Processing method and device for inner hole of tempered glass

A technology of strengthening glass and processing method, applied in metal processing equipment, welding equipment, laser welding equipment, etc., can solve the problems of time-consuming, inability to process strong glass, and inability to process holes with too small size, etc., and achieve good results , low cost, small consumables

Active Publication Date: 2015-11-25
深圳市大族半导体装备科技有限公司
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Problems solved by technology

This machining method is very time-consuming and cannot be used to process holes that are too small in size, nor can it process high-strength glass

Method used

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  • Processing method and device for inner hole of tempered glass
  • Processing method and device for inner hole of tempered glass
  • Processing method and device for inner hole of tempered glass

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] The invention provides a processing method for strengthening glass inner holes, comprising the following steps:

[0031] Step S1: Using a laser to process the outline of the inner hole on the strengthened glass substrate, at this time the glass in the hole is completely separated from the substrate, but the gap formed is very small because only extremely limited material is removed, and the glass is laser processed The surface of the glass is not smooth, so the glass in the hole does not come off naturally from the substrate.

[0032] The laser used in this step is preferably an ultrashort ...

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Abstract

The invention discloses a processing method for an inner hole of tempered glass. The processing method comprises the following steps that laser is used for processing the contour of the inner hole in a substrate of the tempered glass firstly, the glass in the hole is separated from the substrate completely at the time, but the glass in the hole does not fall off the substrate; and laser is then used for removing the glass in the inner hole. The invention further discloses a processing device adopting the method. The processing device comprises a workbench, a moving unit, a positioning unit, a laser system and a control system. According to the processing method and device, a processing mode with ultrashort pulse laser and nanosecond laser combined is used, and the processing method and device are applicable to processing of high-intensity tempered glass and inner holes of any shape and size. The processing method and device have the characteristics of being high in speed, good in effect, high in yield, few in consumable, low in cost and the like.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a processing method and processing equipment for inner-shaped holes of strengthened glass. Background technique [0002] With the development of society, strengthened glass is widely used in electronic products such as smartphones and tablet computers, and the processing requirements for strengthened glass are also getting higher and higher. [0003] Strengthened glass is obtained by strengthening ordinary glass by ion exchange. Specifically, the silicate glass containing alkali metal ions is exchanged with Na+ ions on the surface of the glass and K+ ions in the molten salt to form a K+ ion exchange layer on the surface. Since the radius of K+ ions is larger than that of Na+ ions, the surface expands and produces pre-compressive stress, which greatly enhances the strength of the glass. However, due to this pre-compressive stress, it is easy to destroy the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/0622B23K26/382B23K26/402
Inventor 张小军苑学瑞卢建刚刁凌天高云峰
Owner 深圳市大族半导体装备科技有限公司
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