263 results about "Nanosecond laser" patented technology

The invention discloses a repetition-frequency-adjustable high-energy nanosecond laser and a working method thereof, and belongs to the technical field of lasers. The laser comprises a synchronizing signal controller, a nanosecond seed source, an electro-optical selection system, a first end face pumping amplification stage, a second end face pumping amplification stage and a side face pumping bi-pass amplification stage, the synchronizing signal controller is adopted to generate a clock reference signal, a frequency division synchronizing signal and a clock synchronizing signal, and integrated control over system signals is achieved. The clock reference signal is used for triggering the seed source to generate nanosecond seed light pulses, the frequency division synchronizing signal is optimized and adjusted to control the electro-optical menu system to screen out frequency division seed light pulses, and the repetition frequency of the seed light pulses is adjustable. Meanwhile, a pulse pumping mode MOPA structure is adopted, the repetition frequency of each amplification stage pumping light pulse and the repetition frequency of the non-frequency-divided seed light pulse are kept consistent through a clock synchronization signal, it is ensured that the heat effect of the whole system is stable, and repetition frequency adjustable nanosecond laser output with high energy and good reliability is achieved.

The present invention belongs to the field of water-jet guided laser micro-hole machining. Specifically, provided is a machining apparatus for a water-jet guided laser micro-hole with a high surface quality, the apparatus comprising: a nanosecond laser device, which is turned on on the basis of a control instruction of a machining control system and refracts an incident laser into a laser water-jet coupling head by means of an optical path transmission unit; a CCD camera, which is arranged above the optical path transmission unit, wherein the laser enters a detection optical path by means of the optical path transmission unit and images on the CCD camera, so as to detect the position of a laser spot diameter at a nozzle of the laser water-jet coupling head in real time, and to complete the coupling of the laser and a water jet; and the laser water-jet coupling head, which is used for coupling the laser, which is focused in the coupling head, and a high-pressure water flow, which enters a coupling cavity through a pipe of a water cavity sidewall, at small holes of the nozzle, so as to perform micro-hole machining on a workpiece. By means of the present invention, interference with a stable jet is reduced, and a micro-hole with a high roundness, a low taper and a good outlet / inlet morphology can be machined, thereby improving the machining efficiency, while also ensuring the precision and quality of micro-hole machining.

The invention provides a wafer laser stripping method and device, and belongs to the technical field of wafer manufacturing, and the method comprises the steps: 1, transmitting a pulse laser beam I through a nanosecond laser, focusing the pulse laser beam I to a first depth H1 in a to-be-processed wafer, and carrying out scanning processing to form a first modified layer; step 2, a pulse laser beam II is emitted through a nanosecond laser, the pulse laser beam II is focused at a second depth H2 of the wafer to be processed for scanning processing, a stripping layer is formed, the energy of the pulse laser beam II is smaller than that of the pulse laser beam I, and the second depth H2 is smaller than the first depth H1; and step 3, stripping the surface of the to-be-processed wafer in a vacuum adsorption mode to obtain a target wafer. According to the method, crack induction, crack propagation and target wafer stripping can be carried out by adopting one device, the required stripping force is small, and stripping of the target wafer can be realized by only needing the force of 40-60N.

The invention belongs to the related technical field of lasers, and provides a high-power subnanosecond-nanosecond laser in order to solve the problems that the range adjustment and the application range of an existing laser are limited, and the structural stability needs to be improved. A modulation semiconductor seed source, an optical fiber pre-amplifier, a light beam isolation system, a high repetition frequency solid pre-amplifier, an acousto-optic modulator frequency reduction module and a multi-stage solid single-pass main amplifier are sequentially arranged along an optical path, continuous adjustable output of repetition frequency and pulse width is achieved, the adjustable range of the repetition frequency is 100 kHz to 1 MHz, the adjustable range of the pulse width is 100 ps to 10 ns, and the adjustable range of the pulse width is 100 ps to 10 ns. The laser power and the light beam quality are remarkably improved, and the method is suitable for the fields of high-precision micromachining, nonlinear optical research, medical cosmetology and the like.

The invention discloses an ultrafast laser precision cutting method capable of removing burrs in parallel, which comprises the following steps: materials are conveyed to cutting positions of a first galvanometer system and a second galvanometer system, and the materials comprise a metal foil and a coating coated on the metal foil; determining a tab cutting total path and a linear cutting path in the tab cutting total path according to the tab specification parameters; the metal foil is pre-cut by the first galvanometer system along a linear cutting path; the metal foil is cut by a second galvanometer system along the tab cutting total path, and the pre-cutting path of the metal foil is cleaned; laser light sources of the first galvanometer system and the second galvanometer system are a nanosecond laser and an ultrafast laser respectively; the linear cutting path is located at the coating portion of the metal foil. By means of the method, the input cost of tab cutting equipment can be reduced, the phenomena of burrs and bead melting generated in the tab cutting process are reduced, high-quality tab cutting is achieved with low cost, and the battery performance and the yield are improved.

The invention discloses a method for realizing high-quality stripping of large-size diamond by double-laser composite modification, which comprises the following steps: placing and fixing a sample on a three-dimensional mobile platform, and the upper surface of the sample is a crystal face (100); laser generated by an ultrafast laser generator penetrates through the upper surface of a sample and is focused into the sample, and then the laser generated by the ultrafast laser generator is used for performing first spot scanning on the sample to form an independent lattice structure; laser generated by the ultrafast laser generator is adopted to carry out secondary spot scanning on the sample to form a crack interconnected lattice structure; performing third-time line scanning on the sample by using laser generated by a nanosecond laser generator; and ultrasonically stripping the sample in water bath. By adopting a dual-laser composite modification process and combining bionic'honeycomb 'and'turtle shell' crack structure design, the crack is effectively guided to directionally extend along the crystal face (100), the problem of oblique crack when the stripping face is the crystal face (111) in the past is avoided, and the integrity and flatness of the stripping face are greatly improved.

The invention discloses a laser welding process of a neodymium iron boron Halbach magnetic assembly. The laser welding process comprises the following steps: firstly, arranging a plurality of magnetized magnets in a Halbach array form; then glue is dispensed on the butt joint faces between the adjacent magnets, and the multiple magnets are glued to form a Halbach magnetic assembly; next, adjacent magnets are welded and fixed on the weak magnetic surface of the Halbach magnetic assembly in a nanosecond laser welding mode; glue is dispensed at the welding position, and the welding seam is filled and covered with glue while the Halbach magnetic assembly and the magnet fixing piece are fixed in a glue joint mode. According to the method, the Halbach magnetic assembly is assembled in the mode that glue joint is conducted firstly and then nanosecond laser welding is conducted, the welding operation is easy to conduct, the welding position is accurate, and magnetic performance attenuation can be controlled within a small range.

The invention discloses a double-pulse system and method for improving depth resolution of laser ionization mass spectrometry, and relates to the technical field of mass spectrometers, the system comprises a control system for controlling femtosecond laser parameters generated by a femtosecond laser and nanosecond laser parameters of a nanosecond laser; the laser energy regulation and control module is used for carrying out phase adjustment and detection on the input femtosecond laser and outputting the femtosecond laser meeting set parameters based on the femtosecond laser parameters; the light beam shaping and light beam morphology analysis module is used for shaping femtosecond laser and focusing the femtosecond laser on the surface of the sample for laser denudation; the nanosecond laser performs off-resonance multi-photon ionization on the denudated neutral particles to generate ionized ions for mass spectrometry. According to the invention, the depth resolution of the laser ionization mass spectrum can be improved to nanoscale, the ionization efficiency of ions is improved under the condition of reducing the sampling amount, and meanwhile, the sensitivity of an instrument and the accuracy of quantitative analysis are improved.

The invention relates to an aluminum alloy strengthening method for high-frequency pulse nanosecond laser surface remelting after low-temperature rolling, which comprises the following steps: firstly, carrying out low-temperature rolling deformation treatment on an aluminum alloy plate to obtain an aluminum alloy material with a high dislocation density fiber structure and realize deformation strengthening; afterwards, the surface of the aluminum alloy plate is subjected to high-frequency pulse nanosecond laser remelting treatment, the aluminum alloy plate is rapidly melted by means of the characteristics of high instantaneous energy density, short acting time and the like of high-frequency pulse nanosecond laser, a small molten pool is obtained, the small molten pool has the great supercooling degree, the driving force of crystallization is increased, and ultra-rapid solidification is achieved; and submicron equiaxed crystals with the grain size ranging from 0.55 micrometer to 0.7 micrometer are obtained on the surface of the aluminum alloy, and fine grain strengthening of the surface is achieved. Through the low-temperature rolling and laser remelting processes, the aluminum alloy material with the special structure is prepared, the interior of the aluminum alloy material is of a hardened state high dislocation density structure, and the surface layer of the aluminum alloy material is of a submicron equiaxed structure.

The invention discloses a multi-physics coupling modeling method based on nanosecond laser etching microgroove resistance reduction simulation, relates to the technical field of laser processing, and is used for solving the problem of optimization of a microgroove resistance reduction effect in a laser etching process. According to the method, the drag reduction effect of the microgroove in the laser etching process is simulated by establishing a coupling model of a plurality of physical fields such as heat transfer, fluid dynamics and material removal. Specifically, an adaptive grid technology is adopted to accurately calculate a temperature field and a flow field in an etching process, and meanwhile, a pulse laser equivalent processing method is introduced to model influences of different scanning times and laser power, so that etching process parameters are optimized. According to the method, the drag reduction effect under different parameters can be efficiently predicted, a theoretical basis is provided for microgroove design and laser etching process optimization, and the method has a wide application prospect.

A glass and metal laser welding method using a double-layer structure solder and its solder, the method includes: surface pretreatment, ultrasonic cleaning of the metal and glass surfaces, using pulsed laser deposition technology to sequentially deposit nano-Si and Al double-layer thin film pre-solder in the area to be welded on the glass surface; assembly, assembling the glass and metal according to the requirements of the connection joint, placing the glass solder with the pre-solder downward on the metal, and clamping the two with a clamp; nanosecond laser welding, focusing the laser on the contact surface of the thin film solder and the glass, and keeping the focus on the same plane, turning on the laser to scan and weld on the focal plane; post-welding treatment, using high-frequency nanosecond laser for post-welding heat treatment, and naturally cooling the joint after treatment. The present invention can accurately control the thermal effect generated in the tiny welding area, improve the wettability between the glass and metal interface, inhibit interface brittle compounds, and reduce thermal stress and residual stress.

The invention provides a laser de-bonding method and device, electronic equipment and a storage medium. The method comprises the following steps: determining a de-bonding area on a semiconductor substrate to be de-bonded; wherein the de-bonding area is made of an inorganic material; selecting laser parameters of a pulse laser; wherein the pulse laser comprises any one of a nanosecond laser, a picosecond laser and a femtosecond laser, and the laser parameters comprise laser wavelength and laser pulse width and frequency; and controlling the pulse laser to irradiate the de-bonding area according to the laser parameters. According to the laser de-bonding method, a nanosecond laser, a picosecond laser or a femtosecond laser is adopted to irradiate a de-bonding area on a to-be-de-bonded device, so that de-bonding treatment is carried out on the de-bonding area, and the de-bonding efficiency of taking an inorganic material as a to-be-de-bonded material is improved.

The invention discloses a high-integration-level interdigital flexible strain sensing array and a preparation method thereof. The preparation method comprises the following steps: circularly cutting a flexible thin film through a nanosecond laser to manufacture a thin film substrate with small holes; after the small holes in the film substrate are aligned with the small points of the interdigital array electrode layer silk-screen printing screen plate, an interdigital array upper electrode layer is manufactured through via hole silk-screen printing; covering the cured upper electrode layer of the interdigital array with a protective film, and performing hot pressing and cooling to form an upper packaging layer; after small holes in the back face of the film substrate where the upper packaging layer is installed are aligned with small points of a back face electrode layer silk-screen printing screen plate, an interdigital array lower electrode layer is manufactured through the silk-screen printing technology; and covering the lower electrode layer of the interdigital array with a protective film, and performing hot-pressing packaging to obtain a complete sensing array. According to the invention, the bottleneck that the traditional interdigital array is complex in design and low in integration level is successfully broken through, high integration of the sensor array is realized, and more complex strain monitoring requirements can be met.

The invention belongs to the technical field of metal surface laser processing, and particularly relates to a metal surface microstructure precise preparation method and device based on nanosecond laser. Carrying out scanning processing on the metal sample with the surface covered with the flowing liquid film by adopting nanosecond laser processing equipment; wherein the flowing liquid film is a carbon nano tube suspension and is used for removing deposition residues generated in the processing process. According to the method, the microstructure with the needed shape and arrangement mode can be rapidly and efficiently created on the metal surface, the problems that the microstructure on the metal surface is staggered and disordered and poor in forming after nanosecond laser machining are solved, the machining efficiency and quality of the nanosecond laser microstructure can be remarkably improved, the microstructure is improved, and the surface performance is improved. Meanwhile, the process is simple, flexibility is high, and operation is simple and efficient.

The invention provides a laser marking system and method for metal surface dazzling and coloring, and relates to the technical field of metal surface laser precision machining.The system integrates a femtosecond laser, a nanosecond laser, an optical bread board, a lifting platform, an electric rotating slide, a scanning galvanometer, a focusing lens, a computer control system and an adsorption platform; two laser marking processes of colorful marking and coloring marking are innovatively combined; the femtosecond laser device achieves a colorful effect on the metal surface through ultrashort pulses, and the nanosecond laser device generates a colorful effect of various colors through the heat effect. Automatic switching of the two lasers is controlled through the lifting platform, the computer automatically recognizes the drawing and document process type, and multi-color-zone pattern marking is efficiently completed. The system is simple in structure and convenient to operate, can meet the high-precision double-process marking requirement of the metal surface, and is widely applied to the fields of consumer electronics, anti-counterfeiting technologies and the like.

The invention belongs to the technical field of enhanced boiling heat exchange, and designs a non-uniform fractal micro-pit structure and super-hydrophilic composite surface, which comprises a micro-pit structure, a micro-pit structure area and a super-hydrophilic channel, the micro-pit structure and the micro-pit structure area can be obtained through a nanosecond laser micromachining technology, a non-uniform fractal micro-pit structure is formed on the surface of the copper base, and the super-hydrophilic channel can be obtained in a chemical oxidation mode. According to the non-uniform fractal micro-pit structure and super-hydrophilic composite surface, the number of vaporization cores can be increased under the low heat flux, the directional bubble convergence process can be achieved under the medium heat flux, liquid backflow can be enhanced under the high heat flux, bubble film forming can be delayed, and the critical heat flux can be increased; therefore, the enhanced boiling heat exchange effect under different heat flux densities is achieved.

The invention relates to the technical field of laser processing, and discloses a laser processing method of a ceramic substrate, which adopts an ultrashort pulse laser and nanosecond laser dual-laser system process, integrates the advantages of precise surface modification of ultrashort pulse laser and efficient processing of nanosecond laser, and forms a micron-sized porous sacrificial layer on the surface of a ceramic material. Micropores and microcracks on the micron-sized porous sacrificial layer destroy the continuous heat conduction path of the original compact ceramic, and heat is gathered on the micron-sized porous sacrificial layer formed on the surface, so that when subsequent nanosecond laser acts, compared with the original smooth ceramic substrate, the generated cracks are easy to block, two-dimensional cracks are not easy to generate on the surface of the ceramic substrate, and the surface of the ceramic substrate is not easy to crack. And low-power and high-efficiency processing can be carried out on the ceramic material without coating an auxiliary material, and high-absorption and low-heat-influence processing is realized.

The invention provides a method for improving passivation contact performance of a p region of a TBC battery, which comprises the following steps of: pretreating an n-type monocrystalline silicon wafer, depositing a SiO2 layer and boron (B) doped polycrystalline silicon (poly-Si), etching, performing laser ablation and the like, then depositing phosphorus (P) doped poly-Si, and finally depositing a passivation and anti-reflection layer and preparing a metal electrode. A tunneling oxide layer and boron in-situ doped polycrystalline silicon are deposited in a p region by adopting an ultra-low temperature plasma enhanced chemical deposition (PECVD) mode, the reaction of SiH4 and N2O is introduced to improve the deposition effect of the oxide layer at low temperature, the compactness of a film layer at low temperature is ensured to improve the separation of B on a SiO2 / c-Si interface, and the passivation performance is improved; b doping poly-Si is adopted in the p region, meanwhile, processing is matched with a nanosecond laser, non-equilibrium doping of the B to the poly-Si is achieved, the ultrahigh doping concentration is obtained, the p region passivation performance of the TBC is improved, and then the open-circuit voltage and the conversion efficiency of the TBC battery are finally improved.

The utility model provides a nanosecond blue light laser. Comprising a first reflecting lens, a quarter-wave plate, a first Q-switching module, a first side pump module, an optical rotation sheet, a second side pump module, a second Q-switching module, a polarizing film, a second reflecting lens, a third reflecting lens, a half-wave plate, a fourth reflecting lens, a beam expanding lens, a first plano-convex lens, a frequency doubling crystal, a color separation lens and a second plano-convex lens which are arranged in sequence. According to the nanosecond blue light laser, a resonant cavity with a novel structure is used, and high-efficiency nanosecond polarized light output with the wavelength of 946 nm is achieved. The LBO frequency doubling crystal is utilized, nanosecond laser with the wavelength of 946 nm is subjected to frequency doubling to form nanosecond blue light with the wavelength of 473 nm, the nanosecond blue light is output, the light beam quality is good, and the power is high.

The invention provides an infrared femtosecond and infrared nanosecond laser combined machining system and a bionic machining method, and relates to the technical field of laser surface machining. According to the method, rapid rough machining and pre-structure construction are achieved through nanosecond laser, then fine modification and micro-nano structure regulation and control are conducted through femtosecond laser, the machining efficiency and the structure quality can be remarkably improved through the synergistic effect of the nanosecond laser and the femtosecond laser, meanwhile, the heat influence is reduced, high-precision and low-damage machining of the SiC surface is achieved, and the machining quality is improved. And a technical support is provided for constructing a surface structure with special functionality.

The invention discloses a clamping system for nanosecond laser welding of metal foil and film-like plastic, and relates to the field of laser welding. It comprises two supporting bases, on which clamping assemblies are respectively provided, and further comprises a quartz glass pad and a high-transmittance quartz glass sheet. The quartz glass pad, the metal foil, the film-like plastic, and the high-transmittance quartz glass sheet are fixed together by two clamping assemblies. The invention has a simple structure and a reasonable design. By arranging a quartz glass pad and a high-transmittance quartz glass sheet, the invention not only ensures the fixation between the metal foil and the film-like plastic, but also makes the metal foil and the film-like plastic completely spread and in close contact. The clamping force is controlled by the clamping bolts and pressure sensors on both sides, which is convenient for adjusting the welding effect. The integration of the base and the clamping device enables the entire fixture to be stably installed and easy to operate, improves the stability during the welding process, ensures the accuracy of welding, improves the quality of welding, and has good practicality.

The invention discloses a silicone rubber plate for blending bone cement and a preparation process thereof, and relates to the technical field of silicone rubber plates, the preparation process comprises the following steps: adding silicone rubber, fluorinated silicone rubber and a double vulcanizing agent into a kneading machine, adjusting roller spacing, preparing into tablets, and vulcanizing to obtain a silicone rubber raw sheet; cutting and forming a silicone rubber raw sheet, and ultrasonically cleaning in ethanol for later use; the preparation method comprises the following steps: treating the surface of a cleaned raw silicon rubber sheet by using a nanosecond laser and performing laser drilling treatment by using a picosecond laser in sequence, then preparing nano silicon dioxide through hydrolytic condensation of ethyl silicate to fill holes, cleaning a drilling area on the surface by using the picosecond laser, and finally performing hydrophobic modification by using hexamethyldisilazane to obtain the super-hydrophobic silicon rubber plate. The preparation method comprises the following steps: carrying out sulfydryl modification on the surface of a super-hydrophobic silicone rubber plate, grafting ammonium bromide on the surface of the super-hydrophobic silicone rubber plate through an ultraviolet sulfydryl olefin reaction, grafting through an L-proline reaction, and finally absorbing nitric oxide to be saturated to obtain the silicone rubber plate for blending the bone cement.

The invention provides a method for processing a micropore by combining vortex beam shaping femtosecond laser with nanosecond laser, which comprises the following steps of: firstly, taking charge of melting and sublimation of a material by utilizing the high-power characteristic of the nanosecond laser, and then taking charge of finish machining of the hole wall of the processed micropore by utilizing the characteristics of small heat affected zone and high peak energy of the femtosecond laser. Therefore, the problems that the heat affected zone of the hole wall of the micropore machined by nanosecond laser is large, and the machining quality of the hole wall is poor due to material melting and recasting are solved. Therefore, the advantages of high efficiency of nanosecond laser micropore processing, small thermal damage area of femtosecond laser material processing and high micropore pattern quality of the processed micropore are combined, coarse and fine synchronous processing is finally realized, and the processing quality of the micropore wall is improved.

The invention discloses a multi-stage honeycomb and nano needle cone composite super-hydrophobic structure and a preparation method thereof.The composite super-hydrophobic structure comprises a honeycomb micron structure machined on the surface of a metal substrate, and the honeycomb micron structure comprises a plurality of structural units distributed in an array; and a plurality of nano cones which are vertical to the longitudinal growth of the metal base material and are tightly arranged are uniformly distributed in each structural unit, so that the surface hydrophobicity of the structure can be improved, and the strength, stability and durability of the super-hydrophobic structure can be improved. According to the method, laser ablation is conducted on the surface of a metal substrate from top to bottom through nanosecond laser, a honeycomb-shaped micron structure is machined, a plurality of nanometer needle cones are formed in a structural unit through the electrochemical deposition technology, and the composite super-hydrophobic structure is obtained. According to the method, expensive equipment is not needed, the machining efficiency is high, the cost is low, the controllability is good, and therefore the efficient and low-cost machining method is provided for firm preparation, durability and corrosion prevention of the high-durability super-hydrophobic surface.

The invention belongs to the technical field of laser diagnosis, and discloses a device and method for measuring oil and gas reservoir rock organic carbon characteristics, the device comprises an LIBS spectrum system and an ultraviolet Raman laser system, the LIBS spectrum system comprises a nanosecond laser, the nanosecond laser is connected with a microscope through a light guide arm, a reflecting surface of a reflecting mirror is connected with the light guide arm, and the reflecting surface of the reflecting mirror is connected with the ultraviolet Raman laser system. A convex lens is arranged below the reflecting mirror, a detachable spectroscope is arranged above the reflecting mirror, and a CCD (Charge Coupled Device) camera is arranged in the horizontal reflecting direction of the spectroscope. The LIBS spectrum system provided by the invention is simple in light path adjustment; the microscope carrying the CCD camera can observe the surface appearance of the sample at any time. According to the method, the LIBS spectrum system and the Raman spectrum equipment are respectively used for measuring the spectrum data of each shale, the prediction model of the total organic carbon of the shale is constructed, and the rapid measurement of the total organic carbon of the rock can be realized.

The invention discloses a double-pulse-sequence laser-assisted in-situ chemical etching method for improving semiconductor thinning efficiency. The method comprises the following steps: firstly, placing a semiconductor wafer in a prepared chemical etching solution; then the liquid level height is adjusted, and nanosecond and ultrafast laser multi-focus flat-topped light beams are modulated through a spatial light modulator; then performing first processing on the semiconductor material in the ablation liquid by using nanosecond laser to realize removal at a specific depth, and then performing second processing by using ultrafast laser to remove a defect layer introduced by the nanosecond laser and optimize the quality of the substrate; and finally, the semiconductor material is taken out, and atomic-scale flattening processing is carried out through chemical mechanical polishing. The method has the advantages of high efficiency, high repeatability, high controllability and the like, and the thinning efficiency and quality of the semiconductor substrate can be effectively improved.

The invention discloses a high-temperature high-density plasma generation and radiation opacity measurement method, which comprises the following steps: clamping a target material by using low-density low-Z-element foam to form a sandwich structure sample, and synchronously and directly driving the sandwich sample from two sides by using multiple beams of smooth nanosecond laser, the preparation temperature reaches 1,000,000 DEG C, and the electron density reaches 1 * 1023 pieces per cubic centimeter; then generating an X-ray source through the action of one or more nanosecond laser beams and the high-Z material, measuring the absorption spectrum of the X-ray source penetrating through the target plasma, the backlight spectrum of the X-ray source not penetrating through the target plasma and the self-emission spectrum of the target plasma through a spectrograph, and finally realizing the measurement of the radiation opacity of the high-temperature and high-density plasma. The high-temperature and high-density plasma radiation opaqueness measurement device has the beneficial effects that the high-temperature and high-density plasma radiation opaqueness measurement of which the temperature reaches 1,000,000 DEG C and the electron density reaches 1 * 1023 per cubic centimeter is realized on a million-joule nanosecond laser device.

The application discloses a disk medium high-energy ultra-short pulse laser regenerative amplifier based on CPA technology, comprising: a femtosecond laser seed light source for providing femtosecond seed light; a chirped Bragg fiber grating for expanding the femtosecond seed light into nanosecond laser pulses; an optical coupling input and output device for coupling input of the nanosecond laser pulses and coupling output of the nanosecond laser pulses after amplification processing; a regenerative amplification laser cavity for regenerative amplification processing of the coupled-in nanosecond laser pulses; the optical coupling input and output device comprises a fiber coupling collimation module, an optical isolator, a first 1 / 2 wave plate and a thin film polarizer; the regenerative amplification laser cavity comprises a Pockels cell, a second 1 / 2 wave plate, a first reflection module, a second reflection module, a first telescope module, a second telescope module, a first disk gain medium, a second disk gain medium and a third reflection module; the regenerative amplifier can realize high-repetition-frequency and high-pulse-energy laser pulse output.

The invention relates to the technical field of micro-nano machining, in particular to a system and method for preparing a flexible transparent electrode through nanosecond laser machining and application. The galvanometer polarization module is used for deflecting the nanosecond laser beam; the water bath cooling module is used for placing a membrane material, one side of the membrane material is in contact with water in the water bath cooling module, and the other side of the membrane material is etched by the deflected nanosecond laser beam; and the ultrasonic module is used for carrying out ultrasonic cleaning on the etched membrane material. The flexible transparent latticed electrode is prepared in a mode of combining laser emission module etching, galvanometer polarization, water bath cooling and final ultrasonic deburring, and the transparent latticed electrode has the characteristics of high conductivity, high light transmittance, excellent mechanical flexibility and the like; the requirement on equipment is reduced; and the production and manufacturing cost is greatly reduced.