Method for ultrasonic-assisted laser polishing of ceramic-based composite material

Abstract

The invention discloses a method for ultrasonic-assisted laser polishing of a ceramic-based composite material. The method comprises the following steps of firstly, grinding and polishing the surfaceof a machined sample wafer of a SiC ceramic-based composite material, and carrying out ultrasonic cleaning; fixing the machined sample wafer on an ultrasonic-assisted laser polishing processing device, and moving a platform to focus the laser to an initial machining position; setting a laser parameter, a galvanometer scanning parameter, an ultrasonic vibration parameter and a motion parameter of an XYZ high-precision mobile platform, starting a femtosecond laser and an ultrasonic generator, and carrying out ultrasonic-assisted laser polishing machining on the machined sample wafer by using theadjusted parameters; and after polishing is completed, carrying out ultrasonic cleaning on the machined sample wafer again. According to the method, the laser machining method and the ultrasonic machining method are combined, the effects of acoustic streaming, cavitation and the like of ultrasonic waves are fully utilized, the problems of defects such as a recast layer and surface cracks caused by the plasma effect and the particle adhesion effect in the laser polishing process are solved, the laser machining process is optimized, and the material removal rate and the polished surface qualityare improved.

Description

technical field [0001] The invention relates to the technical field of laser processing of ceramic matrix composite materials, in particular to a method for ultrasonically assisted laser polishing of ceramic matrix composite materials. Background technique [0002] SiC ceramic matrix composites have the advantages of high temperature resistance, low density, high strength, high hardness, corrosion resistance, etc., and are widely used in high temperature and some harsh environments, especially in special parts that need to withstand extremely high temperatures on aerospace vehicles. Great application potential. Due to the multi-layer braided structure and ultra-high hardness of the material, traditional processing methods have been difficult to meet the needs of high-precision polished surfaces. [0003] Compared with traditional processing methods, laser processing technology has the advantages of high processing efficiency, small heat-affected zone, non-contact processing...

AI Technical Summary

Problems solved by technology

However, direct laser polishing on the material surface has the following disadvantages: (1) During laser polishing, on the one hand, due to the shielding and scattering effects of the plasma cloud on the laser, the transmission efficiency of the laser is directly affected, which is not conducive to the removal of materials on the polished surface; (2) On the other hand, the particle adhesion effect on the laser polished surface makes it difficult to discharge gasified substances and residues, and it is easy to carry out secondary deposition on the surface of the material to form a recast layer; (3) In addition, the plasma reheating effect It will also cause problems such as surface cracks and interface cracks on the processed surface, and the quality of the polished surface obtained is poor

[0004] Ultrasonic machining technology is based on the acoustic flow, cavitation, and mechanical effects of ultrasonic waves. It is widely used in the processing of hard and brittle materials. It has the advantages of high machining accuracy, small heat-affected zone, and no pollution. High cost

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