43 results about "Nano machining" patented technology

The invention provides a micro-nano processing platform user machine-hour management method and device, a storage medium and equipment. The method comprises the following steps: acquiring an equipment reservation request sent by a user; calling a user initial machine hour from the equipment machine hour management system according to the user identity information; if the initial machine time of the user does not meet the equipment machine time sum of the equipment reservation request, sending a prompt message that the machine time is insufficient to the user; real-time equipment operation parameters and user real-time operation records of a user in the equipment operation process are obtained, and a user machine time adjustment strategy is obtained according to the real-time equipment operation parameters, the user real-time operation records and the equipment reservation request; and adjusting the initial machine time of the user according to the machine time adjustment strategy to obtain a final user machine time, and sending the final user machine time to the user. Through the user machine-hour management method, transparent machine-hour management of the micro-nano machining platform is realized, and meanwhile, the opinions of standard operation of the user and the use efficiency of the micro-nano machining platform equipment are improved by utilizing the equipment machine-hour adjustment strategy.

The application relates to the technical field of micro-nano machining, and discloses a kind of optical waveguide manufacturing template and its processing method, working template and diffractive optical waveguide manufacturing method.The optical waveguide manufacturing template includes template base and etching layer arranged on the surface of the template base, at least two groups of optical waveguide microstructures are arranged on the etching layer, and the depth of each group of optical waveguide microstructures is different.The thickness of the etching layer is configured to be able to meet the maximum design depth of each group of optical waveguide microstructures.The bottoms of different groups of optical waveguide microstructures are flush, and the tops are not flush.After implementing the technical scheme of the application, the technical problems of the prior art, such as complicated processing technology of multi-depth optical waveguide microstructure template, high overlay precision requirement, high manufacturing cost, low yield, low diffraction efficiency of depth microstructure due to imprinting residual glue during processing and poor display effect, are solved.

The invention provides a multi-dimensional vibration platform with oppositely-arranged double-sandwich piezoelectric actuators and an excitation method of the multi-dimensional vibration platform, and belongs to the technical field of high-frequency vibration engineering and micro-nano machining.The vibration platform comprises a center platform, the two oppositely-arranged piezoelectric actuators, two end covers and two bolts, wherein the center platform is integrated with the tail end platform, the two flexible hinges and the two amplitude-change poles, and the center platform is slender and is in mirror symmetry about the longitudinal symmetry plane of the tail end platform. The piezoelectric actuator comprises a longitudinal vibration ceramic group, a bending vibration ceramic group around the Y axis and a bending vibration ceramic group around the Z axis, translation along the X / Y / Z axis and rotation around the Y / Z axis can be realized through in-phase or anti-phase excitation different combinations under the condition of not increasing extra driving channels, and five-degree-of-freedom high-frequency micro-vibration output can be achieved at most. The structure has high symmetry, low parasitic vibration, compact size and high integration, and is suitable for precise engineering scenes such as micro-nano processing, laser-assisted manufacturing, cell manipulation and active vibration suppression.

The invention discloses a micro-nano device photoetching process based on surface energy repair and a micro-nano device, and relates to the technical field of photoetching. The process provided by the invention comprises the following steps: carrying out plasma cleaning on a substrate, immersing the substrate subjected to plasma cleaning into an organic cleaning solvent, and removing an unstable metamorphic layer and pollutants on the surface of the substrate by adopting at least one of soaking, stirring and ultrasonic treatment, then, the cleaned substrate is adopted to carry out subsequent photoetching and micro-nano machining processes; the step of organic solvent cleaning is added after substrate plasma cleaning, an unstable metamorphic layer is disintegrated and other impurities are removed through permeation and slight dissolution effects of an organic solvent on the surface of the substrate, so that the surface of the substrate is recovered to a smooth and stable state; therefore, the defects of edge collapse, side wall roughness and the like of the photoresist pattern in the photoetching process are remarkably reduced, and the photoetching morphology precision and the production yield of the micro-nano device are effectively improved.

The application discloses an information management system and method of a micro-nano machining experiment platform, and is used for solving the problems of great difficulty in personnel management and poor information display effect in the prior art. The information management system comprises an identification and tracking module, an alarm module, an intelligent pushing module and a rendering module. The identity information data of the micro-nano machining laboratory personnel in a monitoring area is acquired through the identification and tracking module. The first type of identity information is extracted from the identity information data of the micro-nano machining laboratory personnel through the intelligent pushing module, and the first type of identity information is displayed at a preset position of the real scene image of the micro-nano machining laboratory personnel through the rendering module. When the alarm information of the violation is received from the alarm module, the intelligent pushing module can determine the second type of identity information according to the preset display rule, and the second type of identity information is displayed at the preset position of the real scene image of the micro-nano machining laboratory personnel through the rendering module.

The invention belongs to the technical field of micro-nano machining, and particularly relates to a method for preparing a high-resolution EUV optical element through electron beam lithography. The method comprises the following steps: etching an optical element by using an electron beam lithography system, and introducing a region proximity effect correction strategy; the method comprises the following specific steps: preparing a silicon nitride film as a substrate, and spin-coating HSQ photoresist on the silicon nitride film; carrying out geometric region division on the to-be-exposed optical component graphic layout; at least dividing a central region, an edge region and a corner region; utilizing Monte Carlo simulation software to establish a function relationship between the graphic position and the required exposure dose so as to determine an independent exposure reference dose of each geometric region; an independent and compensated exposure reference dose is set for each geometric region based on dose deviation data obtained by simulation. According to the method, the pattern uniformity can be remarkably improved, and reliable preparation of a large-area and large-aspect-ratio nano structure is realized.

The invention relates to a nano-sieve and a preparation method and application thereof, the nano-sieve is composed of multiple layers of micro-nano processing stacked structures, the nano-sieve internally comprises a high-density nano-channel array, the cross section of each channel is rectangular, and the width of each channel is determined according to the size of a target separation particle. The preparation method of the nano sieve comprises the following steps: preparing an initial groove; filling and flattening the photoresist; performing film deposition and secondary configuration; constructing a stacking structure; cutting and forming; and removing the photoresist. The method has the advantages of being small in screening scale, high in mechanical strength, high in flux, high in anti-blocking capacity and high in process compatibility.

The utility model discloses double-beam infrared picosecond laser non-standard micro-nano machining equipment which comprises an infrared picosecond laser micro-nano equipment body, a high-precision linear module is arranged on the top face of the infrared picosecond laser micro-nano equipment body, and operation panels are arranged on the two sides of a high-precision linear module platform respectively. The clamping assembly is arranged on the top faces of the operation plates and used for clamping a machined workpiece, the clamping assembly comprises two swing columns, and the two swing columns are arranged on the top faces of the two operation plates correspondingly; according to the infrared picosecond laser micro-nano equipment, the arranged infrared picosecond laser micro-nano equipment body, the high-precision linear module, the operation plate, the swing column, the clamping head, the clamping groove, the operation column, the supporting frame and the rotating column are used in cooperation, a trapezoidal table can abut against the lower portion of the swing column, and therefore the clamping head can press and clamp a workpiece, machining workpieces of various sizes and various shapes can be clamped, and the machining efficiency is improved. When a circular workpiece is clamped, the circular workpiece enters the clamping groove, and the circular workpiece can be clamped.

The invention relates to the technical field of micro-nano machining and manufacturing, and particularly provides photoetching direct-writing micro-nano machining equipment and a machining method.The photoetching direct-writing micro-nano machining equipment comprises an electron beam exposure assembly, a laser direct-writing assembly, a connecting cavity and a conveying guide rail, and the electron beam exposure assembly is used for conducting electron beam exposure on a first pattern on a sample; the laser direct-writing assembly is used for carrying out laser direct-writing exposure on a second pattern on a sample, the connecting cavity is communicated with the electron beam exposure assembly and the laser direct-writing assembly, the conveying guide rail sequentially penetrates into the laser direct-writing assembly, the connecting cavity and the electron beam exposure assembly, the conveying guide rail is used for conveying the sample, and the laser direct-writing assembly is used for carrying out laser direct-writing exposure on the sample. And the sample can be exposed by the electron beam exposure assembly and the laser direct writing assembly in sequence. The sample is subjected to different levels of exposure treatment in the equipment in sequence, so that the problems that the precision cannot be guaranteed and the sample is polluted due to the fact that the sample is transferred among different equipment are solved.

The invention discloses a femtosecond laser pulse string driven atom precipitation method, which relates to the field of laser extreme manufacturing, is realized based on a femtosecond laser micro-nano machining system, and comprises the following steps: fixing an alloy material on a three-dimensional displacement table; the angle of the two-phase color mirror is adjusted, so that the femtosecond laser pulse is vertically incident to the surface of the alloy material; a focus lens is adjusted and machined, and it is guaranteed that laser coaxially and vertically enters; an imaging camera is adjusted, and a laser processing area is monitored in real time through a real-time imaging module; adjusting the beam shaping module to generate a pulse string with a fixed pulse interval; and laser energy is adjusted, array processing of different pulse overlap rates is carried out in a designated area on the surface of the material through cooperative control of a galvanometer system, a three-dimensional displacement table and a mechanical light shutter, and femtosecond laser pulse string driven atom precipitation is completed. According to the method, the laser heating and cooling rate can be flexibly adjusted, low-cost and high-efficiency atomic-scale precipitation and even atomic configuration regulation of different elements of the alloy are achieved, and improvement of the performance of the alloy material is facilitated.

The invention discloses a machining method for controlling the height of a nano periodic structure through a tool movement track, and belongs to the technical field of micro-nano machining. According to the specific scheme, the machining method for controlling the height of the nanometer periodic structure through the tool motion trail comprises the following steps that firstly, according to a motion equation, under the condition that the machining period is fixed, different nanometer down-milling machining motion trails of a tool are obtained by regulating and controlling parameters RX, Rz and phi; step 2, calculating the forming amount of the processing material in each period by adopting a numerical calculation method, adjusting the sizes and the relationship of the three parameters, and controlling the size of the forming amount of the material; selecting a proper motion trail of the cutter according to the forming amount of the nano grating material; 3, under different parameter combinations, tool paths are different, according to the tool paths, driving signals are set, the nanometer grating structure is machined, and morphology measurement is carried out; and 4, carrying out quality evaluation on the morphology measurement result, determining the optimal geometric characteristics of the processing track, and establishing a functional equation for predicting the height of the nano grating structure. By means of the machining method, efficient and high-quality machining of the surface nanometer periodic structures with different heights can be achieved, and the application performance of the surface nanometer periodic structures is improved.

The invention discloses a multi-dimensional vibration platform with double sandwich type piezoelectric actuators arranged in the same direction and an excitation method of the multi-dimensional vibration platform, and relates to the field of high-frequency vibration engineering and micro-nano machining. Aiming at the problem that a traditional piezoelectric vibration platform is difficult to realize higher-dimension multi-degree-of-freedom operation capability, the piezoelectric vibration platform comprises an output platform, two piezoelectric actuators, two end covers and two bolts. The piezoelectric actuator is provided with a longitudinal vibration ceramic set and two bending vibration ceramic sets arranged in the orthogonal direction, and through excitation of voltage signals with the same phase or the phase difference of 180 degrees, rotation around the X axis, the Y axis and the Z axis and translation along the X axis and the Y axis are achieved. Due to structural symmetry and driver arrangement constraint, Z-direction translation is strongly coupled with an existing mode, so that high-practicability five-degree-of-freedom output is focused. The same-direction arrangement type design is adopted, the characteristic of low motion coupling is achieved, and displacement deformation of the piezoelectric actuator can be converted into different actions needed by multi-dimensional vibration of the tail end platform. The method is suitable for the fields of laser processing, vibration-assisted processing, micro-nano operation, active vibration suppression and the like.

The application discloses a kind of micro porous carbon spring based on femtosecond laser micro-nano machining and preparation method thereof, it is related to femtosecond laser micro-nano machining technical field.The application provides a kind of preparation method of micro porous carbon spring, take polyimide film and fix on slide, the slide is fixed on object table;Laser parameter is adjusted, laser beam is focused on the surface of the polyimide film and is scanned, and the micro porous carbon spring is obtained;The laser parameter is 500 mW-4000 mW of laser power, and scanning speed is 1-10 mm / s.The application also provides corresponding micro-nano machining system and micro-nano machining parameter database.Micro porous carbon spring prepared by the method has good conductivity, mechanical strength and environmental stability.

The invention discloses an asymmetric scattering myopia control lens and a manufacturing method thereof, which are applied to the optical field, firstly, the problem that an optical defocus signal is not matched with an actual visual task mode in the prior art is solved by accurately associating optical scattering intensity with a human visual behavior thermodynamic diagram; a stronger myopia out-of-focus signal is provided in a short-distance reading area used by a wearer at high frequency, the myopia control effect is effectively enhanced, high definition is maintained in a long-distance watching area, unnecessary visual interference and comfort reduction are avoided, secondly, waste of optical resources in an existing rotational symmetry design is avoided due to the adoption of the asymmetric design, and the cost is reduced. According to the lens structure, optical energy is distributed according to needs, precise free-form surface machining and micro-nano machining technologies are combined, high-precision manufacturing of an asymmetric microstructure is ensured, smooth transition of scattering intensity between different optical areas is achieved, and finally the innovative lens structure with myopia control efficiency and visual comfort is provided.

The invention relates to a method for preparing a lithium tantalate super-structure surface based on a focused ion beam, and belongs to the technical field of micro-nano integrated devices. The method comprises the following steps: (1) cleaning a cut lithium tantalate film; (2) depositing a hard mask on the lithium tantalate thin film through a magnetron sputtering method, and carrying out annealing treatment after deposition is completed; (3) etching a super-structure surface on the annealed lithium tantalate thin film by using a focused ion beam; and (4) the hard mask is removed, and after cleaning, preparation of the lithium tantalate super-structure surface is completed. By comparing the influence of hard mask materials such as Cr, Pt, Cr-Pt mixing and Cr / Pt layering on the image contrast, it is found that the Pt material can effectively improve the contrast of the ion beam secondary electron image. According to the discovery, a feasible mask design scheme is provided for micro-nano processing of the lithium tantalate super-structure surface structure, and meanwhile, a new thought is provided for effective improvement of the charge effect of positive charges of an insulating material.

The application discloses a multi-material surface controllable millimeter scale lens and a preparation method thereof, and belongs to the technical field of laser micro-nano machining. Two ion beams are obliquely incident on the surface of a hard material sample, the sample is fixed on a sample holder and uniformly rotates at a certain speed, and a very smooth millimeter scale lens can be obtained after etching for a period of time. The millimeter scale lens has excellent stability and surface quality, and is very suitable for being used as a template to transcribe a millimeter scale convex lens. In a word, the application can efficiently etch a smooth, uniform and surface controllable millimeter scale lens on the surface of various hard materials through the method of oblique incidence of two ion beams, and to some extent, solves the problems of difficult surface morphology control, poor surface quality, low preparation efficiency and complex preparation process during the preparation of the millimeter scale lens.

The invention discloses a high-flux multi-dot-matrix two-photon laser direct writing system and method, the system expands femtosecond laser beams by using a beam expanding and dodging module, the laser light intensity of the femtosecond laser is shaped from Gaussian distribution to flat-topped light, and through the two points, it is ensured that a plurality of generation modules generate enough number of sub-dot matrixes with uniform intensity, so that the generation efficiency of the femtosecond laser is improved. In addition, the multiple sub-dot matrixes are combined into multiple dot matrixes according to a set arrangement mode through the beam combining module, and therefore large-area three-dimensional micro-nano machining with extremely high flux can be achieved under the action of the laser direct writing module. By means of the system, large-area three-dimensional micro-nano machining with extremely high flux can be achieved.

The invention discloses a method and a device for carrying out back wet etching on fused quartz by using laser with the wave band of 300-600nm, and belongs to the technical field of laser micro-nano processing. According to the method, 532nm laser pulses are focused on the back surface of a transparent fused quartz sample, a light damage area is generated in a contact area of the sample and an acid red No.1 aqueous solution, and the characteristic that the acid red No.1 aqueous solution has high absorptivity on 532nm wavelength laser is utilized, so that local etching of a material is realized under the condition that an absorption layer does not need to be additionally arranged; and finally, forming a circular microstructure on the surface of the fused quartz by taking the light destruction region as the center. The device is made of a polytetrafluoroethylene material and has chemical corrosion resistance, stable liquid level control is achieved through the high-position liquid injection channel, and etching uniformity and repeatability are guaranteed. Compared with a traditional infrared laser etching mode, the method has the advantages that the process is simpler, the microstructure array with clear edges and low surface roughness can be prepared, and the method is suitable for micro-nano machining of optical devices.

The utility model discloses a micro-nano machining clamp capable of automatically adjusting the height, and relates to the field of silicon wafer micro-nano machining. The silicon wafer conveying device comprises a mounting plate, a movable block, a pneumatic suction cup and a silicon wafer, a clamping mechanism is arranged on the movable block and comprises a second electric push rod, the silicon wafer conveying device fixes the center area of the silicon wafer through negative pressure adsorption through the clamping mechanism, basic constraint is formed, silicon wafer displacement caused by inertia force or vibration in the initial stage of conveying is avoided, and the conveying efficiency is improved. Meanwhile, a first electric push rod drives a sliding plate to vertically lift the silicon wafer, so that the silicon wafer is separated from a groove of a placement table top for positioning, and space position transfer preparation is completed; when a clamping mechanism is started, a second electric push rod shrinks to drive a movable frame to longitudinally move, and a clamping plate forms supporting and lifting from the lower part of the bottom edge of the silicon wafer under the lever action of a connecting plate; the non-contact hooking arrangement eliminates the stress concentration generated by directly extruding the edge by the traditional clamping jaw, and avoids the risk of edge breakage.

The invention belongs to the technical field of micro-nano machining and advanced manufacturing, and particularly belongs to a preparation method of a three-dimensional curved surface microstructure based on shape memory alloy phase change driving. Carrying out thermomechanical treatment on the substrate, and endowing the three-dimensional curved surface with a memory state to obtain a trained SMA substrate; the trained SMA substrate is cooled to the temperature below the martensite phase transformation completion temperature, external mechanical force is applied, the three-dimensional curved surface shape in the memory state is stretched and flattened into a temporary two-dimensional plane state, then the SMA substrate is fixed to a rigid carrier plate, and the SMA substrate in the temporary plane state is obtained; and processing on the SMA substrate in the temporary plane state by using a plane micro-nano processing technology, then recovering to a three-dimensional curved surface shape in a memory state, and removing redundant structures to obtain the three-dimensional curved surface microstructure. Through phase change driving of the shape memory alloy, two-dimensional plane machining is converted into three-dimensional curved surface result forming.

The invention discloses a micro-nano processing method for a double-sided metasurface structure of a silicon wafer, which is characterized in that in the double-sided processing process of the silicon wafer, the micro-nano structure is protected from being damaged and the cleanliness of the surface is ensured by using uniform-thickness protective glue, blue film pasting and the like, and coarse alignment of the double-sided structure is realized by using corner side lines and direction positioning marks; concentrated sulfuric acid and hydrogen peroxide solution H2O2 which are mixed according to the proportion of about 3: 1 are used for cleaning chemical residues in the machining process, ammonium fluoride corrosive liquid with the hydrofluoric acid content of 6% is used for removing intermediate products, and therefore a good double-face super-surface structure is obtained. According to the method, the double-sided metasurface micro-nano structure is processed on the single silicon wafer, the integration level of a metasurface device is improved, the metasurface structure is protected by adopting a uniform-thickness glue protection mode, the method is matched with a previous micro-nano processing technology, new process equipment and material intervention are not needed, the protection glue is easy to clean and strip, and the production efficiency is improved. And the damage to the metasurface structure is small.

The application belongs to the technical field of micro-nano machining, and particularly relates to a preparation method of a via based on a glass substrate, a glass substrate and an intermediate thereof. The preparation method comprises the following steps: performing laser treatment on a target region of the glass substrate to form a modified region in the target region; performing chemical treatment on the glass substrate subjected to the laser treatment to form a passivation layer on the surface of the glass substrate, wherein the passivation layer corresponding to the modified region is formed into a first passivation layer, and the passivation layer corresponding to a non-modified region outside the modified region is formed into a second passivation layer; the density of the first passivation layer is less than the density of the second passivation layer; and etching the glass substrate subjected to the chemical treatment to form a via based on the modified region. The application can break through the limitation of isotropic etching of etching liquid, has a simple process, can realize the machining of a high aspect ratio via without adjusting too many process parameters, has low cost, and has a wide application range.

The application relates to an integrated process method for super-precision machining and detection of a complex micro-component surface microstructure, and belongs to the technical field of micro-component surface machining.The application is used for solving the problem that the single super-precision cutting, energy beam micro-nano machining technology and contact type detection technology cannot meet the high-precision and high-efficiency forming requirement of the microstructure of a micro-component surface due to the low manufacturing response capability, micro-space constraint, insufficient measurement range and the fact that the precision benchmarks of the technologies cannot be unified.The application realizes the preliminary high-efficiency forming of a micro-spherical crown structure by milling and removing the microstructure material based on a super-precision micro-milling machining device; the local profile and surface topography of the spherical crown are precisely controlled by an ultraviolet nanosecond laser machining device to realize laser reshaping; the machining precision of the micro-spherical crown after each process forming is quantified based on a special complex micro-component measuring system and a non-contact lossless detection method to realize machining quality characterization.The application is used for complex micro-component surface machining.

The invention belongs to the technical field of micro-nano machining and photoetching, and particularly relates to a photoetching method for preparing a pattern edge frame structure in one step. After a photoresist containing a photoacid generator, a polymer and a solvent is coated to form a film, single exposure is performed through a mask, and three characteristic areas are spontaneously formed in the film according to acid concentration distribution: the acid concentration in the exposure area is the highest, the polymer is triggered to be crosslinked and then hydrolyzed, and the polymer is soluble during development; in the edge region influenced by acid diffusion in the unexposed region, the polymer is only crosslinked and is insoluble during development; the core area, which is not influenced by acid diffusion, in the unexposed area is soluble during development. And after developing, synchronously removing the soluble region and retaining the insoluble region, thereby directly forming the pattern edge frame structure in one step. The method is simple in process, does not need multi-step exposure or complex post-processing, can regulate and control the structure morphology in a programmed manner, and is suitable for the fields of micro electro mechanical systems, photonic devices, programmable photoetching and the like.

This invention relates to the field of femtosecond laser application technology, specifically to a femtosecond laser micro / nano fabrication device based on dynamic focusing. It includes a processing stage for mounting the workpiece and a drive mechanism that moves along a processing trajectory. A laser for generating femtosecond laser pulses is positioned above the processing stage. A rotation module and a beam-shrinking mechanism are sequentially arranged along the irradiation direction of the femtosecond laser pulses. The rotation module includes a first optical path system for irradiating along the processing trajectory and a second optical path system for probing the workpiece. The beam-shrinking mechanism is used to adjust the beam diameter and to generate polarized light with different polarization states. A CCD camera for acquiring real-time image data is also included. A control module is further included, which adjusts the power of the beam-shrinking mechanism and the laser based on the real-time images. This invention is used to automatically adjust control parameters according to the processing trajectory control requirements in complex processing tasks, ensuring processing accuracy.

The invention relates to the technical field of ultrafast laser micro-nano machining and process monitoring, and particularly discloses a machining monitoring system and method based on femtosecond laser multi-focus parallel ablation. The system comprises a femtosecond laser generation and regulation module; the multi-focus generation and transmission module comprises a spatial light modulator and is used for modulating the femtosecond laser pulse to form a multi-focus array and focusing the multi-focus array in a sample processing area; the multi-mode real-time monitoring module is used for synchronously carrying out surface topography imaging monitoring, laser-induced breakdown spectroscopy monitoring and ultrasonic monitoring on the processing area; and the central control module is in communication connection with the femtosecond laser generation and regulation module, the multi-focus generation and transmission module and the multi-mode real-time monitoring module. The method uses the system. Therefore, high efficiency and high quality can be considered, a multi-azimuth in-situ monitoring function is integrated, the morphology, spectrum and acoustic signals of a processing area are obtained in real time, and real-time diagnosis and closed-loop control of the technological process are achieved.

The invention discloses a focused ion beam-based crystal three-dimensional orientation precise controllable micro-nano processing method, which comprises the following steps of: carrying out EBSD scanning test on a target area of a crystal material, and constructing a current orientation matrix of the crystal material; constructing a target crystal face normal direction or a target crystal direction; a target orientation matrix is constructed based on the target crystal face normal direction or the target crystal orientation, so that the target orientation meets the single-orientation constraint or the double-orientation constraint; calculating a rotation matrix required by processing; determining the rotation angle of the FIB double-beam electron microscope processing equipment; and controlling the sample table to rotate based on the rotation angle so as to carry out directional processing on the crystal material. According to the method, the crystallographic target orientation is directly mapped into the rotation and tilting angles which can be executed by the FIB sample table, progressive constraint from two-dimensional orientation to three-dimensional orientation is supported, the machining precision is high, and operability is high.

The invention relates to the technical field of electronic optical equipment and micro-nano machining, and discloses a field emission electron source. The field emission electron source is mainly composed of a filament base, a binding post, a welding post, a welding groove, a tungsten sheet, an emission tungsten needle and the like. During welding, the tungsten sheet is in direct contact with the side wall of the welding groove, so that original point contact between the tungsten filament and the welding column is replaced by surface contact by contact between the tungsten sheet and the side wall of the welding groove, the welding area is increased, the conditions of pseudo soldering, unsoldering and the like are reduced, and the welding quality and reliability are greatly improved; and two or more tungsten sheet welding structures can disperse thermal stress generated in the heating process to a plurality of welding spots, deformation of a single welding spot due to stress concentration can be avoided, the position offset of the emission tungsten needle is prevented, and then the emission stability of the electron source can still be ensured in a long-term heating environment.