169 results about "Laser polishing" patented technology

The invention relates to the technical field of optical engineering, in particular to an AI silicon carbide lens-oriented aspheric laser polishing precision online detection and feedback system. Comprising a detection module; the data processing module is electrically connected with the detection module and used for constructing a lens surface three-dimensional model and calculating polishing precision parameters; the feedback control module is electrically connected with the data processing module, is used for generating a feedback control strategy and comprises a strategy generation unit and a parameter optimization unit; an execution module; and an intelligent learning module. According to the design, a laser measuring head, an energy sensor array and an environment sensor are integrated through the detection module, synchronous acquisition of multi-dimensional data such as surface profile, laser energy distribution and environment parameters is realized, and three-dimensional point cloud data with consistent time and space are generated through multi-modal fusion processing (time domain synchronization, space registration and feature enhancement) of the data preprocessing unit; the physical essence of the polishing process is completely represented, and the detection comprehensiveness and the data relevance are improved.

A glassy electroactive prepreg made by generating submicron particles of lithium-ion conducting sulfide glass by providing lithium-ion conducting sulfide glass feedstock material, and subjecting the feedstock material to subzero processing to transform the material into submicron particles can avoid plastic deformation of sulfide glass particles during grinding and produce submicron powders. The prepreg is formed by providing a porous electroactive layer comprising electroactive material, and infiltrating the porous electroactive layer with the submicron particles of lithium-ion conducting sulfide glass. The subzero processing can include cryogenic processing. The prepreg can be used to form glassy embedded electrodes.

The present invention discloses an optimization polishing method and system for nonferrous metal alloy die castings, which relates to the technical field of optimization polishing of alloy die castings, and includes the following steps: the laser polishing equipment first performs surface treatment on the zinc-aluminum alloy die castings at an initial scanning speed, and at the same time, the visual inspection system obtains the defect data on the surface of the casting in real time, dynamically tracks the surface changes of the casting, and provides accurate input for intelligent evaluation. The present invention combines the laser polishing equipment and the visual inspection system to identify the surface defects of the casting in real time and dynamically adjust the laser scanning speed and power, thereby solving the problem of uneven surface caused by fixed scanning speed. The system intelligently evaluates the severity of defects, ensures that the laser energy acts evenly on the surface, avoids overheating or insufficient treatment, improves the surface finish and appearance quality of the casting, reduces surface damage and material waste, and thus improves production efficiency and product performance.

The invention provides a device and a method for polishing and repairing a blisk of an aero-engine by using composite laser aiming at the common problems of cracks and surface roughness in the machining process of the blisk of the aero-engine, and the device comprises a five-axis moving platform system, a 1064nm infrared laser generator system and an optical ranging system; according to the method, a six-axis composite laser polishing and repairing device is utilized, a high-precision multi-wavelength and multi-frequency-band laser scanning device is carried, continuous polishing and repairing serve as a main body, and a five-axis moving platform system, a 1064nm infrared laser generator system, an optical distance measuring device and an ultrasonic scanning and surface analysis technology are combined. Honeycomb-shaped cracks left on the surface of the blade of the blade disc through milling are successfully repaired, and the surface quality of the blade disc is remarkably improved. According to the device and method, the repairing effect is excellent, the polishing efficiency is remarkably improved, and the time needed by traditional manual polishing can be greatly shortened. In addition, the surface roughness of the bladed disc repaired through the composite laser polishing repairing method is remarkably reduced, and the influence on the flowing property of working fluid is effectively controlled. Therefore, the method has important engineering application prospects and is expected to bring remarkable method progress and economic benefits in the field of aero-engine manufacturing.

The invention discloses a fused quartz high-precision surface laser double-sided polishing method, and belongs to the technical field of optical element laser processing. In order to solve the problem of surface shape distortion of the fused quartz element under the existing laser polishing process, the method comprises the following steps: firstly, ultrasonically cleaning the fused quartz element and blow-drying the fused quartz element by using compressed air; the morphology distribution of the fused quartz after laser polishing is simulated through finite element simulation, and the scanning speed is optimized; polishing the target surface according to the process parameters and the processing path after the scanning speed is optimized; the internal temperature distribution of the fused quartz after laser polishing is obtained through finite element simulation, and the polishing power of elements with different thicknesses is optimized; the back face of the target face is polished through the optimized laser power; and after laser polishing, carrying out ultrasonic cleaning and drying again. The method is simple in process and low in cost, the surface shape quality can be remarkably improved, the roughness is reduced, the time cost consumed by a parameter cross experiment is avoided, and optimization of laser polishing parameters is efficiently achieved.

The embodiment of the invention provides a system and method for laser processing of a carbon-based chip, and the system comprises a multi-wavelength laser emission module which is used for emitting laser beams suitable for carbon-based chips with different crystal structures according to laser parameters; the intelligent control device is used for dynamically adjusting laser parameters according to thermal and optical characteristics of the carbon-based chip based on a processing strategy and sending the laser parameters to the multi-wavelength laser emission module; the self-adaptive machine learning module is used for optimizing a processing strategy according to the monitoring data and the processing characteristics of the carbon-based chip and sending an optimization result to the intelligent control device; the micro-nano laser polishing device is used for treating the surface of the carbon-based chip; the cutting mechanism is used for carrying out hidden cutting on the carbon-based chip; and the multi-mode sensing and analyzing system is used for monitoring the structural integrity of the carbon-based chip in the processing process and sending monitoring data to the self-adaptive machine learning module.

The invention relates to the field of ultra-precision polishing, in particular to an in-situ laser polishing system for a diamond turning metal surface. Comprising a turning tool servo shaft, a laser polishing assembly and a controller, a laser emitting part is arranged on the turning tool servo shaft, and the controller is used for controlling polishing laser emitted by the laser emitting part to move and scan on the surface of a turned workpiece in the direction perpendicular to the turning path. The distance between two adjacent scanning paths is smaller than the diameter of the Gaussian beam. According to the invention, the laser polishing system is integrated on the ultra-precision machine tool, so that the turning and polishing processes of the workpiece can be completed under the same clamping, and secondary clamping and repositioning, introduced scratches and clamping errors are avoided. And meanwhile, the surface of the workpiece is heated through the out-of-focus light spots, so that the material in the area is in a flowable state after being heated, and under the action of gravity or self-tension, the material at the high position moves to the low position, so that the self-leveling effect is achieved, and the surface roughness is reduced.

The invention provides a laser polishing device combining gas protection and substrate heat dissipation and a using method. The device comprises a focus lens (1), a laser beam (2), a to-be-polished sample piece (3), a gas nozzle (4), a gas pipe (5), a high-pressure gas cylinder (6), a dust collector (7), a cooling liquid level (8), a metal substrate (9), an objective table (10), a water tank (11) and a laser (12). The invention further relates to a using method of the device. A micro-nano coarse structure is formed on the surface of the metal substrate through chemical etching, electrochemical etching or laser etching and the like, then a hydrophilic oxide layer is introduced through oxidation treatment or plasma treatment, and the super-hydrophilic performance of the metal substrate is further enhanced. The device has excellent liquid cooling capacity, gas protection performance and oxidation resistance, heat can be efficiently conducted and dissipated in the laser polishing process, the temperature uniformity of the surface of a sample is ensured, and overheating and oxidation phenomena are prevented.

The invention discloses a laser polishing device for the inner wall of an outer tire of an automobile tire, which relates to the technical field of automobile tire repair and comprises a driving mechanism, a limiting mechanism, an adjusting mechanism and a polishing mechanism. According to the tire polishing device, firstly, when the tire polishing device is used, a self-locking motor is started, a first gear at the rotating end of a transmission box rotates, an annular transmission plate is driven to rotate through a series of transmission mechanisms, it is kept that a polishing mechanism can be arranged in a tire in a suspended mode, and convenience is provided for follow-up laser polishing; through a complex gear transmission system, outward extension of the two adjusting columns is achieved, so that the laser processing width of the grinding mechanism is adjusted, accurate adjustment of the grinding mechanism is achieved, meanwhile, the processing efficiency is improved, the labor cost is reduced, it is ensured that the equipment can meet the grinding requirements of different tires through adjustment, and the adaptability of the device is improved.

A steel structural plate external field in-situ laser additive repairing method comprises the steps that firstly, the range of a to-be-repaired damaged area of a steel structural plate component is determined, a laser additive repairing mode and repairing path planning are determined according to the damage type and degree, and laser cutting or laser removing is conducted on the to-be-repaired damaged area; then, the surface of the damaged area to be repaired is subjected to laser polishing treatment, and a layer of laser additive deposition is conducted; then laser remelting is conducted on the current additive repairing layer, it is ensured that the laser remelting area completely covers the laser additive area, and heat treatment is conducted on the additive area; next layer of laser additive filling repair is carried out, and the upper layer of laser additive part is covered; the steps are repeated until the laser additive completely covers the cutting area, and filling of the additive repairing area is completed; and finally, laser remelting treatment is conducted on the surface of the additive repairing area and the combined part of the additive repairing area and the base metal. According to the method, various damage types of the steel bridge after long-term service are repaired.

The utility model discloses a composite laser polishing device based on ultrasonic micro-forging, which comprises a sealed cabin, a three-axis guide rail system arranged in the sealed cabin and driven by a motor, a rotating disc arranged on a Z-axis direction movement guide rail, a replaceable working panel mounted on the rotating disc, an inflation switch, an exhaust switch and a clamp mounted on the working panel, the ultrasonic micro-forging device cabin is arranged on the Z-axis direction movement guide rail; and the ultrasonic generator is matched with the ultrasonic micro-forging device cabin. A cabin pressure detection sensor and an oxygen concentration sensor are arranged in the sealed cabin; the system further comprises an infrared optical fiber laser, an integrated ultraviolet optical fiber laser and corresponding optical assemblies. According to the polishing device, an oxide layer on the surface of a workpiece is removed in a pulse mode of the infrared laser, and then the continuous mode is switched for fine polishing. The ultraviolet laser adopts a pulse mode to assist in machining, and the ultraviolet laser and the pulse mode cooperate to improve the polishing effect. And after polishing is completed, the surface of the workpiece is subjected to strengthening treatment through an ultrasonic micro-forging device.

The invention discloses a perovskite thin film, a photoelectric device and a method for improving the surface quality of the perovskite thin film. The method for improving the surface quality of the perovskite thin film comprises the following steps: S1, preparing the perovskite thin film; s2, performing picosecond pulse laser surface polishing treatment; and S3, guanidine ion implantation and repair: applying a guanidine salt solution to the surface of the perovskite thin film, removing the redundant guanidine salt solution on the surface of the perovskite thin film after the guanidine ions are implanted into the surface of the perovskite thin film, and then carrying out annealing treatment. According to the method, the surface of the perovskite thin film is polished through the picosecond pulse laser, the roughness of the surface of the perovskite is effectively reduced, a surface layer rich in defects is removed, guanidine ions are selectively implanted again through a multi-A-site vacancy structure formed on the surface of the perovskite thin film subjected to laser polishing, multiple hydrogen bonds are formed through the guanidine ions and a perovskite framework, and the surface roughness of the perovskite thin film is effectively reduced. And deep and stable defect passivation and lattice strengthening are realized, and the high-quality perovskite thin film with smooth surface, low defect density and high stability is obtained.

The invention relates to the technical field of equipment treatment, in particular to an oil tank welding seam laser polishing device which comprises a laser transmitter, an adjusting mechanism, a side edge rust removal mechanism and a bottom rust removal mechanism. An operator firstly places a laser transmitter above an oil tank to polish a welding seam, after polishing is completed, the laser transmitter touches an adjusting mechanism, a light path is refracted to the side wall of the oil tank through a side edge rust removal mechanism to be polished, and after the side wall is polished, the bottom continues to be polished through a bottom rust removal mechanism; the equipment is simple in structure, different oil tank positions are effectively polished through a simple mechanical structure, the investment of laser equipment is effectively reduced, meanwhile, the phenomenon that other objects are damaged by bottom laser emission is avoided, good practicability and economical efficiency are achieved, and popularization and use of the equipment are facilitated.

The invention discloses a magnetic field-ultrasonic-assisted laser polishing composite manufacturing method. The method comprises the following steps that S1, a workpiece to be machined is placed on a machining table top; s2, adjusting the direction of a magnetic field through movement of an electromagnet on a guide rail; s3, controlling a moving assembly to align the to-be-machined position of the workpiece to a laser; s4, the lifting assembly is controlled to drive the machining table top to ascend and descend, and the focus of the laser is aligned with the surface of the to-be-polished position of the workpiece; s5, the magnetic field intensity is set, the frequency and amplitude of an ultrasonic generation assembly are set, a machining path is set, and the refrigeration temperature of a refrigeration assembly is set; and S6, the electromagnet, the ultrasonic generation assembly, the moving assembly and the laser are started, the moving assembly drives the machining platform to move according to the machining path, and polishing machining is conducted. The invention provides a magnetic field-ultrasonic-assisted laser polishing composite manufacturing device. The surface quality and precision of the workpiece can be rapidly improved.

The invention discloses a laser-assisted CVD (chemical vapor deposition) diamond polishing device, which belongs to the technical field of machining and comprises a rotary table connected with a first driving component, and the first driving component drives the rotary table to rotate around the axis of the rotary table; three adsorption tables are arranged at the top of the rotary table in the circumferential direction around the axis of the rotary table at equal intervals, a second driving assembly is arranged on the rotary table, and the second driving assembly drives the adsorption tables to rotate around the axes of the adsorption tables; a clamping mechanism, a laser polishing mechanism and a grinding mechanism are arranged on one side of the rotary table, and the clamping mechanism, the grinding mechanism and the laser polishing mechanism are arranged in one-to-one correspondence with the three adsorption tables correspondingly. The clamping mechanism is used for taking and placing workpieces, the laser polishing mechanism is used for moving along the radial direction of the corresponding adsorption table to roughly grind the workpieces, and the grinding mechanism is used for moving along the radial direction of the corresponding adsorption table to finely polish the workpieces. Mechanical grinding and laser polishing are combined, thinning and polishing work of a workpiece is rapidly achieved, and the machining efficiency is improved; and meanwhile, rapid circulation of the workpieces can be achieved.

The invention relates to the technical field of photovoltaic cell preparation, in particular to a cell assembly based on a rectangular silicon wafer and a processing method of the cell assembly. Comprising the following steps: placing a monocrystalline silicon wafer in a potassium hydroxide solution, texturing, washing and drying to obtain a textured silicon wafer; sequentially performing low-pressure diffusion, SE laser, polishing and oxidizing annealing on the textured silicon wafer to obtain a silicon wafer A; sequentially depositing an aluminum oxide layer and a silicon nitride layer on the back surface of the silicon wafer A to obtain a silicon wafer B; depositing a silicon nitride layer on the front surface of the silicon wafer B to obtain a rectangular silicon wafer; performing laser grooving, screen printing and sintering on the rectangular silicon wafer to obtain a single battery piece; the single battery pieces are connected in series through a welding strip to obtain a battery string; (3) sequentially laying glass, POE / EPE, a battery string, EVA and grid glazed backboard glass, sealing the edge by an edge sealing tape machine, and then, carrying out lamination, framing and junction box installation in the next process; and thus, a rectangular silicon wafer battery assembly is obtained.

The utility model discloses a three-dimensional dynamic laser polishing line, and relates to the technical field of laser polishing, the three-dimensional dynamic laser polishing line comprises a first electric roller line, a second electric roller line and a third electric roller line which are arranged on the same horizontal line, one end of the first electric roller line is a manual workpiece feeding part, a front polishing mechanism is arranged on the first electric roller line, and the other end of the first electric roller line is provided with a rear polishing mechanism. A workpiece overturning mechanism is installed on the second electric roller line, a reverse face grinding mechanism is installed on the third electric roller line, and the tail end of the third electric roller line is a manual workpiece discharging part. According to the utility model, the pulse laser, the dynamic galvanometer assembly and the plurality of electric roller wires are adopted to polish a product, and laser is utilized to carry out three-dimensional polishing processing on a workpiece, so that environmental pollution and possible mechanical damage to the workpiece are completely eradicated.

Method for producing a workpiece (64) made of quartz glass, which has at least one melt-polished workpiece surface (113) for use in a plasma-assisted manufacturing process, comprising the process steps: a) Providing a workpiece (64) made of quartz glass which has at least one raw surface (111) produced by cutting or machining, and b) Polishing the raw surface (111) to the polished workpiece surface (113) by laser polishing using at least one laser beam (81) moving relative to the raw surface (111), wherein the relative movement is generated by superimposing a translational-oscillating movement and a feed movement, wherein, as a result of the translational-oscillating movement, a quasi-line (87) is generated by a relative velocity between the raw surface (111) and the laser beam (81) above 500 mm / s, and wherein the feed movement has a relative velocity between the raw surface (111) and the laser beam (81) between 1 mm / s and 50 mm / s, c) and wherein a polished workpiece surface (113) is produced which has a micro-roughness and waviness, wherein the white light interferometry at a spatial wavelength λ OMicroroughness measured in the range of 1 µm to 10 µm has a surface roughness Sa of less than 0.5 nm, characterized in that the measurement is taken by means of a white light interferometer at a spatial wavelength in the range λ O Surface roughness (waviness) measured from 100 µm to 1000 µm has a value Sa of more than 5 nm, where the quasi-line (87) has a radiation intensity within the quasi-line (87) on the workpiece (64) between 10 W / cm² 2 and 1000 W / cm² 2 is produced wherein, for laser polishing of an annular end face (80) of a hollow cylindrical workpiece (64), the feed movement comprises rotation of the end face (80) about the longitudinal axis (84), and the translational-oscillating movement comprises a reversing movement of the laser beam (81) between an inner workpiece surface (85) and an outer workpiece surface (86), and wherein the speed of the translational-oscillating movement is set higher in the region of the inner surface (85) than in the region of the outer surface (86).

The application discloses a laser modification polishing integrated method for improving thinning efficiency of silicon carbide wafers. First, the wafer is placed on an ultrasonic vibration platform; then laser slow scanning parameters are set to make the semiconductor wafer efficiently modified under the action of ultrasonic vibration; then an air flow device is started, laser polishing parameters are set, and the laser is polished on the surface of the modified wafer under the action of ultrasonic vibration and high-speed air flow; finally, the wafer after laser polishing is ground and thinned by a wafer thinning machine matched with a fine-grit diamond grinding wheel, so that the final finished product sample is obtained. The method has the advantages of simplicity, high efficiency, strong repeatability and the like, and in combination with an external field assisted laser modification polishing process, the thinning efficiency can be effectively improved and the wafer thinning cost can be reduced.

The invention relates to the technical field of oil pump rotors, in particular to a rotor dynamic balance measurement and automatic correction system and a technological process method.The system comprises a marble platform, the marble platform is provided with a rotor positioning unit, and an oil pump rotor is installed on the rotor positioning unit; the dynamic balance measuring unit is matched with the rotor positioning unit to measure the unbalance size and phase of the oil pump rotor; a size measuring unit is arranged on the laser material reducing unit, and laser material reducing machining and laser polishing treatment are carried out according to data measured by the dynamic balance measuring unit in cooperation with the rotor positioning unit; a negative pressure dust removal unit; and the workpiece cooling unit is used for cooling the subtractive machining part of the oil pump rotor. Dynamic balance detection, laser correction and machining area size measurement of the oil pump rotor can be achieved, full automation in the treatment process is achieved, the precision and efficiency of dynamic balance of the rotor are improved, and meanwhile the surface quality of the rotor workpiece after material reduction machining can be effectively controlled.

The embodiment of the specification provides a carbon nanotube laser polishing quality real-time monitoring system and method based on optical coherence tomography (OCT) and secondary ion mass spectrometer (SIMS), an electronic device and a medium, wherein the system comprises: an ultrafast laser polishing device for high-precision laser polishing of a carbon nanotube film according to laser parameters; an OCT optical monitoring system for real-time monitoring of the surface morphology of the carbon nanotube film in the polishing process of the ultrafast laser polishing device, to obtain OCT data; a SIMS chemical component analysis module for detecting the surface element composition and impurity content of the carbon nanotube film before and after polishing, to obtain SIMS data; an intelligent feedback control system for optimizing the laser parameters of the ultrafast laser polishing device based on the OCT data and the SIMS data by using a machine learning algorithm; and a data processing and storage module for storing and analyzing the OCT data and the SIMS data, generating a surface quality evaluation report, and remotely adjusting the laser parameters according to the feedback of the intelligent feedback control system.

This application discloses a laser polishing device and its control method. The laser polishing device includes: a main body containing a processing chamber; an air inlet on one side of the processing chamber; an air inlet pipe connected to the air inlet on one side and to an air source on the other side; an air outlet on the opposite side of the processing chamber; an air outlet pipe connected to the air outlet on one end and to an exhaust device on the other side; a first sensor module installed on the air outlet pipe for detecting the pressure and / or velocity of the airflow within the air outlet pipe; and determining whether a filter module enters a self-cleaning mode based on the information fed back from the first sensor module. This ensures that the cleanliness within the processing chamber meets processing requirements and improves processing efficiency.

The utility model relates to the technical field of laser polishing, in particular to a laser stripping tool which comprises a rotating ring, a plurality of sliding holes are formed in the top of the rotating ring, supporting plates are connected to the inner walls of the sliding holes in a sliding mode, a plurality of driving assemblies are installed at the bottom of the rotating ring, and second air cylinders are fixedly connected to the inner walls of the supporting plates. Limiting holes are formed in the two sides of the inner wall of the supporting plate, a supporting plate is fixedly connected to the output end of the second air cylinder, limiting blocks are fixedly connected to the two sides of the supporting plate, the limiting blocks are slidably connected with the inner walls of the limiting holes, adjusting assemblies are installed on the inner wall of the supporting plate, and a mounting groove is formed in the top of the supporting plate. And the inner wall of the mounting groove is rotationally connected with a rotating shaft. The driving assembly drives the clamping arms to move, the ends of the clamping arms clamp and fix the outer wall of a product, meanwhile, downward force is applied to the product, the bottom of the product can be firmly fixed to the top of the supporting table, and the stability of product installation is guaranteed.

The invention discloses a laser modification and polishing integrated method for improving the thinning efficiency of a semiconductor wafer. The method comprises the following steps: firstly, placing a wafer on an ultrasonic vibration platform; then laser low-speed scanning parameters are set, so that the semiconductor wafer is efficiently modified under the action of ultrasonic vibration; then an airflow device is started, laser polishing parameters are set, and the laser polishes the surface of the modified wafer under the action of ultrasonic vibration and high-speed airflow; and finally, a wafer thinning machine matched with a fine-particle-size diamond grinding wheel is used for carrying out grinding and thinning on the wafer subjected to laser polishing, so that a final finished product sample piece is obtained. The method has the advantages of being simple, efficient, high in repeatability and the like, and the thinning efficiency can be effectively improved and the wafer thinning cost can be effectively reduced in combination with the external field-assisted laser modification polishing process.

A mobile processing chamber for laser polishing of glass workpieces comprises a workpiece carrier, a shielding element for the laser radiation used in the polishing process, and a protective enclosure. The shielding element is designed and positioned to surround a receiving area for the workpiece to be polished on the workpiece carrier, thus shielding the workpiece carrier from direct exposure to the laser radiation during the polishing process. The protective enclosure, either alone or in conjunction with the workpiece carrier, forms a closed chamber around the surface of the inserted workpiece to be polished and has a removable lid. The workpiece carrier, shielding element, and protective enclosure are made of materials that can withstand temperatures up to at least 500 °C. The material of the workpiece carrier is additionally selected to have a low thermal conductivity, preferably less than 10 W / (m K).The mobile processing chamber enables laser polishing of glass workpieces on an industrial scale with high yield.

The application provides a simulation prediction analysis method for laser polishing of a microtopography and roughness of a diamond surface, and comprises the following steps: creating a mapping relationship data table of laser parameters and laser spot size and power density; establishing a mapping relationship model diagram of laser spot power density, pulse width, laser incidence angle and diamond surface ablation pit depth; constructing an analysis model of a laser spot stacking state; generating a simulation image of the microtopography of the laser polished diamond surface; and predicting the roughness of the laser polished diamond surface. The application takes the machining parameters of laser spot power, pulse width, repetition frequency, defocusing amount, incidence angle, transverse scanning rate and longitudinal stepping interval as inputs, takes the microtopography and roughness of the laser polished diamond surface as outputs, and establishes a mapping relationship between the inputs and the outputs through simulation analysis of the size of the ablation pit, the spot scanning path and the spot stacking state, so as to guide the optimization of the laser polishing process parameters.

The present invention discloses a laser-jet electrochemical hybrid polishing method, which mainly utilizes laser irradiation combined with electrified spraying of electrolyte to process the surface of stainless steel, so as to solve the problems of low flexibility, limited shape and size, insufficient precision in jet electrochemical polishing, and easy oxidation and blackening of samples during laser polishing in traditional electrochemical polishing. The main creativity of the present invention is embodied in that the laser-jet electrochemical hybrid polishing has great flexibility, can perform selective polishing on large-sized and special-shaped workpieces in daily environment, effectively reduce the roughness of the workpiece surface and improve the surface reflectivity, and will not produce oxidation and morphological defects on the substrate surface.

The invention provides a three-step polishing method for suppressing high-frequency errors in CO2 laser polishing of a fused quartz element, and belongs to the technical field of laser processing of optical elements. The invention aims to solve the problem that the optical transmission performance and the laser damage resistance of a fused quartz element are severely influenced by medium-high frequency error induced far-field light modulation and high-frequency error induced near-field light field enhancement when the fused quartz element is processed by laser. The method comprises the first step of laser preheating, the second step of high-speed multi-layer polishing and the third step of low-speed single-layer polishing, laser polishing movement tracks and polishing parameters of the corresponding steps are drawn, medium-high frequency and high-frequency errors of the surface of the fused quartz element subjected to laser polishing are greatly reduced, the machined surface almost has no surface knife lines, and the surface quality is improved. And the far-field light modulation and near-field light field enhancement effects are effectively reduced.

The invention discloses olefinic magnetic heating equipment and belongs to the technical field of linen ironing in the washing and dyeing industry. The problems that an ironing groove in the existing linen ironing field needs various auxiliary facilities, and potential safety hazards of high temperature and high pressure exist are solved. An electromagnetic coil fixing frame of a first arc-shaped heating body is sequentially provided with an electromagnetic coil, a high-temperature-resistant insulating layer, a first fireproof heat insulation layer and a first high-temperature-resistant anticorrosive layer; the second arc-shaped heating body comprises a laser polishing surface layer, a nanometer insulating base layer, a second high-temperature-resistant anticorrosive layer, a first mica insulating layer, a graphene printing coating, a nanometer heat preservation layer and a second mica insulating layer which are sequentially arranged, and a power supply wiring pile is arranged on the second mica insulating layer and connected with the graphene printing coating. According to the olefinic magnetic heating equipment disclosed by the invention, heat energy is exerted to the maximum on the arc-shaped heating body in a short time, and the efficiency of ironing linen is improved.

The invention relates to the technical field of welding seam detection, in particular to a fillet welding seam inner surface grinding and detecting integrated device which comprises a circumferential rotating device, a position adjusting device, a laser grinding device and a phased array detecting device, and the position adjusting device is fixedly installed on the circumferential rotating device; the laser polishing device and the phased array detection device are installed on the two sides of the position adjusting device respectively, and the circumferential rotating device drives the position adjusting device and the laser polishing device and the phased array detection device installed on the position adjusting device to rotate in the circumferential direction. The position adjusting device drives the laser polishing device and the phased array detection device to move in the radial direction, and laser polishing is conducted on the inner surface of the fillet weld through the laser polishing device; and then the polished area is detected through the phased array detection device. The device has automation and high efficiency, high-precision grinding and nondestructive testing can be achieved, safety is improved, the detection process is optimized, and diversified requirements are met.