78 results about "Nano machining" patented technology

The invention provides a micro-nano processing platform user machine-hour management method and device, a storage medium and equipment. The method comprises the following steps: acquiring an equipment reservation request sent by a user; calling a user initial machine hour from the equipment machine hour management system according to the user identity information; if the initial machine time of the user does not meet the equipment machine time sum of the equipment reservation request, sending a prompt message that the machine time is insufficient to the user; real-time equipment operation parameters and user real-time operation records of a user in the equipment operation process are obtained, and a user machine time adjustment strategy is obtained according to the real-time equipment operation parameters, the user real-time operation records and the equipment reservation request; and adjusting the initial machine time of the user according to the machine time adjustment strategy to obtain a final user machine time, and sending the final user machine time to the user. Through the user machine-hour management method, transparent machine-hour management of the micro-nano machining platform is realized, and meanwhile, the opinions of standard operation of the user and the use efficiency of the micro-nano machining platform equipment are improved by utilizing the equipment machine-hour adjustment strategy.

The invention relates to the technical field of biomedical engineering and microfluidics, in particular to a fluid dynamics topological optimization design method of a circulating tumor cell sorting structure, which comprises the following steps of: establishing a three-dimensional flow field model containing a key separation area in a preset design domain, dispersing by adopting a tetrahedral mesh and setting boundary conditions; the method comprises the following steps: establishing a multi-objective optimization function based on a maximized transverse focusing distance, a minimum shear force peak value and a total pressure drop, dispersing a design domain into units and endowing the units with density variables, and realizing global automatic topological optimization by adopting penalty material interpolation and minimum flow velocity threshold constraint. An optimization result is subjected to structural reconstruction processing to generate a CAD model adaptive to micro-nano machining, closed-loop feedback is formed through secondary verification and experimental verification of computational fluid mechanics, it is ensured that the design meets the requirements for sorting efficiency and cell activity, limitation of a traditional flow channel form is broken through, and the design freedom degree, manufacturability and application value are improved.

The invention relates to the technical field of high-power femtosecond laser manufacturing, and discloses a high-power industrial femtosecond laser water cooling structure and a manufacturing method thereof. Comprising the steps that any one of a variable cross-section spiral flow channel, a bionic fin flow channel or a micro-channel array is directly machined in a machine shell water-cooling plate through the five-axis linkage precision machining technology or the micro-nano machining technology, or the printer shell water-cooling plate is integrated through the metal additive manufacturing technology; a reflector base, a heat dissipation chute and a cooling water channel are integrated in the machining process of the water cooling plate of the machine shell; carrying out material and surface treatment process operation; assembling process operation is carried out, a reflecting mirror base is matched with a mortise and tenon joint structure and a machine shell water-cooling plate through high-precision positioning pins, the reflecting mirror base and the machine shell water-cooling plate are rigidly connected in a vacuum brazing or laser welding mode, and a light guide side plate and a runner cover plate are designed into standard modules; the light guide side plate and the runner cover plate are quickly assembled through magnetic attraction positioning and spring buckles.

The invention belongs to the technical field of micro-nano machining, and discloses a sapphire laser implicit cutting method and system based on femtosecond laser induced micro holes. The sapphire wafer is fixed on the object carrying moving unit, the femtosecond laser is used for emitting femtosecond laser, the femtosecond laser sequentially passes through the polarization rotating mirror, the first reflecting mirror and the objective lens and then is focused in the sapphire wafer, a micro-hole array is induced to grow in the sapphire wafer, the micro-hole array serves as a modification layer, and the modification layer is used for modifying the sapphire wafer. Carrying out femtosecond laser scanning by combining with a loading moving unit, and processing to obtain a plurality of modified layers; and applying an external force to separate the sapphire wafer after laser modification. According to the invention, the implicit cutting efficiency can be improved, and the fracture surface with lower roughness can be obtained.

The invention discloses a method for preparing a two-dimensional material with a wrinkle structure under the assistance of liquid metal and application, and belongs to the field of micro-nano machining of two-dimensional materials. The method comprises the following steps: S1, covering the upper surface of a two-dimensional material with liquid metal gallium, and solidifying the liquid metal gallium under a cooling condition to obtain a metal gallium ingot loaded with a two-dimensional material nanosheet; s2, heating the metal gallium ingot loaded with the molybdenum disulfide nanosheet until gallium is molten, cooling and solidifying, and obtaining a two-dimensional material with a wrinkle structure after solidification; the method disclosed by the invention can be used for efficiently preparing the large-area and high-density wrinkle type two-dimensional material, is suitable for manufacturing devices such as high-performance sensors and has a wide application prospect.

The application relates to the field of laser micro-nano processing, in particular to a laser micro-nano processing device based on an acousto-optic deflector and a rotating mirror and a use method thereof, which comprises a pulse laser, a mirror group, an acousto-optic deflection module, a signal control unit, a beam splitting module, a rotating mirror and a flat-field focusing lens arranged in sequence; the acousto-optic deflection module comprises a first acousto-optic deflector and a second acousto-optic deflector, the first acousto-optic deflector and the second acousto-optic deflector are orthogonally arranged, the first acousto-optic deflector is arranged in parallel with the rotating shaft of the rotating mirror, the second acousto-optic deflector is arranged in perpendicular to the rotating shaft of the rotating mirror, through the arrangement of the two orthogonally arranged acousto-optic deflectors, the laser beam can be flexibly controlled to be deflected to any position in a rectangular scanning area, and in combination with the polygon rotating mirror, the polygon rotating mirror can be rotated only once along a processing track, the acousto-optic deflector can compensate and fill a processing pattern, and the technical effect that any shape can be realized is achieved.

The invention relates to a beam gate and centering unit integrated focused ion beam micro-nano machining system and an ion beam control method. The focused ion beam micro-nano machining system integrating the beam brake and the centering units comprises a first centering unit (3), a second centering unit (4), a Faraday cup (5) and a control unit, and the control unit is electrically connected with the first centering unit (3) and the second centering unit (4). The control unit is used for controlling the first centering unit (3) and the second centering unit (4) to form a deflection electric field. According to the focused ion beam micro-nano machining system integrating the beam gate and the centering units, the centering unit located on the lower portion is used as the beam gate by means of the superposing performance of electric signals, and integration of the beam gate and the centering units is achieved; rapid closing of the ion beam under high-voltage driving and high-precision centering and axis closing of the ion beam under low-voltage driving can be realized in the same unit, and the complexity of an ion optical system and circuit control is reduced.

The application relates to the technical field of micro-nano machining, and discloses a kind of optical waveguide manufacturing template and its processing method, working template and diffractive optical waveguide manufacturing method.The optical waveguide manufacturing template includes template base and etching layer arranged on the surface of the template base, at least two groups of optical waveguide microstructures are arranged on the etching layer, and the depth of each group of optical waveguide microstructures is different.The thickness of the etching layer is configured to be able to meet the maximum design depth of each group of optical waveguide microstructures.The bottoms of different groups of optical waveguide microstructures are flush, and the tops are not flush.After implementing the technical scheme of the application, the technical problems of the prior art, such as complicated processing technology of multi-depth optical waveguide microstructure template, high overlay precision requirement, high manufacturing cost, low yield, low diffraction efficiency of depth microstructure due to imprinting residual glue during processing and poor display effect, are solved.

The invention relates to a time-of-flight secondary ion mass spectrometry focusing offset measurement and calibration method and application. Preparing a verification workpiece based on a micro-nano machining technology; the method comprises the following steps: placing a verification workpiece in a time-of-flight secondary ion mass spectrometry (ToF-SIMS) system, and acquiring an optical image and a secondary ion image SI of a charge-coupled device (CCD) of each dot-matrix array; the CCD optical image of each dot-matrix array is used as a reference image, image superposition comparison is carried out on the reference image and the corresponding SI image, a plurality of feature points are selected, the two-dimensional position deviation of each feature point in the SI image relative to the corresponding feature point in the CCD optical image is measured, the average value of the two-dimensional position deviation of all the feature points in each dot-matrix array is calculated, and the two-dimensional position deviation of all the feature points in each dot-matrix array is calculated. The focusing offset of the dot matrix array corresponding to each feature size is obtained; focusing offset data measured in the dot-matrix arrays are summarized, and a function relation between the feature size and the focusing offset is constructed and used for offset calibration or parameter adjustment of the time-of-flight secondary ion mass spectrometry system.

The invention provides a multi-dimensional vibration platform with oppositely-arranged double-sandwich piezoelectric actuators and an excitation method of the multi-dimensional vibration platform, and belongs to the technical field of high-frequency vibration engineering and micro-nano machining.The vibration platform comprises a center platform, the two oppositely-arranged piezoelectric actuators, two end covers and two bolts, wherein the center platform is integrated with the tail end platform, the two flexible hinges and the two amplitude-change poles, and the center platform is slender and is in mirror symmetry about the longitudinal symmetry plane of the tail end platform. The piezoelectric actuator comprises a longitudinal vibration ceramic group, a bending vibration ceramic group around the Y axis and a bending vibration ceramic group around the Z axis, translation along the X / Y / Z axis and rotation around the Y / Z axis can be realized through in-phase or anti-phase excitation different combinations under the condition of not increasing extra driving channels, and five-degree-of-freedom high-frequency micro-vibration output can be achieved at most. The structure has high symmetry, low parasitic vibration, compact size and high integration, and is suitable for precise engineering scenes such as micro-nano processing, laser-assisted manufacturing, cell manipulation and active vibration suppression.

The invention provides a long-life restoration for oral micro-ecological regulation and an intelligent preparation method and device thereof. The preparation method comprises the following steps: collecting oral micro-ecological medical data of a patient, combining high-precision three-dimensional morphology feature extraction of the restoration, performing multi-modal data deep fusion and feature mining, and utilizing a multi-physics coupling AI design engine to construct a bionic micro-nano texture topological configuration with a specific function; a graded micro-nano composite structure is constructed on the surface of the restoration in situ by adopting an ultrafast laser micro-nano machining system, and the surface wettability is controllably converted from hydrophilic to super-hydrophobic through cooperative regulation and control of the surface wettability, hydrophilicity and hydrophobicity. The prepared prosthesis integrates the functions of passively inhibiting bacteria from being adsorbed on the surface of the prosthesis, preventing gingival atrophy, guiding periodontal tissue regeneration and the like, and the long-life dental prosthesis with the bionic micro-nano texture generated by the AI is obtained. The bionic micro-nano texture manufactured by the invention has excellent mechanical properties and the functions of passive bacteriostasis, damage resistance, gum fixation and the like.

The invention discloses a micro-nano device photoetching process based on surface energy repair and a micro-nano device, and relates to the technical field of photoetching. The process provided by the invention comprises the following steps: carrying out plasma cleaning on a substrate, immersing the substrate subjected to plasma cleaning into an organic cleaning solvent, and removing an unstable metamorphic layer and pollutants on the surface of the substrate by adopting at least one of soaking, stirring and ultrasonic treatment, then, the cleaned substrate is adopted to carry out subsequent photoetching and micro-nano machining processes; the step of organic solvent cleaning is added after substrate plasma cleaning, an unstable metamorphic layer is disintegrated and other impurities are removed through permeation and slight dissolution effects of an organic solvent on the surface of the substrate, so that the surface of the substrate is recovered to a smooth and stable state; therefore, the defects of edge collapse, side wall roughness and the like of the photoresist pattern in the photoetching process are remarkably reduced, and the photoetching morphology precision and the production yield of the micro-nano device are effectively improved.

The application discloses an information management system and method of a micro-nano machining experiment platform, and is used for solving the problems of great difficulty in personnel management and poor information display effect in the prior art. The information management system comprises an identification and tracking module, an alarm module, an intelligent pushing module and a rendering module. The identity information data of the micro-nano machining laboratory personnel in a monitoring area is acquired through the identification and tracking module. The first type of identity information is extracted from the identity information data of the micro-nano machining laboratory personnel through the intelligent pushing module, and the first type of identity information is displayed at a preset position of the real scene image of the micro-nano machining laboratory personnel through the rendering module. When the alarm information of the violation is received from the alarm module, the intelligent pushing module can determine the second type of identity information according to the preset display rule, and the second type of identity information is displayed at the preset position of the real scene image of the micro-nano machining laboratory personnel through the rendering module.

The invention provides micro-nano machining equipment based on a longitudinal light field, and belongs to the technical field of micro-nano machining, and the micro-nano machining equipment comprises a light source module which is used for providing an input light beam; the light beam shaping module is used for receiving the light beam output by the light source module and shaping the input light beam into an annular light beam; the polarization regulation and control module is used for receiving the annular light beam output by the light beam shaping module and adjusting the polarization state of the annular light beam into radial polarization; and the focusing module is used for receiving the radial polarization annular light beam output by the polarization regulation and control module and focusing the radial polarization annular light beam on a focal plane to generate a high-purity longitudinal light field. According to the device, efficient conversion from common Gaussian light to a high-purity longitudinal light field is achieved, the device can generate sub-wavelength light spots with energy highly concentrated in the axial direction, the high-purity longitudinal light field can be stably generated, transverse field interference can be restrained, and therefore the micro-nano machining resolution is improved, and breakthrough of the traditional optical diffraction limit is facilitated.

The invention relates to a special-shaped mold modeling method and a micro-nano machining method for a coronal bionic adhesion array, and the method comprises the steps: carrying out the parametric modeling of a special-shaped micro-nano structure through three-dimensional digital scanning and curvature analysis, and achieving the high-precision molding of the spatial distribution special-shaped micro-nano structure of a mold through a focused ion beam or ultrafast laser or other micro-nano machining technologies; in combination with plasma-assisted multi-step deposition, in-situ growth of graded nano textures such as nano spikes and nanotube arrays in different space areas of the mold is realized, and precise regulation and control of nano structure space distribution and surface energy state are realized; according to the technology, the surface anti-pollution and coining consistency of the mold is effectively improved.

The invention belongs to the technical field of micro-nano machining, and particularly relates to a method for preparing a high-resolution EUV optical element through electron beam lithography. The method comprises the following steps: etching an optical element by using an electron beam lithography system, and introducing a region proximity effect correction strategy; the method comprises the following specific steps: preparing a silicon nitride film as a substrate, and spin-coating HSQ photoresist on the silicon nitride film; carrying out geometric region division on the to-be-exposed optical component graphic layout; at least dividing a central region, an edge region and a corner region; utilizing Monte Carlo simulation software to establish a function relationship between the graphic position and the required exposure dose so as to determine an independent exposure reference dose of each geometric region; an independent and compensated exposure reference dose is set for each geometric region based on dose deviation data obtained by simulation. According to the method, the pattern uniformity can be remarkably improved, and reliable preparation of a large-area and large-aspect-ratio nano structure is realized.

The present invention belongs to the field of atomic precision machining and discloses a method for preparing an atomically sharp diamond edge, comprising the following steps: Step 1: determining the geometry of the atomically sharp diamond edge; Step 2: using a femtosecond laser to trim the diamond surface to a specific crystal orientation; Step 3: designing a clamping device for the atomically sharp diamond edge; Step 4: using a focused ion beam to prepare nanometer-sized diamond micropillars and transfer them to the edge clamping device; Step 5: using argon plasma polishing technology to achieve atomic-level flatness on the surface of the diamond nanopillars; Step 6: using X-Nano multi-degree-of-freedom nanomanipulation technology to achieve atomic-level cleavage of the diamond nanopillars; Step 7: using a spherical aberration electron microscope to characterize and verify the atomically sharp diamond edge. The present invention achieves the preparation of an atomically sharp diamond edge with an edge blunt radius through micro-nano machining and atomic-scale controllable cleavage methods.

The invention provides a simulation method and system for sputtering a monocrystalline silicon target material based on a focused ion beam, and relates to the technical field of semiconductor material micro-nano machining, the method comprises the following steps: defining sputtering parameters including incident ion parameters, target material parameters and target material depth, and selecting an SRIM / TRIM calculation method; on the basis of the sputtering parameters, calculating an ion beam sputtering target material to generate distribution data; based on the distribution data, through integrated analysis of an integrated parameter optimization module and a damage evaluation model, the processing efficiency and the damage depth when the focused ion beam is used for processing the monocrystalline silicon target material are dynamically balanced; wherein the damage evaluation model selects sputtering parameters with the minimum defect influence and the etching efficiency higher than a preset threshold value by comparing defect density distribution, energy loss distribution and phonon energy loss distribution. Through a simulation framework based on the Monte Carlo method, collaborative optimization of parameters such as ion energy and target material thickness is realized, and the dynamic relationship between the sputtering yield and the damage depth is quantitatively analyzed.

The invention relates to a nano-sieve and a preparation method and application thereof, the nano-sieve is composed of multiple layers of micro-nano processing stacked structures, the nano-sieve internally comprises a high-density nano-channel array, the cross section of each channel is rectangular, and the width of each channel is determined according to the size of a target separation particle. The preparation method of the nano sieve comprises the following steps: preparing an initial groove; filling and flattening the photoresist; performing film deposition and secondary configuration; constructing a stacking structure; cutting and forming; and removing the photoresist. The method has the advantages of being small in screening scale, high in mechanical strength, high in flux, high in anti-blocking capacity and high in process compatibility.

The application discloses a Solis photon pump array based on two-dimensional non-Abelian and fun principle and a pumping method thereof, and belongs to the technical field of laser micro-nano machining. The Solis photon pump array is formed by stacking multiple waveguide unit cells in a dense arrangement in the vertical propagation direction. Each of the multiple waveguide unit cells is a "vegetable basket" structure. The waveguide unit cell comprises a first main waveguide, a second main waveguide, a first auxiliary waveguide, a second auxiliary waveguide, a first straight waveguide and a second straight waveguide. The first main waveguide is located at the bottom surface of the "vegetable basket" structure, the second main waveguide and the first auxiliary waveguide are respectively located at two side surfaces of the "vegetable basket" structure, the second auxiliary waveguide is located at the handle surface of the "vegetable basket" structure which is symmetrical to the bottom surface, and the first straight waveguide and the second straight waveguide are respectively located at two mutually parallel edge lines of the bottom surface of the "vegetable basket" structure, and the direction is the propagation direction. The Solis photon pump is integrated in the horizontal and vertical directions by periodically adjusting the horizontal and vertical coupling coefficients between the waveguides, and then the photon control can be performed in the horizontal and vertical directions. The application further improves the calculation dimension of the Solis photon pump device, and realizes one-step construction and preparation of a high-order unitary matrix operation module based on the Solis pump.

The utility model discloses double-beam infrared picosecond laser non-standard micro-nano machining equipment which comprises an infrared picosecond laser micro-nano equipment body, a high-precision linear module is arranged on the top face of the infrared picosecond laser micro-nano equipment body, and operation panels are arranged on the two sides of a high-precision linear module platform respectively. The clamping assembly is arranged on the top faces of the operation plates and used for clamping a machined workpiece, the clamping assembly comprises two swing columns, and the two swing columns are arranged on the top faces of the two operation plates correspondingly; according to the infrared picosecond laser micro-nano equipment, the arranged infrared picosecond laser micro-nano equipment body, the high-precision linear module, the operation plate, the swing column, the clamping head, the clamping groove, the operation column, the supporting frame and the rotating column are used in cooperation, a trapezoidal table can abut against the lower portion of the swing column, and therefore the clamping head can press and clamp a workpiece, machining workpieces of various sizes and various shapes can be clamped, and the machining efficiency is improved. When a circular workpiece is clamped, the circular workpiece enters the clamping groove, and the circular workpiece can be clamped.

The invention relates to a quartz etching method based on a C4F6 (hexafluoro-2-butyne) mixed gas. According to the method, the developed quartz glass substrate is etched through a special etching gas ratio and etching parameters, and the photoresist on the quartz glass substrate is removed, so that the quartz glass device is obtained. The method is applied to micro-nano machining and integrated circuit processes, and replacement of original etching technologies based on CHF3 mixed gas and the like is achieved. According to the method, the high etching selection ratio is achieved while it is guaranteed that the etching speed is high and the etching dip angle perpendicularity is good, and etching of materials such as quartz and silicon oxide can be effectively achieved.

The invention relates to the technical field of micro-nano machining and manufacturing, and particularly provides photoetching direct-writing micro-nano machining equipment and a machining method.The photoetching direct-writing micro-nano machining equipment comprises an electron beam exposure assembly, a laser direct-writing assembly, a connecting cavity and a conveying guide rail, and the electron beam exposure assembly is used for conducting electron beam exposure on a first pattern on a sample; the laser direct-writing assembly is used for carrying out laser direct-writing exposure on a second pattern on a sample, the connecting cavity is communicated with the electron beam exposure assembly and the laser direct-writing assembly, the conveying guide rail sequentially penetrates into the laser direct-writing assembly, the connecting cavity and the electron beam exposure assembly, the conveying guide rail is used for conveying the sample, and the laser direct-writing assembly is used for carrying out laser direct-writing exposure on the sample. And the sample can be exposed by the electron beam exposure assembly and the laser direct writing assembly in sequence. The sample is subjected to different levels of exposure treatment in the equipment in sequence, so that the problems that the precision cannot be guaranteed and the sample is polluted due to the fact that the sample is transferred among different equipment are solved.

The invention discloses a femtosecond laser pulse string driven atom precipitation method, which relates to the field of laser extreme manufacturing, is realized based on a femtosecond laser micro-nano machining system, and comprises the following steps: fixing an alloy material on a three-dimensional displacement table; the angle of the two-phase color mirror is adjusted, so that the femtosecond laser pulse is vertically incident to the surface of the alloy material; a focus lens is adjusted and machined, and it is guaranteed that laser coaxially and vertically enters; an imaging camera is adjusted, and a laser processing area is monitored in real time through a real-time imaging module; adjusting the beam shaping module to generate a pulse string with a fixed pulse interval; and laser energy is adjusted, array processing of different pulse overlap rates is carried out in a designated area on the surface of the material through cooperative control of a galvanometer system, a three-dimensional displacement table and a mechanical light shutter, and femtosecond laser pulse string driven atom precipitation is completed. According to the method, the laser heating and cooling rate can be flexibly adjusted, low-cost and high-efficiency atomic-scale precipitation and even atomic configuration regulation of different elements of the alloy are achieved, and improvement of the performance of the alloy material is facilitated.

The invention provides a laser micro-nano machining control method and system for coping with complex structure design, and relates to the technical field of laser micro-nano machining, and the method comprises the steps: firstly obtaining a discrete point cloud cluster of a target complex micro-nano structure and a set texture feature constant, expanding discrete point cloud, carrying out topological distance filtering analysis, and generating a vein persistence graph; analyzing the venation nodes based on a preset processing strategy to obtain a venation affiliation result, and calculating the complex saturation to judge the processing difficulty; if the point is the source structure point, planning a smooth benchmarking guide map according to the surface element size and the normal vector of the one-class discrete point cloud, and controlling processing; and if the structural points are derivative structural points, evaluating second-class discrete point clouds to obtain difficulty coefficient freeze-frame, disassembling and searching a global common track, and controlling processing. According to the method, smooth processing of the source complex pattern and rapid communication processing of the derivative complex pattern can be correspondingly executed according to different complex saturation conditions, so that the stability of the complex micro-nano structure is improved.

The invention discloses a machining method for controlling the height of a nano periodic structure through a tool movement track, and belongs to the technical field of micro-nano machining. According to the specific scheme, the machining method for controlling the height of the nanometer periodic structure through the tool motion trail comprises the following steps that firstly, according to a motion equation, under the condition that the machining period is fixed, different nanometer down-milling machining motion trails of a tool are obtained by regulating and controlling parameters RX, Rz and phi; step 2, calculating the forming amount of the processing material in each period by adopting a numerical calculation method, adjusting the sizes and the relationship of the three parameters, and controlling the size of the forming amount of the material; selecting a proper motion trail of the cutter according to the forming amount of the nano grating material; 3, under different parameter combinations, tool paths are different, according to the tool paths, driving signals are set, the nanometer grating structure is machined, and morphology measurement is carried out; and 4, carrying out quality evaluation on the morphology measurement result, determining the optimal geometric characteristics of the processing track, and establishing a functional equation for predicting the height of the nano grating structure. By means of the machining method, efficient and high-quality machining of the surface nanometer periodic structures with different heights can be achieved, and the application performance of the surface nanometer periodic structures is improved.

The invention discloses a multi-dimensional vibration platform with double sandwich type piezoelectric actuators arranged in the same direction and an excitation method of the multi-dimensional vibration platform, and relates to the field of high-frequency vibration engineering and micro-nano machining. Aiming at the problem that a traditional piezoelectric vibration platform is difficult to realize higher-dimension multi-degree-of-freedom operation capability, the piezoelectric vibration platform comprises an output platform, two piezoelectric actuators, two end covers and two bolts. The piezoelectric actuator is provided with a longitudinal vibration ceramic set and two bending vibration ceramic sets arranged in the orthogonal direction, and through excitation of voltage signals with the same phase or the phase difference of 180 degrees, rotation around the X axis, the Y axis and the Z axis and translation along the X axis and the Y axis are achieved. Due to structural symmetry and driver arrangement constraint, Z-direction translation is strongly coupled with an existing mode, so that high-practicability five-degree-of-freedom output is focused. The same-direction arrangement type design is adopted, the characteristic of low motion coupling is achieved, and displacement deformation of the piezoelectric actuator can be converted into different actions needed by multi-dimensional vibration of the tail end platform. The method is suitable for the fields of laser processing, vibration-assisted processing, micro-nano operation, active vibration suppression and the like.

The application discloses a kind of micro porous carbon spring based on femtosecond laser micro-nano machining and preparation method thereof, it is related to femtosecond laser micro-nano machining technical field.The application provides a kind of preparation method of micro porous carbon spring, take polyimide film and fix on slide, the slide is fixed on object table;Laser parameter is adjusted, laser beam is focused on the surface of the polyimide film and is scanned, and the micro porous carbon spring is obtained;The laser parameter is 500 mW-4000 mW of laser power, and scanning speed is 1-10 mm / s.The application also provides corresponding micro-nano machining system and micro-nano machining parameter database.Micro porous carbon spring prepared by the method has good conductivity, mechanical strength and environmental stability.

The invention discloses an asymmetric scattering myopia control lens and a manufacturing method thereof, which are applied to the optical field, firstly, the problem that an optical defocus signal is not matched with an actual visual task mode in the prior art is solved by accurately associating optical scattering intensity with a human visual behavior thermodynamic diagram; a stronger myopia out-of-focus signal is provided in a short-distance reading area used by a wearer at high frequency, the myopia control effect is effectively enhanced, high definition is maintained in a long-distance watching area, unnecessary visual interference and comfort reduction are avoided, secondly, waste of optical resources in an existing rotational symmetry design is avoided due to the adoption of the asymmetric design, and the cost is reduced. According to the lens structure, optical energy is distributed according to needs, precise free-form surface machining and micro-nano machining technologies are combined, high-precision manufacturing of an asymmetric microstructure is ensured, smooth transition of scattering intensity between different optical areas is achieved, and finally the innovative lens structure with myopia control efficiency and visual comfort is provided.

The application discloses a high-speed laser micro-nano processing device and a control method, and mainly relates to the technical field of laser micro-nano processing, and aims to solve the problems of complicated process and low efficiency of the existing laser micro-nano processing. The device comprises a laser, the laser is connected with an acousto-optic modulator, the acousto-optic modulator is connected with a first beam splitter, the first beam splitter is connected with a rotating mirror system, the rotating mirror system is connected with a first focusing lens, the first focusing lens is connected with a second focusing lens, the second focusing lens is connected with a galvanometer, the galvanometer is connected with a third focusing lens, the third focusing lens is connected with a fourth focusing lens, the fourth focusing lens is connected with a second beam splitter, the second beam splitter is connected with an objective lens and a microscopic imaging module, the objective lens is connected with a three-dimensional moving stage, and the microscopic imaging module and the three-dimensional moving stage are connected with a control card. The device and the control method realize the rapid processing of laser micro-nano, and improve the processing efficiency.