further purified, an environment close to a physiological state is established, the mitochondria is subjected to a budding reaction, in-vitro reconstruction of the mitochondria-derived vesicles is carried out, and the mitochondria-derived vesicles are purified by adopting a discontinuous sucrose gradient flotation method. Through a transmission electron microscope and a nano-particle tracking analysis technology, the extracted mitochondrial derived vesicles are few in impurity and large in quantity.

According to the present disclosure, a novel system or method for electron beam imaging or electron beam spectroscopy is provided, the system includes a transmission electron microscope (TEM) including an electron source configured to provide an electron beam, at least one laser-based device configured to provide at least one laser beam, the laser beam being configured to shift a predetermined portion of the electron beam to an energy spectrum different from the original energy spectrum provided by the electron source, and an electron energy filter configured to pass the electron beam having the original energy spectrum but not pass the electron beam having the energy spectrum different from the original energy spectrum.

Provided is an anti-reflection member having excellent scratch resistance. An anti-reflection member having a low refractive index layer on a substrate, in which the low refractive index layer contains a binder component, hollow particles, and solid particles, as the solid particles, solid particles [alpha] having a particle diameter exceeding the average particle diameter of the hollow particles, the number of the solid particles (alpha) per 1 [mu] m in the width direction of the low refractive index layer is 0.7-8.0 on average in an image obtained by capturing a vertical cross section of the anti-reflection member using a scanning transmission electron microscope.

Herein is reported a method for determining the amount or / and ratio of filled recombinant virus particles, such as recombinant adeno-associated virus particles (rAAVps), compared to empty and partially filled viral particles in a sample using transmission electron microscopy (TEM) with an EM grid without chemical staining, wherein the method comprises the step of drying the sample, preferably air-drying the sample, on the EM grid.

Positive electrode active material particles according to an aspect of the present invention comprise a bulk region and a coating region, the coating region containing cobalt (Co), wherein on a scanning electron microscope (SEM) image of one surface of the positive electrode active material particles, the ratio of the coating area of the coating region to the total area of the one surface may be 83% to 96%.

The present application provides a laminate with high yield strength. The laminate, which is a laminate comprising a resin film, and a metal layer provided on at least one face of the resin film, has a skewness Psk of 0.05 or more in a cross-sectional image of the laminate in the thickness direction, obtained by a scanning electron microscope, from a cross-sectional curve of the interface between the resin film and the metal layer.

Described herein are machine learning based systems, methods, and non-transitory computer readable media for determining three-dimensional (3D) information of structures of a patterned substrate. The 3D information can be determined using a neural network to convert a two-dimensional image to a 3D image. In a method, the neural network is trained by supplying varying parameters to simulated images of a sample to model a real manufactured IC structure. The trained network generates a depth map from a newly supplied image of the sample to predict defect locations. The depth map can be converted to a binary map to predict defect size and location, which can be used to guide inspection of the sample using an inspection tool.

A method of analyzing a rock sample includes segmenting a digital image volume corresponding to an image of the rock sample to associate voxels in the digital image volume with a plurality of rock fabrics of the rock sample. The method also includes identifying a set of digital planes that intersect each of the plurality of rock fabrics. The method also includes mechanically machining the rock sample to expose a physical plane corresponding to the identified digital planes, performing scanning electron microscope (SEM) imaging of the physical plane to generate a two-dimensional (2D) SEM image of the physical plane, and performing image processing on the SEM image to determine a material property associated with each of the rock fabrics.

A process for predicting and adjusting particle removal efficiency of fiber-based filter media based on quantification of disorder. An order parameter may be extracted through Raman spectroscopy or scanning electron microscopy. Production processes may be adjusted to change (e.g., increase) the particle removal efficiency of fiber-based filter media utilizing a predefined correlation between order parameter and particle removal efficiency. The filter media may be utilized in masks, filters, and other applications.

A scientific instrument, such as an electron microscope, is disclosed, and the scientific instrument includes a movable stage with a sample holder. A finger-shaped cryostat contacts a heat sink and includes a cooling plate configured to contact the sample holder to cool the sample holder in a rapid cooling position. A flexible heat-conducting component thermally connects the sample holder and the finger-shaped cryostat to cool the sample holder away from the rapid cooling position, where the sample can be studied, imaged, etc. In the disclosed embodiments, both the cryostat and the sample holder are movable, or only the finger-shaped cryostat moves between the rapid cooling configuration and other configurations. A corresponding method for operating the scientific instrument is also disclosed. This disclosure advantageously combines rapid cooling in the rapid cooling position with reduced restrictions on movement of the sample holder away from its parking position.

This invention relates to the field of image processing technology, and more specifically, to an intelligent contour analysis method for benzimidazolone pigment particles based on a graph search algorithm. The method includes: acquiring a grayscale image using an electron microscope and performing binarization segmentation; constructing a particle distance map based on Euclidean distance transformation; analyzing the curvature features of pixels in the particle distance map using the Hessian matrix to obtain the probability that a pixel in the particle distance map belongs to the core skeleton of the particle; extracting contour depression points based on the closed contour of the particle region; calculating the adhesion penalty intensity of each pixel in the particle distance map; accurately locating seed points by combining the skeleton probability and penalty intensity; and achieving precise cutting of adhered particles by constructing a graph model containing specific edge weights, using the seed points and background as constraints. This invention solves the problem of over-segmentation or under-segmentation caused by severe adhesion of pigment particles, improving the accuracy of contour recognition.